Friday, August 31, 2012
Re: Shutdown p5000etch SNF 2012-08-31 16:25:34: wafer dropped in load lock
adjusted on extension pick and drop to cassette elevator.
Comment p5000etch SNF 2012-08-31 17:13:06: Update
elevator..
Comment p5000etch SNF 2012-08-31 16:34:51: managed to retrieve wafer.
help needed, Au coated Si wafer
I need a Au coated Si wafer, for optical reflection purpose. A 4 inch
should be fine. Does anyone has a spare one?
Thanks!
Yin Liu
Spin-on glass/ sputter dielectric on a substrate
Two questions:
1. I am interested in spin coating my sample (Ag/ Si) with 150nm
spin-on glass. Does anyone have spin-on glass that I can borrow for
now? If you can recommend some vendors then I can also place an order
for you today.
2. Does anyone know of any company/vendor that can sputter dielectric
(any oxide would work) of a given thickness on a substrate for me?
Any help would be highly appreciated!
thanks,
--
~Vrinda
Vrinda Thareja
Ph.D. Candidate
Brongersma Group
Department of Materials Science and Engineering
Stanford University
New Prudential Gown Services starting Sept. 4th.
Thursday, August 30, 2012
Does anyone have SOG stored inside SNF?
Does anyone have SOG stored inside SNF? Could you share with me?
I want to spin coat 100-1000nm SiO2 on my nanowire samples to passivate the substrate. The samples are smaller than 1*1cm, so a small amount of SOG is needed.
If anyone can share with me, that will be very helpfull!
Thanks!
Xiaoqing
Does anyone have 950PMMA A4?
--Katie
Updating Java on your computers ....
As you may know, there has been a lot of press in the last week about a
"zero-day" exploit in Java that affects all computer platforms and all
browsers that run on those platforms. It was believed that this
affected only Java 7 and not Java 6. A number of you likely have Java 7
on your machines. Earlier today, Oracle has released an updated version
of both Java 7 (specifically Java 7 update 7) and Java 6 (Java 6 update
36) to address these issues.
If you run Remote Coral on a computer, you have either Java 6 or Java 7
on your machine and should update those versions as soon as possible to
reduce the likelihood that you machines will become infected or injected
with various forms of malware.
For those of you running Windows XP or Windows 7, the easiest way to
upgrade your machine is to open the Java Control Panel . This is
normally an icon on the main page that contains other control panels.
That will usually be found on either XP or Windows 7 machines in:
Windows XP Click Start > Settings > Control Panel
Windows 7, Windows Vista Click Start > Control Panel > Programs
Double click that Java icon which should open the Java Control Panel.
There you should see the Update tab.
Select that and click the "Update Now" button. That should download and
install the latest version of the Java Runtime Environment (JRE) onto
your machine.
After that is done, you may want to open the Java Control Panel again,
but this time select the Java tab. On that page you will see a "View
..." button. Clicking that will show you the version (or versions) of
Java that are currently installed on your machine. After the upgrade
you should under Platform either 1.7 (Java 7) or 1.6 (Java 6) and under
product it should list either 1.7.0_07 for the latest version of Java 7
or 1.6.0_35 for the latest version of Java 6.
Note: if you run Stanford administrative application, you may also see
Java 1.6.0_21 because a number of Stanford-specific applications will
ONLY run on that version of Java.
In any event, I encourage you to make these upgrades as soon as possible
to minimize the chances that undesirable code may get injected onto your
machine.
Note: while I am less familiar with Mac OS-X, if you are running Java 7
on a Mac, there is also an upgrade for Java 7 for the Mac available from
http://java.oracle.com. Java 6 for Mac OS-X has been controlled and
distributed by Applie and I don't know if they have an updated version.
Hopefully, this will reduce the risk for anyone running Java on their
machines.
Thanks,
John
Re: Problem p5000etch SNF 2012-08-30 08:44:56: Ch C turbo is off
Fwd: Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition)
Due to the overwhelming response, we have reached the allowable occupancy level in the conference room. I encourage you to still sign up, but please be aware it will be on a waiting list status.
I also encourage those who have registered and know they will not be attending the full two days to let me know. I'm sure you don't want to be responsible for preventing anyone from attending.
