Comment p5000etch SNF 2008-04-30 19:28:45: Update

Broken wafer in Ch.B. Also heavy resist build-up in the chamber. Wet cleaned the chamber and adjusted the wafer hand-off position. Still having a problem with the current reading on one of the magnet's 3 power supply line. One of the current reading drops to "0" when the RF turns on. Continuing to troubleshoot.
Ch.A - ordered two new chamber interconnect cables to replace the ones that has signs of corrosion.
Ch.C- ran OK. cycled 10 wafers with no problems. Will continue to exercise the chamber tomorrow.
Located at least one source of the water leak. Will attempt to repair tomorrow.

Maskmaking update

Hello Labmembers --

Lots of new stuff on the maskmaking front, so please check out the the
website describing maskmaking resources at:

http://snf.stanford.edu/Process/Masks/Masks.html

Some key features:
- Special pricing for has been arranged for both academic and industrial
SNF labmembers from several suppliers.
- Mask Order Forms and contact info for maskmasking services are
provided online for industrial labmembers
(http://snf.stanford.edu/Process/Resources/MaskSources.html) and
academic labmembers
(https://www.stanford.edu/group/snf/Masks/Maskmaking.html).
- Detailed instructions on how to fill out mask order forms are
available on these pages.
- An overview from Bill Martin describing the terminology and layout
conventions -- essential info for new layouts
- Tips & tricks and detailed examples for making the most of LEdit in
your layouts.

If you have any questions or would like to contribute tips & tricks or
other info, please don't hesitate to get in touch with one of us (Ed,
Mahnaz, Mary).

The SNF Mask Team

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

PhD Oral Examination - Shuhong Liu (Wednesday, May 14, 2008, 1:30 pm)

Controlled Deposition of Organic Semiconductor Single Crystals and its
Application in Field-Effect Transistors

Shuhong Liu
Department of Materials Science and Engineering
Advisor: Professor Zhenan Bao

Wednesday, May 14, 2008, 1:30 pm, Packard building, Room 101
(Refershment to be served at 1:15 pm)

Abstract:

The search for low-cost, large area, flexible devices has led to a
remarkable increase in the research and development of organic
semiconductors. Single-crystal organic field-effect transistors are
ideal device structures for studying fundamental science associated
with charge transport in organic materials and have demonstrated high
mobility and outstanding electrical characteristics. For example, an
exceptionally high carrier mobility of 20 cm2/Vs has been demonstrated
for rubrene single crystal field effect transistors. However, it
remains a technical challenge to integrate single-crystal devices into
practical electronic applications. A key difficulty is that organic
single-crystal devices are usually fabricated one device at a time by
handpicking a single crystal and placing it onto the device substrate.
This makes it impossible to mass-produce at high density with
reasonable throughput. Therefore, there is a great need for a
high-throughput method for depositing large arrays of organic
semiconductor single crystals directly onto device structures.

In this talk, I?ll present several approaches towards realizing this
goal. In the first part, I?ll introduce a solution-processing
technique that relies on solvent wetting and de-wetting on substrates
with patterned wettability to selectively direct the deposition or
removal of organic crystals. The assembly of different organic
crystals over centimeter-squared areas on Au, SiO2 and flexible
plastic substrates is demonstrated. By designing line features on the
substrate, alignment of needle-like crystals is also achieved. As a
demonstration of the potential application of this approach, arrays of
organic single crystal FETs are fabricated by patterning organic
single crystals directly onto and between transistor source and drain
electrodes. Besides organic single crystals, our self-assembly
strategy is also be applicable for patterning other objects such as
metallic nanowires.

In the second part, I?ll present a vapor-processing technique that
patterns organic single crystals using carbon nanotube (CNT) bundles
as templates. Several organic semiconductor materials are successfully
patterned, including p-type pentacene, tetracene, sexiphenylene, and
sexithiophene, as well as n-type tetracyanoquinodimethane (TCNQ). This
study suggests that the selective growth of crystals onto patterned
carbon nanotubes is most likely due to the coarse topography of the
CNT bundles. Moreover, we observe that the crystals nucleate from CNT
bundles and grow onto CNT bundles in a conformal fashion. The crystal
growth can be directly applied onto transistor source-drain electrodes
and arrays of organic single-crystal field effect transistors are
demonstrated. To investigate the impact of CNTs on device performance,
CNT bundles are incorporated into thin-film FETs and a mobility
enhancement of organic semiconductors is observed.

