I know two solutions for your spec.
1. You can find "Photosensitive glass wafers" in HOYA. They also offer
conductive feed-throughs if needed.
2. Electrochemical etch of Pyrex glass. (You can search the author
"Esashi".)
Method 2 above is doable here.
Additionally, I also have tried femto-second laser, but it is not a cheap
way. (You can search my paper.)
I think there are still a lot of methods.
Good luck.
Chienliu
-------------------------------------------------
Chienliu Chang, Ph.D.
Room 104
Ginzton Laboratory
Center for Nanoscale Science & Engineering
Stanford University
348 Via Pueblo, Stanford, CA 94305-4088
Phone: 650-725-2265
Email: clchang6@stanford.edu
clchang6@ntu.edu.tw
-------------------------------------------------
----- Original Message -----
From: "Ben Jian" <ben.jian@arrayedfiberoptics.com>
To: <labmembers@snf.stanford.edu>
Sent: Thursday, April 05, 2012 9:24 PM
Subject: making tiny through holes in glass substrate
> Hi Labmembers,
>
> I am trying to find a cheap way to make some through holes in glass or
> fused silica. This is for a prototype device. The holes are 135um +/-
> 10um and can have loose tolerance. The glass substrate thickness should
> be at least 100um. The hole profile is not very important. We want to
> make a small number of holes (say 4x4) with a pitch of 500um. We have
> looked into laser drilling but the price is too high for us ($3000). It
> seems that very small diameter diamond drills of this diameter exist but I
> don't know who can provide this service, because air bearing drilling
> machines are required. Does anyone have a low cost solution? Thank you.
>
> Ben
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