Regards,
Ed
-------- Original Message --------
| Subject: | Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition) |
|---|---|
| Date: | Thu, 09 Aug 2012 16:28:22 -0700 |
| From: | Ed Myers <edmyers@stanford.edu> |
| To: | labmembers@snf.stanford.edu |
| CC: | Lishan, David (Plasma-Therm LLC) <david.lishan@plasmatherm.com> |
All, SNF and Plasma-Therm would like to invite you and your team members to attend the Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition) to be held at the Stanford University on September 10 and 11, 2012. The Workshop is intended to provide understanding and insight to those working with plasma etching and deposition processes and equipment. The goal is to help researchers make faster progress on projects requiring plasma processing. The course has been very well received at Harvard, UC Berkeley, UCLA, Notre Dame, USF, IMRE, Israel, and Lund University. Graduate students, post docs, professors, and staff have all found the material useful. The format encourages questions and we hope attendees take advantage of the opportunity for networking and discussing their projects. The workshop is meant to encourage cooperation within the academic and industrial research communities. Please be assured that the course is not an advertisement about Plasma-Therm products. Aside from a very brief 15 min introduction to Plasma-Therm, the rest of the day is dedicated to education on fundamentals and advanced etching and plasma-enhanced chemical vapor deposition technology. Presentation materials are equally useful to those that do and do not have our equipment. Details regarding the Workshop objectives, agenda, location, and speaker can be found on the attached flyer. Please note that the workshop is free and registration is requested online by August 31, 2012 at the website: http://www.surveymonkey.com/s/FPQLZPQ Regards, SNF Staff and Plasma-Therm
Problem p5000etch SNF 2012-08-30 08:44:56: Ch C turbo is off
Wednesday, August 29, 2012
Fwd: Invited Talk by Prof. Paul Alivisatos (8/31), updated title and abstract
---------- Forwarded message ----------
From: Chris Earhart <cearhart@stanford.edu>
Date: Wed, Aug 29, 2012 at 3:07 PM
Subject: Invited Talk by Prof. Paul Alivisatos (8/31), updated title and
abstract
To: Chris Earhart <cearhart@stanford.edu>
[image: Inline image 1]
MSE Undergraduate Research Program Invited Talk
Friday, August 31, 2012
William R. Hewlett Teaching Center, 201
Lecture at 3:30PM
Studies of Colloidal Nanocrystals in the Electron Microscope
A. Paul Alivisatos, Ph.D.
Director of Lawrence Berkeley National Laboratory
Larry and Diane Bock Professor
Departments of Chemistry and Materials Science
University of California, Berkeley
This talk will present our recent work on the study of colloidal
nanocrystals in a fluid using the TEM. We have studied the motion of
nanocrystals, the trajectories for the growth of individual particles, and
the formation of nanocrystal arrays as the liquid evaporates. In each
case, the ability to observe the behavior of single particles offers new
physical insights.
MSE Undergraduate Summer Research Poster Symposium
Science and Technology at the Nanoscale
Friday, August 31, 2012
Patio outside of Hewlett 201
4:30PM (After the invited talk by Prof. Paul Alivisatos)
Sponsored by the Office of the Vice Provost for Undergraduate Education
(VPUE)
** Pizza and drinks will be served**
*Map of Hewlett Teaching Center:***
*[image: Inline image 2]
*
*
*
*List of Undergraduate Research Posters*
*REU Student*
*Advisor*
*Poster Title*
Amin Aalipour
N. Melosh
Exploring Cell-Nanostraw Interactions to Promote Highly Efficient
Intracellular Delivery
Erin Antono
R. Salleo
Suppressed Crystallinity Hinders Doping Efficiency in p-doped Solution
Processed TIPS-Pentacene
Tracey Atkinson
J. Dionne
Enhancing Magnetic Dipole Transitions with Nanocrescents
Jena Barnes
K. Goodson
Thermal Characterization of Zinc Oxide Nanowire Films
Mai Bui
D. Nelson
Growth of "Fish-Eye" Fatigue Cracks in Steel Alloys
Sam Carreon
S. Wang
Physical Fabrication of Nanoparticles
Maverick Chea
J. Dionne
Pressure Dependence of Upconverting Nanoparticles
Brian Fei
R. Sinclair
TEM Analysis of QD Thin Films Deposited by ALD
Brian Flamm
R. Sinclair
TEM Holography and Image Simulations
Darren Hau
M. McGehee
Effect of Antioxidant Additive on Polymer Photobleaching and Organic Solar
Cells
Atsu Kobashi
B. Clemens
Kinetic and Structural Properties of Magnesium Hydride Formation
John Lawrence
P. McIntyre
Effects of Forming Gas Anneal on the Performance of ALD-TiO2-coated Si
Photoanodes for Electrocatalytic Hydrolysis
Elena Leon
R. Dauskardt
Effects of UV Damage on the Biomechanical Propertiesof the Stratum Corneum
Marion Lepert
B. Clemens
The Photoelectrochemical Analysis of Semiconductors
Jason Middleton
N. Melosh
Self-Assembling Superstructures of 1D Molecular Wires
Janina Motter
Y. Cui
Chemical Exfoliation of Synthesized Bismuth Selenide Nanoplates
Kevin Moy
R. Salleo
Plasmonic-Enhanced Upconversion in Security Applications
Keziah Plattner
A. Lindenberg
Ultrafast Dynamics of Phase-Change Materials
Andrew Ponec
M. McGehee
Improved Efficiency of Bulk Heterojunction Solar Cells through Silicon
Naphthalocyanine Dye Additives
Victoria Robles
S. Heilshorn
Extending Tunability of Elastin-like Matrices: Nanostructure and Mechanics
Wilson Torres
S. Heilshorn
Patterning Thin Film Elastin Like Protein Using Photolithography
Ellen Tsay
R. Dauskardt
Cohesion and Reliability of Organic Bulk Heterojunction Solar Cells
Sigberto Viesca
S. Wang
Hydrophilic treatments for PDMS microfluidic chips
Monday, August 27, 2012
Fwd: Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition)
-------- Original Message --------