In the third part, I?ll present a method that offers the control of
the size and shape of organic single crystals using patterned Au films
as templates. It is observed that ?-sexithiophene (?-6T) crystals
nucleate from the edge or the top surface of Au films and then grow
two dimensionally on SiO2 surface. The sizes and shapes of ?-6T
crystals are precisely determined by that of the Au patterns. After
removing Au templates, large arrays of ?-6T crystals with controlled
sizes and various shapes such as stripes, squares, hexagons, etc. are
achieved. Top-contact FETs made of ?-6T ribbons are demonstrated.
Besides organic single crystals, Au templates can also act as
templates to pattern vapor- and solution-deposited organic
semiconductor thin films. Patterned organic thin-film FETs exhibit
superior performance compared to unpatterned devices.

Comment p5000etch SNF 2008-04-30 00:38:07: Ch.C was down when I enabled machine

Shutdown p5000etch SNF 2008-04-30 00:37:37: Wafer fell off blade in machine

Tried CH.B JIM.OX with 55 gauss. Failed with the usual magnet error.
Tried to return wafer to cassette, and wafer fell off the blade.
Also, blade gave "unknown robot axis position" errors.

Comment p5000etch SNF 2008-04-29 14:57:36: Ch.B magnet current fault

Try running the magnet at 55 gauss or less. Cycled 24 wafers yesterday at 55 gauss with no problems. At > 59 gauss, the system faulted for the low magnet current.

Lunch at CIS Patio

All,

There are plenty of food left at the CIS Patio. Go get them while they are last!

Grace

Problem p5000etch SNF 2008-04-29 13:15:55: chamber B helium pressure

Chamber B alarm during main etch: helium pressure not withini limits.

Problem p5000etch SNF 2008-04-29 13:10:40: chamber B magnet fault

Chamber B alarm: detected magnet fault during main etch step.

Problem p5000etch SNF 2008-04-28 14:55:44: Ch.A is down for wafer lift

Problem seems to be due to corrosion in the ch. interconnect cable caused by coolant leak. Tried cleaning the cable contacts but only worked temporarily. Next ,we will try to replace cables.

Re: Problem p5000etch SNF 2008-03-17 08:19:47: Ch.A is down

Chamber lift assy is OK. Chamber interconnect cables has some corrosion due to water leak.

Re: Comment p5000etch SNF 2008-03-19 18:33:20: Ch.A update

Noted

Re: Problem p5000etch SNF 2008-03-24 15:18:46: where is Jim DP trench?

Noted

Re: Comment p5000etch SNF 2008-03-27 06:05:59: Applied working on restoring Hard drive

Noted

Re: Comment p5000etch SNF 2008-03-27 13:22:32: FS working on Drive

Noted

Re: Comment p5000etch SNF 2008-04-02 07:36:11: Update

Noted

Re: Comment p5000etch SNF 2008-04-01 15:04:56: Update

Noted

Re: Comment p5000etch SNF 2008-03-31 11:53:36: Update

Noted

Re: Comment p5000etch SNF 2008-04-08 15:09:16: Update

Noted

Re: Comment p5000etch SNF 2008-04-23 10:56:40: Update

Noted

Re: Comment p5000etch SNF 2008-04-03 13:43:43: Update

Noted

Re: Comment p5000etch SNF 2008-04-03 08:55:38: Update

Noted

Re: Comment p5000etch SNF 2008-04-02 19:03:41: Update

Noted

Re: Comment p5000etch SNF 2008-04-24 14:59:15: Update

Ch. C is up -Ran 12 wafers on Ch.C with no problem.
Ch. B is up but unable to run electro-magnets at > 55 gauss. Ran 24 wafers (Ch.B Timed recipe @ 55 gauss) with no problems. Next step is to swap the chamber magnet's power supply. If the problem goes away, we will order a new power supply
Ch.A is DOWN- The wafer lift sensor problem is back. The plan is to replace a chamber interconnect cable.

Re: Comment p5000etch SNF 2008-04-25 14:57:24: Update

Ch. C is up -Ran 12 wafers on Ch.C with no problem.
Ch. B is up but unable to run electro-magnets at > 55 gauss. Ran 24 wafers (Ch.B Timed recipe @ 55 gauss) with no problems. Next step is to swap the chamber magnet's power supply. If the problem goes away, we will order a new power supply
Ch.A is DOWN- The wafer lift sensor problem is back. The plan is to replace a chamber interconnect cable.

Re: Shutdown p5000etch SNF 2008-03-26 09:16:10: Hard drive crashed

Field service replaced the hard drive and restored recipes. Found an old hard drive in the parts cabinet and test on the system. Old hard drive is OK. Now have a spare.