| Subject: | Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition) |
|---|---|
| Date: | Thu, 09 Aug 2012 16:28:22 -0700 |
| From: | Ed Myers <edmyers@stanford.edu> |
| To: | labmembers@snf.stanford.edu |
| CC: | Lishan, David (Plasma-Therm LLC) <david.lishan@plasmatherm.com> |
All, SNF and Plasma-Therm would like to invite you and your team members to attend the Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition) to be held at the Stanford University on September 10 and 11, 2012. The Workshop is intended to provide understanding and insight to those working with plasma etching and deposition processes and equipment. The goal is to help researchers make faster progress on projects requiring plasma processing. The course has been very well received at Harvard, UC Berkeley, UCLA, Notre Dame, USF, IMRE, Israel, and Lund University. Graduate students, post docs, professors, and staff have all found the material useful. The format encourages questions and we hope attendees take advantage of the opportunity for networking and discussing their projects. The workshop is meant to encourage cooperation within the academic and industrial research communities. Please be assured that the course is not an advertisement about Plasma-Therm products. Aside from a very brief 15 min introduction to Plasma-Therm, the rest of the day is dedicated to education on fundamentals and advanced etching and plasma-enhanced chemical vapor deposition technology. Presentation materials are equally useful to those that do and do not have our equipment. Details regarding the Workshop objectives, agenda, location, and speaker can be found on the attached flyer. Please note that the workshop is free and registration is requested online by August 31, 2012 at the website: http://www.surveymonkey.com/s/FPQLZPQ Regards, SNF Staff and Plasma-Therm
Friday, August 24, 2012
Re: coverslip for bonding
Although there may be minor chemical differences, Pyrex 7740 is Corning's trade name for a glass whose primary constituent is borosilicate glass. Have you actually asked about the differences between the borosilicate glass you have been quoted and true Pyrex 7740? They may be chemically very similar, but the vendor may be careful not to use a trademarked name if Corning is not their supplier.
You may be asking for champagne, and being told that they only sell California sparkling wine.
Have a good weekend,
John
Sent from my iPhone
On Aug 24, 2012, at 6:21 PM, Max Marcel Shulaker <maxms@stanford.edu> wrote:
> Hey everyone,
> Thanks for all of the responses for the glass drilling - the response was really amazing.
> I was wondering if anyone knew a place where you can purchase glass coverslips for bonding?
> For the anodic bonding, it should be type Pyres 7740, however, every coverslip I have seen is borosilicate.
> Does anyone have suggestions for getting this type of glass/ in something roughly 25mm*25mm or 25*50mm (size can be different, but on this order)? Or, does anyone have experience bonding with borosilicate or some other glass which can be bought in these rough dimensions? (thickness ~300um)
> Thanks for your help,
> Max Shulaker
coverslip for bonding
Thanks for all of the responses for the glass drilling - the response was really amazing.
I was wondering if anyone knew a place where you can purchase glass coverslips for bonding?
For the anodic bonding, it should be type Pyres 7740, however, every coverslip I have seen is borosilicate.
Does anyone have suggestions for getting this type of glass/ in something roughly 25mm*25mm or 25*50mm (size can be different, but on this order)? Or, does anyone have experience bonding with borosilicate or some other glass which can be bought in these rough dimensions? (thickness ~300um)
Thanks for your help,
Max Shulaker
Re: Sputter gold on Al piece
If only considering the adhesion, the gold can be directly deposited on Al without adhesion layer. But there is intermetallic (Purple plague) at Al-Au contact, which has different properties. So it is better to have adhesion layer.
Best,
Yongliang
----- Original Message -----
From: "Yongliang Yang" <ylyang@stanford.edu>
To: labmembers@snf.stanford.edu
Sent: Friday, August 24, 2012 11:25:00 AM
Subject: Sputter gold on Al piece
Hi, all,
I would like to sputter gold layer on an Al piece. I am not sure if I still need adherent layer such (Ti, Cr). Does anyone have experience on it.
BTW, the sputteiring will be done in our lab not in SNF due to contamination.
Best,
Yongliang
Sputter gold on Al piece
I would like to sputter gold layer on an Al piece. I am not sure if I still need adherent layer such (Ti, Cr). Does anyone have experience on it.
BTW, the sputteiring will be done in our lab not in SNF due to contamination.
Best,
Yongliang
Re: a contact mask missing
Thanks!
- Jae
Dear All,
Please help me to locate my mask. The following label should be in front of the cover:
Customer: Stanford University
Device: SOSOI_TEC
Layer: SOSOI_TEC-VIA
Please let me know if you have seen this mask. Thank you very much!
Best,
Jae
a contact mask missing
Please help me to locate my mask. The following label should be in front of the cover:
Customer: Stanford University
Device: SOSOI_TEC
Layer: SOSOI_TEC-VIA
Please let me know if you have seen this mask. Thank you very much!
Best,
Jae
Thursday, August 23, 2012
Re: Problem p5000etch SNF 2012-08-22 18:00:36: same problem as yesterday... : Ch B clamp issue
Re: Shutdown p5000etch SNF 2012-08-23 08:42:38: chamber B
Process Clinic Today @11
Process Clinic, today (Thursday) at 11. Meet in the cube area nearby
Maureen's office. Feel free to bring your process flows, device cross
sections an mask layouts.
Your SNF Staff
Wednesday, August 22, 2012
Anyone have patterned Si like this?
Art
Problem p5000etch SNF 2012-08-22 18:00:36: same problem as yesterday... : Ch B clamp issue
EE PhD Oral Examination
Abstract:
Accurate extraction of Schottky barrier height is imperative to the development of low resistance contacts. An analytical model for current density is proposed that accurately accounts for conduction in the thermionic emission (TE), thermionic field emission (TFE), and field emission (FE) regimes. Use of this model in non-linear regression allows more information to be extracted from diode IVT curves than previously possible. The proposed model uses the Arrhenius non-linear dependence experimental diode IV curves to regress the Schottky barrier height (φB0), steepness factor (E00), and Fermi level (ξ), enabling band diagrams of the measured interfaces to be determined. This model is tested against both simulated interfaces using the tranismission matrix method (TMM) and experimental data. This complete picture of band information allows material interface behavior to be understood more completely, ultimately facilitating more efficient contact engineering.
Problem p5000etch SNF 2012-08-22 01:41:15: chamber B clamp
RE: laser glass machining - how about glass drilling?
Max,
If you want to drill holes perpendicular to the surface of glass microscope slides, you should use the SNF’s Roland MDX-15 CNC. I setup and use the system for super-clean automated pattern drilling of 635 micron diameter holes (60+ per run) in 0.7mm thick glass wafers. The hole diameter is determined by your diamond drill bit diameter and the geometry via CAD file. Let me know if this is what you need and I can assist with the details.
Best,
Matt Kerby
From: maxmshulaker@gmail.com [mailto:maxmshulaker@gmail.com] On Behalf Of Max Shulaker
Sent: Tuesday, August 21, 2012 6:13 PM
To: labmembers@snf.stanford.edu
Subject: laser glass machining
Hello all,
I was wondering if anyone had suggestions for vendors in the area who do good (and cheap) laser (or other methods) of glass machining. On each glass slide, I'm just looking to do a few holes in the mm range, so it doesn't have to be anything super fancy.
Thanks,
Max
Tuesday, August 21, 2012
RE: laser glass machining
Hi,
I have borrowed time on CO2 lasers on campus. It’s not efficient absorption in glass, but it does work. I created a dwg file and used that for the pattern. The one I used was in a specific research group and I don’t know if it is around anymore.
One piece of advice – metalize the surface with 1 um of aluminum before ablating. The slag from the machining will deposit back and make the surface really crappy. If you put down this metal layer, it’s thin enough that it ablates off quickly. Also Al reflectivity in IR is not nearly so high as in the visible spectrum (unlike gold). Clean off the slag after the ablation mechanically and with rinsing, and then follow with a sulfuric perioxide clean. You’ll get a nice clean surface.
Tony Flannery
From: Max Shulaker [mailto:maxms@stanford.edu]
Sent: Tuesday, August 21, 2012 6:13 PM
To: labmembers@snf.stanford.edu
Subject: laser glass machining
Hello all,
I was wondering if anyone had suggestions for vendors in the area who do good (and cheap) laser (or other methods) of glass machining. On each glass slide, I'm just looking to do a few holes in the mm range, so it doesn't have to be anything super fancy.
Thanks,
Max
Fwd: using Coral after installing Mac10.8
Maurice has discovered that he was unable to run Remote Coral after upgrading to Mac OSX 10.8 (Mountain Lion) without making a change to his security settings. Here is Maurice's note including a discussion of the changes required to allow Remote Coral to run on a Mac with the latest OS.
If you have a Mac that is running OSX 10.8, you will likely be similarly affected.
Thanks to Maurice for his good sleuthing ability ....
Have a good evening,
John
-------- Original Message --------
| Subject: | using Coral after installing Mac10.8 |
|---|---|
| Date: | Tue, 21 Aug 2012 16:18:11 -0700 |
| From: | maurice stevens <maurice@stanford.edu> |
| To: | Michelle Rincon <mmrincon@stanford.edu>, "Brett E. Huff" <bhuff@stanford.edu> |
| CC: | John Bumgarner <jwb2005@stanford.edu>, John Shott <shott@stanford.edu> |
Hey guys,
Go to Preferences -> Security & Privacy and click on padlock to allow changes.
Then in "Allow appications downloaded from" select "Anywhere".
After that, the button in Java dialog will be enabled."
RE: laser glass machining
I use LP Glassblowing for exactly this kinda of thing.
Their phone number is: 408 988 7561
Good service and fast turnaround.
From: maxmshulaker@gmail.com [mailto:maxmshulaker@gmail.com] On Behalf Of Max Shulaker
Sent: Tuesday, August 21, 2012 6:13 PM
To: labmembers@snf.stanford.edu
Subject: laser glass machining
Hello all,
I was wondering if anyone had suggestions for vendors in the area who do good (and cheap) laser (or other methods) of glass machining. On each glass slide, I'm just looking to do a few holes in the mm range, so it doesn't have to be anything super fancy.
Thanks,
Max
laser glass machining
Fwd: J.A. Woollam CompleteEASE Short Course
Here is another course being offered by Woollam. This course covers their CompletEASE software (not the WVASE32 being used at the SNF). The two software programs are very different and taking a class on one software package will not help you with the other.