Re:Re:

■□淫らな主婦があなたを待っています■□

スタイル・性格・ビジュアルいろんな観点から
選べる、人妻検索♪

既婚の方も、独身の方も一度いかがですか？
綺麗な主婦には、必ず秘密があります。

☆その秘密は実はここにあります☆
http://www.lover-say.com/tuma

配信停止には少しお時間を頂きます
『配信を停止したいアドレス』
転送設定されて届く方は転送元のアドレスを
明記の上、下記までメール下さい
maki_miyagawa@yahoo.fr

Comment p5000etch SNF 2008-04-25 14:57:24: Update

Chamber A lift sensor is operational again after cleaning the chamber interconnect connector. Ran 6 wafers with no problem.
Chamber B magnet contactor is also operational. Vendor cleaned some contacts. However the machine alarms for "low magnet current " because the reading on one of the magnets power cable is indicating low current flow. Might be more bad connections but the system ran OK for recipes that have a magnetic field require of less than 60 gauss. Vendor will continue to work on this problem.
Will test system thoroughly on Monday before releasing ??

quesiton about thin Au film liftoff on Si substrate

Hello labmembers,

 

I’ve got into troubles lifting off very thin Au film recently. I used PMMA as photoresist, and patterned my sample (Si substrate) with ebeam. A very thin Au layer (5 angstroms) was deposited by Innotec. After liftoff, I found many Au nanoparticles or even clusters redeposited onto the unpatterned substrate. I thick it may be partially caused by the electronegativity between Au and Si. I wonder if there is anyway to prevent this behavior. Any comments and suggestions will be highly appreciated. Thanks for your attention.

 

Thanks,

Yuan

Yellow cabinets

Hello all,

Urgent

Please look in to  your nonstandard chemicals and remove bottles that are not in use or has gotten expired.
This is quiet urgent.
I was checking the yellow cabinets around 10 am this morning and when I opened the right cabinet one bottle fell out, I was lucky to catch it.
I want the cabinet cleaned TO DAY . At 3 pm today I am forced to take some ( I say about 20  bottles out), if you have chemicals and can take it to your lab for now I would appreciate that. I am forced to do this, I would rather every one take a few minutes and help us  out here.

mahnaz

Comment p5000etch SNF 2008-04-24 14:59:15: Update

Found the defective cable/connnector. Will power down the system tomorrow so that I can clean the contacts. Also, field service will be here tomorrow around 10 am.

seminar today by Prof Mary Boyce from MIT

periodic elastomeric structures and their acoustic structural models, i.e. "phononic crystals"

 

Mechanics of Deformation-Triggered

Pattern Transformations and Superelastic Behavior

in Periodic Elastomeric Structures

 

Presented by

 

Mary C. Boyce

Department of Mechanical Engineering

Massachusetts Institute of Technology

Thursday, April 24, 2008

4:15 PM in Building 300, Room 300

 

Periodic microstructures abound in nature and provide numerous interesting and unique mechanical, photonic, phononic and hydrophobic properties. Here, novel and uniform deformation-induced pattern transformations have been found in periodic elastomeric cellular solids upon reaching a critical level of mechanical load. This behavior is accompanied by a superelastic stress-strain behavior where, after reaching the critical load, the material deforms elastically to large deformations at nearly constant stress. Numerical simulations utilizing Bloch wave analysis clearly show the mechanism of the pattern switch to be a form of local microstructural elastic instability, giving reversible and repeatable transformation events as confirmed by experiments. The nature of the instability and accompanying pattern transformation depend on the initial periodic pattern. The deformation-triggered transformations have been physically realized for several periodic elastomeric structures including square and oblique arrays of circular holes as well as rectangular arrays of elliptical holes, each subjected to axial compression. A ligament buckling instability was found to trigger the transformations in the square and rectangular lattices and a shear instability triggered the transformation in the oblique lattice. Post-deformation transformation is observed to accentuate the new pattern and is found to be elastic and to occur at nearly constant stress, resulting in superelastic behavior.

Furthermore, periodic microstructures are a known method to control wave propagation and create materials with tailored band gap structures. Here, we calculate the acoustic band structures of different periodic elastomers at different levels of deformation. We demonstrate the ability to use deformation to transform phononic band gaps. The elastomeric nature of the material makes the transformation in both structural pattern and phononic band gap a reversible and repeatable process, creating a phononic band gap switch.

 

Re: photo resist pretreatment before ion implantation

Hi SangBum,

Just wanted to clarify one point here:

The second 30min 110 C bake is not needed if you send your wafers for implant right away. It is intended for wafers that sit around for a long while (this is the case for ee410, sometimes the wafers wait in the lab for 2-3 days before the implant step). The reason is that if you leave your wafers waiting around for a long time the resist layer tends to absorb moisture from the ambient and this reverses the effect of baking.