Regards,
SNF Staff
-------- Original Message --------
| Subject: | J.A. Woollam CompleteEASE Short Course |
|---|---|
| Date: | Tue, 21 Aug 2012 14:27:56 -0500 |
| From: | Veronica Cockerill <vcockerill@jawoollam.com> |
| To: | WoollamMailList@jawoollam.com |
Dear J.A. Woollam Customers,
We would like to invite those of you who use our CompleteEASE software to the next CompleteEASE Data Analysis Fundamentals Short Course. It will be held October 9-12, 2012 at the University of Washington in Seattle, Washington. I have attached a course description and registration form. If you would like to attend, please fill out the registration form completely and fax or email to me by October 1, 2012. Once I receive your registration form, I will send a confirmation email.
This course will focus on data analysis methods for spectroscopic ellipsometry, using CompleteEASE software, with a significant amount of "hands-on" computer time. For this reason, participants should be familiar with CompleteEASE software. All participants will need to bring their own laptop. You will be supplied a copy of the software to install on your computer before class begins.
NOTE: Many of you use our other data analysis software, WVASE. A course dedicated to CompleteEASE will not be of benefit to you if you use WVASE. They are two completely different programs. The next WVASE short course has not been scheduled yet. Once it is, I will notify you of that course. Thank you for your patience.
If you have any questions, please let me know.
Best regards,
Veronica
*******************************
Veronica Cockerill
Marketing Coordinator
J. A. Woollam Co., Inc.
645 M Street, Suite 102
Lincoln, NE 68508
vcockerill@jawoollam.com
Phone: (402)477-7501 x101
Fax: (402)477-8214
Re: Problem p5000etch SNF 2012-08-21 06:16:22: Chamber C detected HT EX fault
Re: Problem p5000etch SNF 2012-08-20 16:40:54: Ch.A, wafer enters chamber but no process
RE: Solution for Slow Etch Pit Density Studies in Ge
Robert,
Dilute Secco etch from IBM works well for threading dislocations in SiGe. It required a Silicon cap though.
Quick Turnaround Technique for Highlighting Defects in Thin Si/SiGe Bilayers
S. W. Bedella,z, D. K. Sadanaa, K. Fogela, H. Chenb and A. Domenicuccib
doi: 10.1149/1.1676116 Electrochem. Solid-State Lett. 2004 volume 7, issue 5, G105-G107
J. Phys. D: Appl. Phys. 42 (2009) 175306 (6pp) doi:10.1088/0022-3727/42/17/175306
Defect identification in strained Si/SiGe heterolayers for device applications
Thanks,
Bin
From: robertatx@gmail.com [mailto:robertatx@gmail.com] On Behalf Of Robert Chen
Sent: Tuesday, August 21, 2012 10:40 AM
To: labmembers
Subject: Solution for Slow Etch Pit Density Studies in Ge
Hi All,
I'm looking for an etchant for looking at etch pit density studies for Germanium (001) epi (etching pits corresponding to threading dislocations). There are a few recipes out there, but I believe they use some non-standard and non-stocked chemicals in SNF. Does anyone have a recipe (and the chemicals) that is verified to work for this?
Thanks,
Robert Chen
Solution for Slow Etch Pit Density Studies in Ge
Follow up of this weekend's cooling water incident
Thanks for your patience this weekend as the campus struggled with loss
of cooling water. Several people have asked what happened. This is what
we understand.
Just before 3 pm Friday, a 60Kv electrical line was damaged during
construction work, causing the Cardinal Cogeneration Plant to shut down.
Those of you in the lab at that time may have experienced the associated
power glitch which caused a number of tools to shutdown or lockup. The
Cogen plant is the large green "steamy" structure across the street from
us. It supplies power, cooling water and steam to the entire Stanford
campus. Cogen cooling water is used to absorb heat from the Allen
building process cooling water (PCW) recirculating system. SNF uses PCW
to cool pumps, chillers, and other heat-generating systems. Cogen
cooling water is also used for controlling building temperature and fab
humidity and temperature. Without cooling water, our tools shut off and
the building/lab heat up. Friday afternoon, campus wide, buildings got
hot and computer system shut down.
Emergency backup systems kicked in. In the case of SNF, city water was
automatically introduced to keep the PCW temperatures down. However,
with the whole campus also using city water as backup, the pressure was
not sufficient to keep our tools running. By Friday evening, SNF staff
were able to safety shutdown the major heat generating tools and thus
avoid damage to tools or the PCW system. Stanford emergency crews worked
through the weekend and by around 9 pm Sunday evening were able to
restore cooling water campus wide. Although a couple of SNF tools are
still suffering from the unexpected shutdown, quick action and long
hours by SNF and FacOps staff prevented serious damage. Special thanks
to Maurice, Mahnaz, Ed, Ray, and Elmer for directing traffic and
shutting tools down; Jim H for cutting his vacation short to come in,
help and advise; Ted for calling in instructions and advice while home
sick; and Tony in FacOps for keeping staff informed and putting in long
hours to make sure the PCW was OK.
While recognizing the heroic efforts of many staff, there are a number
of things we need to do to improve communications at the infrastructure
level and with our labmember community. These will be addressed in
coming weeks. If there are any questions about specific tools, please
consult with Coral and the responsible staff member. If there are
questions about this incident, please don't hesitate to ask.