Hope this saves you some time,

Caner.

On Apr 23, 2008, at 9:12 PM, SangBum Kim wrote:

Thank you for those who sent me the reply. I found a recipe from ee410 class runsheet, which you can find at http://www.stanford.edu/class/ee410/#HO thanks to Mary's help.

0) After developing 1um thick 3612,
1) 30mins at 110C
2) 15mins UV exposure
3) 30mins at 110C
4) Ion implantation

SangBum


SangBum Kim wrote:

Dear SNF labmembers,

 

 Could anyone give me some advice on typical photoresist pretreatment before ion implantation, please?

 For example, do I need 1) UV hardening of resist or 2) heat treatment? Any other suggestions?

 

 I plan to use ion implantation service from Innovion and use 1.6um thick SPR 3612 as a photoresist with maximum As ion energy of 180keV.

 

Thanks,

SangBum

Re: photo resist pretreatment before ion implantation

Thank you for those who sent me the reply. I found a recipe from ee410 class runsheet, which you can find at http://www.stanford.edu/class/ee410/#HO thanks to Mary's help.

0) After developing 1um thick 3612,
1) 30mins at 110C
2) 15mins UV exposure
3) 30mins at 110C
4) Ion implantation

SangBum


SangBum Kim wrote:

Dear SNF labmembers,

 

 Could anyone give me some advice on typical photoresist pretreatment before ion implantation, please?

 For example, do I need 1) UV hardening of resist or 2) heat treatment? Any other suggestions?

 

 I plan to use ion implantation service from Innovion and use 1.6um thick SPR 3612 as a photoresist with maximum As ion energy of 180keV.

 

Thanks,

SangBum

Comment p5000etch SNF 2008-04-23 10:56:40: Update

Chamber A wafer lift position sensors are not functioning again. Failed during wafer cycling. Informed field service. They might be here this afternoon.

Re: Comment p5000etch SNF 2008-04-22 14:15:10: Update

Chamber A wafer lift position sensors are not functioning again. Failed during wafer cycling. Informed field service. They might be here this afternoon.

1in siicon wafer

Hi all,
Does anyone have extra(two or three) 1in wafers that I can get today?
I forgot to order so if someone has it I can pay for the wafers.
Thanks!

Joongsun

Sent from iPhone

suggestions for Alumina etchant?

Hello:

Does anybody have experience wet-etching Al2O3? In particular, I'd be
interested in etchants that are not harmful to organics.

Thanks.

--Joey

Mask Clinic: Wednesday, 3 pm

Hi all --

Bill Martin will be back tomorrow (Wednesday) at 3 pm to answer your
mask questions. We'll meet in the bullpen/cubicle area outside Mahnaz'
office. If you haven't done so already, please check out the mask
layout guide at https://www.stanford.edu/group/snf/Masks/Maskmaking.html

(SUNet ID required - or contact a staff person for the info).

Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Tungsten Wet etch

Hello,

We have a resist lifting problem while etching 0.4um of sputtered W on SiO2 using HMDS/Shipley 3612 1um resist. All feature sizes start to peel off after about 1min of etching.

H2O2 is used as etchant @35C.

Can anyone suggest a known good process for this (etchant, adhesion promoter, process conditions)?

For the record, I do not see lifting with resist on SiO2 processed at the same time in the bath.

Thanks,

Arvind Kamath

Re: Etching of ITO

Depends on your sample's feature size, I guess. We are using HCL liquid
etching in our electrode array fabrication. The thickness of our ITO
film is 200 nm and it's usually gone in 8 minutes. Some overetch time
will be helpful.

Take care,
Sergei

Wanki Kim wrote:

> Hi all,
>
> I am trying to make an electrode using ITO.
> Could anyone please tell me the way how to etch ITO?
> Thanks.
>
> Best,
> Wanki
>
>

Micromanipulator 6000 probe station ...

SNF Lab Members:

I've fixed a few items on the Micromanipulator 6000 probe station (the
one in CIS 152):

1. I've put on an new Z-stage drive belt so that the fine-adjustment of
the stage height works once again.

2. I've fixed the long-dead fourth motorized stage motion so that it
will now allow the electric motors to drive left/right and back/front
(both at low- and high-speed).

3. I've fixed and adjusted the lever detent that holds the stage and
probes well above the sample. Somebody had been tinkering with some of
the set screws on that assembly and had very nearly caused it major
problems by misadjusting the tension on the ball bearings in that assembly.

Finally, if you are using the probe station and find that the probe tips
are in poor condition, I've got a stockpile of spare probe tips and
would be happy to replace any that are badly mangled.

Hopefully these adjustments and repairs will make the probe station more
functional for everyone.

Happy probing,

John

Comment p5000etch SNF 2008-04-22 14:15:10: Update

Field service replaced the opto-sensor board and a chamber interface card. Now Chamber A's wafer clamp position indication is now functional. Cycled wafers but had problems with picking up wafer from the chamber. Need to check hand-off position or wafer pin lift speed.

Horizontal tube cleaner is gone

Hello All,
Horizontal tube cleaner is gone The room is back in business. Thanks
for your patience.ted

SEMINAR: Prof. Leslie Field Reversibly Rebuilding the Polar Ice Cap

labmembers,
today there is a seminar that should be of wide spread interest since
we all live on the earth. Visiting Prof. Leslie Field will speak
about a Reversible method for rebuilding the Polar Ice cap and other
global habit elements. see attached notice.
Talk is at 3pm in Packard 101.

~j

Etching of ITO

Hi all,

I am trying to make an electrode using ITO.
Could anyone please tell me the way how to etch ITO?
Thanks.

Best,
Wanki

SNF Process Grand Rounds, Friday, 4/25

Hi all --

The next SNF Process Grand Rounds will be this Friday, April 25, at
11:30 am in CIS 101. There will be two topics on the agenda.

1. LTO Process Issues. As many of you know, SNF staff and labmembers
have been trying to deal with a particle issue on this system. It has
also been brought to our attention that there are electrical testing
issues related to LTO which may go back several months or more. We
would like to solicit and share data and other input from labmembers
which may help set a timeline for these issues -- and which might help
identify the problem and maybe even pinpoint possible causes. Please
bring any data you might have.

2. Quality Circles. This will be an opportunity to update progress on
the functional area Quality Circles.

Pizza provided. Hope to see you there!

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Reminder: Process Clinic & SpecMat today, 2-4 pm

Hi everyone --

Process Clinic today from 2-4 in the bullpen area. From 2-3 will be
open session. From 3-4 will be SpecMat. Bring your processing
questions, process flows, and special materials requests.

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Horizontal tube cleaner leaving today

Hello All,
Just a reminder that the Horizontal tube cleaner will be moving out
today so the botlle wash room-Wafer saw, polisher will not be available.
Thanks, ted

Fwd: University PhD Dissertation Defense for Venkatesh H. R. Chembrolu

Process Clinic/SpecMat: Monday, April 21, 2-4 pm, CIS bullpen

Greetings Labmembers --

In order to try to improve communication and encourage you to use Staff
as a resource, we will be holding regular "Process Clinics" in the
bullpen area outside the lab. As opposed to the larger Grand Rounds,
these will be informal gatherings where labmembers can discuss technical
issues one-on-one with Staff and each other. New labmembers are
especially encouraged to bring their process flows and design layouts
for feedback, suggestions about equipment choices and training
logistics. More experienced labmembers are encouraged to join in on the
discussions, propose/solicit support for processing related projects,
make processing requests, etc.

We will try to make each Clinic topical, but still want to encourage all
labmembers to bring any process-related issue. For example, there was
the Mask Clinic two weeks ago (and by the way, Bill Martin has agreed to
return on a regular basis, to answer questions and review labmembers'
files in this forum.)

For the Process Clinic next Monday (4/21), there will an open forum from
2-3 pm. At 3 pm, a quorum of SpecMat members will be on hand to review
any SpecMat requests anyone wishes to make (please be prepared with MSDS
and other supporting information as appropriate, preferable in
electronic format for easier database entry.)

So, bring your process questions and SpecMat requests, or just stop on
by for a chat -- Monday, 4/21, 2-4 pm in the CIS Bullpen area. Hope to
see you there!

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Horizontal tube cleaner removal

Hello all,
Just a heads up. The horizontal tube cleaner in the wafersaw-bottle
clean room will be removed on Monday April 21 so the room will be very
noisy and dirty i have reseved the saw for that day so it as well as
polisher will not be available. Thanks in advance for your cooperation, ted

photo resist pretreatment before ion implantation

Dear SNF labmembers,

 

 Could anyone give me some advice on typical photoresist pretreatment before ion implantation, please?

 For example, do I need 1) UV hardening of resist or 2) heat treatment? Any other suggestions?

 

 I plan to use ion implantation service from Innovion and use 1.6um thick SPR 3612 as a photoresist with maximum As ion energy of 180keV.

 

Thanks,

SangBum

[Fwd: seminar today-display and image technology]

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

POCl3/BBr3 doping in sentaurus

Hi,

Does anyone know if Sentaurus has a command for doping by gas
diffusion with POCl3 or BBr3?