Thanks again,
Your SNF Staff
Re: can't open labmember's wiki page
While I can't say exactly what was wrong, a bit of cleaning and a restart of the underlying Plone CMS (Content Management System) should now allow you to access the https://snf.stanford.edu/SNF portion of our web site.
John
On 8/20/2012 6:46 PM, Helen Qiushi Ran wrote:
Hi all,I can't open labmemeber's wiki page (snf.stanford.edu/snf) for the whole day. I am not sure whether it's because of my network or the server is down. Does anyone else have this problem?Best,HelenHelen Qiushi RanPh.D. CandidateDepartment of Electrical Engineering,Stanford, CA, 94305
Problem p5000etch SNF 2012-08-21 06:16:22: Chamber C detected HT EX fault
Monday, August 20, 2012
Re: can't open labmember's wiki page
Mechanical Engineering
Stanford University
(650) 353-8041
Hi all,I can't open labmemeber's wiki page (snf.stanford.edu/snf) for the whole day. I am not sure whether it's because of my network or the server is down. Does anyone else have this problem?Best,HelenHelen Qiushi RanPh.D. CandidateDepartment of Electrical Engineering,Stanford, CA, 94305
can't open labmember's wiki page
Problem p5000etch SNF 2012-08-20 16:40:54: Ch.A, wafer enters chamber but no process
retrived wafers
DISSERTATION DEFENSE: Helen Xiangyu Chen
DISSERTATION DEFENSE
Ph.D. Candidate: Helen Xiangyu Chen
Research Advisor: H.-S. Philip Wong
Date: Monday, August 27, 2012
Time: 9am, refreshment served at 8:45am
Location: Packard 202
Title: Graphene in Back-End-Of-Line Technology
Abstract:
Back-End-Of-Line technology have always been one of the major components of modern high-speed integrated circuits (ICs). In the most advanced IC technology, the capacitance associated with interconnects typically accounts for about 50% of the active processor power consumption, and the associated signal delay along interconnects is one of the main bottlenecks for the routing of high-speed signals. Conventional interconnect materials such as copper are facing great challenges to satisfy requirements when physical dimensions are scaled down to the nanoscale range and the need for new interconnect material becomes prominent.
In this work, we studied applications of graphene in BEOL technology. We successfully demonstrated integration of graphene interconnects with CMOS circuits and studied the high speed performance of these wires. We have also studied the reliability performance and failure mechanism of graphene interconnects. Finally, we demonstrated that application of graphene in BEOL can go beyond being used as interconnect. The unique physical and electrical properties of graphene makes it a promising candidate for being used as copper diffusion barrier as well.
Coral software information update meeting (Badger)
Stanford has invested significantly in producing an upgraded version of
Coral lab management software, now called Badger. SNF is planning to
convert to this during the winter shutdown.
Badger maintains a similar look to Coral and the same functionality, but
with some improvements.
I have asked Michael Bell to provide an introduction and update to all
the interested lab members on Sept 6 at 10 am in the AllenX conference
room, 101X. Please attend if you want to learn more.
Regards,
John
PCW back online
Problem p5000etch SNF 2012-08-20 09:25:09: Ch.B is down vacuum pump
Re: Monday - Optical Properties of III-V Nanowire Arrays - McCullough 218 @ 2:30PM-3:00PM
To: "labmembers" <labmembers@snf.stanford.edu>, "cuigroupmaillist" <cuigroupmaillist@lists.stanford.edu>, "Melosh Group" <melosh-group@lists.stanford.edu>, "Paul McIntyre" <pcm1@stanford.edu>, "James Harris" <jhharris@stanford.edu>
Cc: "Nicklas Anttu" <nicklas.anttu@ftf.lth.se>
Sent: Friday, August 17, 2012 7:18:57 AM
Subject: Monday - Optical Properties of III-V Nanowire Arrays - McCullough 218 @ 2:30PM-3:00PM
Optical Properties of III-V semiconductor nanowire arrays
Monday, August 20, 2012, 2:30PM~3:00PM, McCullough 218
Abstract
Vertical III-V semiconductor nanowire arrays offer the possibility for highly tunable optical response in opto-electronic applications. In this presentation, I review the strongly diameter dependent absorption of light in InAs nanowire arrays.1 Recent results of a four-fold absorption enhancement by a non-absorbing dielectric shell around the nanowires and the underlying physical mechanism will also be discussed. After that, a method for extracting the nanowire dimensions from measured reflectance spectra is demonstrated for as-grown InP nanowire arrays. Finally, a brief overview of the modeling of nanowire arrays for photovoltaics is given with emphasis on different optical loss mechanisms.
[1] Wu, P. M.; Anttu, N.; Xu, H. Q.; Samuelson, L.; Pistol, M.-E. Nano Letters 2012, 12, 1990.
Biography
Saturday, August 18, 2012
Re: optical microscope z-depth multiplication factor
Does anyone know the multiplication factor needed to convert the number
in the digital Z-axis control of the optical microscope (next to the UV
curing chamber in the litho area) to microns? It seems the paper with
the instructions on it is lost.
Thanks,
Xuan
Friday, August 17, 2012
Cogen is down
What a toasty Friday afternoon....
Cogen is DOWN, so Chilled water and steam are down so there are no
environmental controls are available.