Thanks,
Rostam

Stanford OSA/SPIE Seminar "Optics, MEMS, and More: Multiphysics Modeling" Thurs 4/17 4pm AP200

The Stanford OSA/SPIE student chapter is hosting the following seminar this week, open to everyone. For more information about our events, including our Google Calendar, please visit http://student-osa.stanford.edu!

 

Optics, MEMS, and More:

Multiphysics Modeling Using COMSOL

 

 

Thursday, April 17, 2008

AP 200

4:15pm (refreshments at 4pm)

 

Simulating scientific phenomena is rapidly becoming an integral part of the design and optimization process in many science and engineering fields. Multiphysics simulation that can account for coupling of various models has never been easier - or more powerful - than what COMSOL (formerly FEMLAB) offers today.

 

 

This seminar covers an overview of COMSOL's capabilities, including specific examples relevant to those conducting research and teaching in fields such as:

 

• Optics, RF and microwave modeling

• Acoustics modeling

• Electromagnetics modeling

• MEMS and Microfluidics modeling

• Electrical-mechanical-thermal coupling

• Flow, transport and chemical reaction modeling

• Unlimited Multiphysics coupling: simulating multiple phenomena and their interactions

 

 

About the Speaker

Brian Adolf graduated from the University of California, Berkeley with degrees in Electrical Engineering / Computer Science and Physics. He worked as an Analog IC designer making DC/DC converters for cell phones and portable electronics. Brian then started his own company using COMSOL Multiphysics, and is now a COMSOL Applications Engineer at the Palo Alto office.

 

---------------------

http://student-osa.stanford.edu

Vacuum Technology Seminar, 4/24/08

Greetings Labmembers --

Just a reminder that there is a Vacuum Technology Seminar scheduled for
next Thursday, 4/24, in the CISX Auditorium, from 8-12. Gary Scarsdale,
from Varian Inc. will be hosting a tutorial on the practical/equipment
aspects of vacuum systems. This event includes a workshop manual, plenty
of opportunity for Q&A, and even lunch. To register, contact Gary
Scarsdale – Call 408.248.8061 or e-mail gary.scarsdale@varianinc.com

Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: LED wafers and processing

Kevin,

You are asking for what people are currently doing research on, so there are absolutely no vendors who can supply what you are looking for.  You will have to do a great deal of the work yourself, including process development and work with one of the groups putting III-V materials onto Si, which isn't so hard, but trying to do mixed processing is literally impossible except by research groups working on mixed III-V/Si as NO ONE wants to risk contamination of any decent Si processing equipment.  I would suggest that the two best chances are at the NNUN facilities at UCSB and Cornell as they have far more III-V work and relatively little Si, so tend to already be "contaminated".  I would first look at Cornell as they not only have a lot of III-V work, but also considerable Si based MEMS activity.

Good luck,

Jim Harris

Hi,
        I am trying to make a simple LED structure on silicon wafers.  Could anyone please tell me if there are groups or vendors that can make a few wafers with LED materials (such as III-Vs) on top?  Emission in the visible will be desirable. 

       Also, post processing is needed for the wafers and the tools I need are DRIE for silicon, pin-hole free LPCVD/PECVD oxide (to coat and protect my structures for XeF2 etch in a later step), oxide etcher, metal sputtering, and metal etcher.  I assume that all LED materials will be considered gold contaminated.  I was told that Santa Barbara has contaminated DRIE.  I tried searching the NNIN sites but they don't have the cleanliness category listed on the website.  Could anyone please also let me know if there are any places or vendors that can provide these services/tools?

Thanks.

Kevin

--
==================================
Kevin Huang
Ph.D. Candidate
Stanford Organic Electronics Lab
Dept. of Electrical Engineering
Email: kevhuang@stanford.edu
Phone: (650) 725-6924
================================== !DSPAM:480134c9123471923448402!

--  

 James S. Harris, '64
 James & Ellenor Chesebrough Professor     E-Mail:Harris@snow.stanford.edu
 Department of Electrical Engineering       http://www-ee.stanford.edu/~harris/
 420 Via Palou Mall, CIS-X Rm 328            Ph:  (650)723-9775
 Stanford, CA 94305-4075                      Fax: (650)723-4659                                    
 Adm. Asst.: Gail Chun-Creech              Ph:  (650)723-0983
 
 __   ___
   |  |
   |__|
    __ arris  Group, Solid State & Photonics Lab
 __|  |__ http://www-snow.stanford.edu/
 

FW: [CPN] Agilent Technologies/Labs -free Scientific AFM Seminar

_______________________________________________
cpn-announcements mailing list
cpn-announcements@lists.stanford.edu
https://mailman.stanford.edu/mailman/listinfo/cpn-announcements

For your information for those who use Agilent AFM.

Yoshio Nishi

 

---

From: cpn-announcements-bounces@lists.stanford.edu [mailto:cpn-announcements-bounces@lists.stanford.edu] On Behalf Of Kyle Cole
Sent: Monday, April 14, 2008 9:39 AM
To: cpn-announcements@lists.stanford.edu
Subject: [CPN] Agilent Technologies/Labs -free Scientific AFM Seminar

 

Scientific AFM Seminar at Agilent April 15th!

Agilent Technologies and Agilent Labs invite you to register for a one-day Scientific AFM Seminar to be held on April 15 in Santa Clara, California. This special event offers a unique opportunity to learn about the latest AFM techniques, technologies, and research. The content-rich program will feature several 45-minute presentations, each of which will be followed by its own Q&A session.

Scheduled speakers:

Katherine Willets, Ph.D.
University of Texas at Austin
"Spatially Correlated Total Internal Reflection Plasmon Spectroscopy and Atomic Force Microscopy"

Fritz B. Prinz, Ph.D.
Stanford University
"Novel Applications for AFM"

Sanjeevi Sivasankar, Ph.D.
University of California, Berkeley, Q3 Institute
"Manipulation and Detection of Single Biomolecules Using Simultaneous Force and Fluorescence Microscopy"

Sergei Magonov, Ph.D.
Agilent Nanotechnology Measurements Division
"Multi-Frequency Approach in Atomic Force Microscopy: Studies of Local Electric and Mechanical Properties"

Tom Kopley, Ph.D.
Agilent Labs
"Electrical Applications of AFM"

The seminar begins at 8:30 a.m. with coffee and a continental breakfast at Agilent's 5301 Stevens Creek Blvd. facility in Santa Clara, includes an onsite lunch, and runs until approximately 4:00 p.m.

Register Here for this exciting and informative event.

(in the event field - enter "Santa Clara Seminar") 

 

 

 

Stu

 

Stuart G. Spencer

Regional Mgr.

Nanotech Measurements Div.

 

Agilent Technologies

 

Office  (760) 941-7488

Cell     (619) 846-7332

stuart_spencer@agilent.com

 

www.agilent.com/find/afm

 

 

Stu

 

Stuart G. Spencer

Regional Mgr.

Nanotech Measurements Div.

 

Agilent Technologies

 

Office  (760) 941-7488

Cell     (619) 846-7332

stuart_spencer@agilent.com

 

www.agilent.com/find/afm

 

 

LED wafers and processing

Hi,
        I am trying to make a simple LED structure on silicon wafers.  Could anyone please tell me if there are groups or vendors that can make a few wafers with LED materials (such as III-Vs) on top?  Emission in the visible will be desirable. 

       Also, post processing is needed for the wafers and the tools I need are DRIE for silicon, pin-hole free LPCVD/PECVD oxide (to coat and protect my structures for XeF2 etch in a later step), oxide etcher, metal sputtering, and metal etcher.  I assume that all LED materials will be considered gold contaminated.  I was told that Santa Barbara has contaminated DRIE.  I tried searching the NNIN sites but they don't have the cleanliness category listed on the website.  Could anyone please also let me know if there are any places or vendors that can provide these services/tools?

Thanks.

Kevin

--
==================================
Kevin Huang
Ph.D. Candidate
Stanford Organic Electronics Lab
Dept. of Electrical Engineering
Email: kevhuang@stanford.edu
Phone: (650) 725-6924
==================================

Re: Missing notebook

Found it! Thanks, Shrestha! :)

Quoting Shrestha Basu Mallick <sbasumal@stanford.edu>:

> It was next to the Nanospec.
> I put it on the ASML table.
> -Shrestha
> Quoting Salman Latif <slatif@stanford.edu>:
>
>> Dear SNF users,
>>
>> I keep my SNF notebook in my bin, and now it's gone. If any of you see
>> it around, please, please, let me know. It should have my name and
>> e-mail written on the front. It has many processing details inside that
>> I won't be able to recall otherwise.
>>
>> Thanks,
>> Salman.

Missing notebook

Dear SNF users,

I keep my SNF notebook in my bin, and now it's gone. If any of you see
it around, please, please, let me know. It should have my name and
e-mail written on the front. It has many processing details inside
that I won't be able to recall otherwise.

Thanks,
Salman.

Hungry this evening? Muffins, banana bread, etc ...

SNF Lab Members:

Professor Nishi informs me that there are muffins and banana bread that
were not consumed drung a meeting he hosted in CIS 101 and suggested
that some of you working this evening might be able to help finish them
off. While they last ....