There is possibility of CDA to go down as well.
Facility will come in after they get the call from MCS that chilled
water has come back on. we will need at least 5 hours after the chilled
water comes back to restart the thin film equipment. Jim H. on vacation
has come in and helping out with getting started.
I have powered down the asml Lamp.
all the furnaces and most etchers are shut down as well.
Please check coral for update and take the opportunity and have a nice
weekend.
Snf staff
Most SNF Tools are Shutdown 8/17/12
At about 3pm the SNF experience a number of tool faults. What we have found out is, Cogen has lost the ability to provide chilled water. This greatly impacts the SNF lab. You will first notice the high room temperature in lab before you notice all the shutdown tools which need process cooling water, that is tied to Cogens' chilled water.
The staff is busy shutting down pumps and furnace to prevent overheating damage. If you have reservations for this evening it is highly unklikely the equipment will be available. Please review Coral before heading to the fab.
The only report as to when we will get chilled water (and room temperature control and process cooling water) is "we don't know when it will be available." Until Cogen is back and running the fab will have very limited equipment available for processing.
Regards,
SNF Staff
Power glitch//many tools down
Check Coral before coming into the lab to check tool status.
Re: Problem p5000etch SNF 2012-08-16 13:48:46: Ch.B pressure not stable
Re: Shutdown p5000etch SNF 2012-08-17 13:00:12: wafer stuck between elevator and cassette
Monday - Optical Properties of III-V Nanowire Arrays - McCullough 218 @ 2:30PM-3:00PM
Optical Properties of III-V semiconductor nanowire arrays
Monday, August 20, 2012, 2:30PM~3:00PM, McCullough 218
Abstract
Vertical III-V semiconductor nanowire arrays offer the possibility for highly tunable optical response in opto-electronic applications. In this presentation, I review the strongly diameter dependent absorption of light in InAs nanowire arrays.1 Recent results of a four-fold absorption enhancement by a non-absorbing dielectric shell around the nanowires and the underlying physical mechanism will also be discussed. After that, a method for extracting the nanowire dimensions from measured reflectance spectra is demonstrated for as-grown InP nanowire arrays. Finally, a brief overview of the modeling of nanowire arrays for photovoltaics is given with emphasis on different optical loss mechanisms.
[1] Wu, P. M.; Anttu, N.; Xu, H. Q.; Samuelson, L.; Pistol, M.-E. Nano Letters 2012, 12, 1990.
Biography
Thursday, August 16, 2012
Problem p5000etch SNF 2012-08-16 13:48:46: Ch.B pressure not stable
Cooling also an issue. Photoresist gets pink for some wafers.
Wednesday, August 15, 2012
Problem p5000etch SNF 2012-08-15 16:52:14: Ch. C Turbo "Slow"
Need something
Hi,
Does anyone have Tetrahydrofuran(THF) solvent and Epo-Tek 377 that I can borrow for a couple days? We need them ASAP.
Thanks,
Yuxin Zheng
PhD candidate
Hesselink's group
Department of Electrical Engineering, Stanford University
Monday, August 13, 2012
Re: Hydrogen flame anneal
I can advise on how to set one up.
Best, j Nathan Hohman
----- Original Message -----
From: Chaitanya Gupta <cgupta2@stanford.edu>
To: labmembers@snf.stanford.edu
Cc: Shuai Chang <schang23@asu.edu>
Sent: Mon, 13 Aug 2012 14:51:57 -0700 (PDT)
Subject: Hydrogen flame anneal
Hello SNF users,
I was wondering if anyone on this list has had experience with hydrogen flame annealing of gold surfaces, or would know of a facility on campus where one can do flame annealing? If so, could you please get back to me and Dr. Chang (cc'd here).
Thank you,
Chaitanya Gupta
Paul Allen Building,
420 Via Palou Mall,
Stanford University,
Stanford, CA 94305-4070
(217)7213701
Hydrogen flame anneal
I was wondering if anyone on this list has had experience with hydrogen flame annealing of gold surfaces, or would know of a facility on campus where one can do flame annealing? If so, could you please get back to me and Dr. Chang (cc'd here).
Thank you,
Chaitanya Gupta
Paul Allen Building,
420 Via Palou Mall,
Stanford University,
Stanford, CA 94305-4070
(217)7213701
CL96 update-good news
After swapping out parts and changing our version of software, Calcon has the CL96 communicating with the rest of the TGO system.
Gases are back on and we are releasing tools back to the lab.
-m
Good Morning All,
Just an update on the CL96 gas monitoring system. As most of you know, there are many systems that are running behind the scenes to keep the lab functional such as process cooling water, mechanical pumps, fume scrubbers, acid waste neutralization, bulk gases, etc.
One of the most important background systems is the toxic gas monitoring system. The CL96 is one part of this important safety system. It monitors several toxic gases to tools in the lab and we are not allowed to run the tools if we cannot monitor the gases going to them. Once again Calcon, our toxic gas company, is on site waiting for parts to get this safety system back up. We are sorry for any inconvenience.
-- maurice@stanford.edu Maurice Stevens Stanford Nanofabrication Facility CIS Room 142, Mail Code 4070 Stanford, CA 94305 P. (650)725-3660 F. (650)725.6278
CL96 update
Just an update on the CL96 gas monitoring system. As most of you know, there are many systems that are running behind the scenes to keep the lab functional such as process cooling water, mechanical pumps, fume scrubbers, acid waste neutralization, bulk gases, etc.
One of the most important background systems is the toxic gas monitoring system. The CL96 is one part of this important safety system. It monitors several toxic gases to tools in the lab and we are not allowed to run the tools if we cannot monitor the gases going to them. Once again Calcon, our toxic gas company, is on site waiting for parts to get this safety system back up. We are sorry for any inconvenience.
Challenges and opertunities of Lithium Air Batteries - guest lecture by Scheffler Rouven
Date: Tue, 19 Jun 2012 05:34:23 -0700
To: "Labmembers@Snf. Edu" <labmembers@snf.stanford.edu>
Cc: Rainer Fasching <rfasch@stanford.edu>
Subject: New Summer Course!
Hi all --
Fellow labmember, Rainer Fasching, is teaching a new course on electrochemistry!
******************************************************************************
Applied Electrochemistry – Advanced Batteries ME420 - Syllabus, Summer 2012.
This class is build around applied electrochemistry with focus on energy conversion and storage. Basic concepts of electrochemistry are presented, of which the fundamentals of electrochemical energy conversion/storage are built. Electrochemical methods of energy conversion and storage are discussed with emphasis on thescaling behaviors.
Advanced battery concepts/systems and their applications (electrical vehicle and grid) will be a main subject of this year. High energy density battery technologies (beyond intercalation materials) and the influence on nano-structured materials/architecture will be discussed. Here the class will focus on challenges, solutions, and future perspectives of high capacity materials in closed systems (e.g. Li-ion, F-ion, flow batteries) as well as open systems (e.g. Li-air).
In addtion solid-state electrolytes with their potential for all solid-state batteries will be introduced this year.
Journals articles and book chapters will be used for in class discussion to emphasize on current research and challenges.
To introduce you to the fundamentals, modern methods, and current
trends of applied electrochemistry:
Understand the basic concepts of electrochemistry for energy storage
Gain familiarity with advanced battery technologies and current trends
Build confidence and knowledge to deal independently with electrochemical problems
Classroom: Will be announced
Time: Tuesday and Thursday
10:00-12:00 AM
Instructor: Rainer Fasching
Building 530, Room 220
Tel: 650-723-0084
Fax: 650-723-5034
Email: rfasch@stanford.edu <mailto:rfasch@stanford.edu>
Friday, August 10, 2012
Missing USB stick
If you found a red Transcend USB stick (link to pic), please let me know or drop it at Maureen's cubicle.
Thanks,
Chu-En
Gases for CL96
for repair should be here early Monday. Gases include: Arsine, B2H6,
Phosphine, and Silane for Epi. Silane for Tylan and Thermco LTOs. Silane
for STS. Silane for ICP and CCP. So the tools that are down are : Epi,
ICP, CCP Tylan and Thermco LPs , STS dep. Sorry for any inconvenience . Ted
CL-96 gas monitor is still down
The CL-96 gas monitor is still down. This system is one that
monitors toxics in the lab. Therefore all gases for tools associated
with it are down for now. Calcon our TGO company is busy working on the
system and we will let everyone know as soon as it is back up.
Thursday, August 9, 2012
Plasma-Therm Technical Workshop: Fundamentals of Plasma Processing (Etching and Deposition)
SNF and Plasma-Therm would like to invite you and your team members to
attend the Plasma-Therm Technical Workshop: Fundamentals of Plasma
Processing (Etching and Deposition) to be held at the Stanford
University on September 10 and 11, 2012.
The Workshop is intended to provide understanding and insight to those
working with plasma etching and deposition processes and equipment. The
goal is to help researchers make faster progress on projects requiring
plasma processing. The course has been very well received at Harvard, UC
Berkeley, UCLA, Notre Dame, USF, IMRE, Israel, and Lund University.
Graduate students, post docs, professors, and staff have all found the
material useful.
The format encourages questions and we hope attendees take advantage of
the opportunity for networking and discussing their projects. The
workshop is meant to encourage cooperation within the academic and
industrial research communities.
Please be assured that the course is not an advertisement about
Plasma-Therm products. Aside from a very brief 15 min introduction to
Plasma-Therm, the rest of the day is dedicated to education on
fundamentals and advanced etching and plasma-enhanced chemical vapor
deposition technology. Presentation materials are equally useful to
those that do and do not have our equipment.
Details regarding the Workshop objectives, agenda, location, and speaker
can be found on the attached flyer.
Please note that the workshop is free and registration is requested
online by August 31, 2012 at the website:
http://www.surveymonkey.com/s/FPQLZPQ
Regards,
SNF Staff and Plasma-Therm
Wednesday, August 8, 2012
lost student card
Thanks,
Mette
Re: Has anyone used NaCl substrates in vacuum?
From: Artit Wangperawong <artitw@stanford.edu>
To: "glamstuds@lists.stanford.edu" <glamstuds@lists.stanford.edu>; "labmembers@snf.stanford.edu" <labmembers@snf.stanford.edu>
Sent: Wednesday, August 8, 2012 11:50 AM
Subject: Has anyone used NaCl substrates in vacuum?