Have a good evening,

John

Found Cell Phone in Lab

A cell phone was found in the Analytical room inside the lab, if this is your phone please come to my cubicle #41 on the first floor of the CIS building and claim it.

 

Maureen

 

Maureen Baran

Stanford Nanofabrication Facility

Lab Services Administrator

mbaran@stanford.edu

650-725-3664

 

Platinum etchant

Hi all,
Does anyone know if there is a platinum etchant in SNF?
I googled and people used to make solution with 7HCl:1HNO3:8H2O at 60
deg.
Is there pre-mixed etchant? Also I'm wondering whether the etchant
could remove oxide underneath the platinum which should be avoided.
Please let me know best process for patterning platinum rather than
lift-off.
Thanks.

Cheers,
Joongsun

Comment p5000etch SNF 2008-04-08 15:09:16: Update

Still unable to contact Applied Materials.

Today's Lab/Building Evacuation

Dear Labmembers and Building Occupants --

Around 10:30 today, the fire alarm/building evacuation alarms went off.
The problem was found to be caused by a break in a water pipe located
above three toxic gas sensor modules in a CISX lab. The sensors were
shorted or damaged, thereby activating the automatic toxic gas alarm
system. This appears to be related to the flooding incident yesterday.
We apologize for the disruption, but please be assured that the toxic
gas monitoring system is working as it should.

Just as a reminder, when the evacuation fire alarm sounds, you should
leave the building through the nearest exit and meet at the Evacuation
Assembly point. If you leave the premises, make sure to let someone
know. And you must not re-enter the building until cleared to do so by
Response Personnel. And although today's incident proved not to be a
safety issue, we want to remind everyone of the serious hazards in this
building and to treat every alarm as if it were the real thing.

Again, many apologies for the disruption -- and thanks for your cooperation.

Your SNF staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Fwd: J.A. Woollam Co. - Short Course Announcement

>Dear J.A. Woollam Customers,
>
>We would like to invite you to our next Standard WVASE32 Short
>Course to be held June 16-19, 2008 at Vanderbilt University in
>Nashville, Tennessee, USA. I have attached a course description and
>registration form. If you are interested, please fill out the
>registration form completely and fax back to me at +1(402)-477-8214
>by May 16, 2008. Once I receive your registration form, I will send
>a confirmation email.
>
>This course will focus on data analysis methods for spectroscopic
>ellipsometry with a significant amount of "hands-on" computer time.
>For this reason, participants should be familiar with WVASE32 software.
>
>For those of you who also use the software program VASEManager, we
>are tentatively planning an additional day of training on Friday,
>June 20th focusing solely on VASEManager. If you do not currently
>use this program, you do not need to attend this additional day.
>Participants interested in VASEManager training will be contacted as
>soon as we have received adequate interest to insure holding this
>additional training day. Please indicate on your registration form
>if you would like to attend the VASEManager training.
>
>If you have any questions, please feel free to contact me.
>
>Sincerely,
>
>Veronica Inlow
>
>
>*******************************
>Veronica Inlow
>Marketing Coordinator
>J. A. Woollam Co., Inc.
>645 M Street, Suite 102
>Lincoln, NE 68508
>vinlow@jawoollam.com
>Phone: (402)477-7501 x101
>Fax: (402)477-8214

Micronic move out of lab

Hello All,
Just an update to let everyone know that the micronic will be moving
form its home on Thursday. The route has changed slightlyit will still
go down the SVG coater aisle and then turn left and out the drytek 2
aisle and left again between Epi and Tycom and out to the dock. This is
to pervent bumpy bump on the blue floor. Sorry for any disruption and
thanks in advance for your cooperation. ted

This morning's flood in CIS-X ....

SNF Lab Members:

As a number of you know, this morning there was a flood in CIS-X due to
a rupture of a 2" process cooling water line in the Harris lab that
quickly spread to the Nishi lab and others.

A number of SNF staff members including Mike Dickey (always first on the
scene ....), Jim McVittie, Gary Sosa, Ray Seymour, Ed Myers, and Mary
Tang .... as well as a number of students, the entire ABM contingent,
and likely others that I've omitted .... worked hard to mop up the
mess. So, if you thought the staffing in the lab looked a little light
this morning, that is why. But thanks to all who helped with the mop up
operation.

This should also be a good reminder to all of us .... some of these
building facilities can "go" at any time. Such a break in a water line
can be an EXCEEDINGLY hazardous situation .... particularly in terms of
possible electrical hazards. Any flooding situation should be
approached with great caution because of possible live electrical
circuits. This should also be a reminder to us to take a critical look
on our lab floors .... it is all too easy to end up with live electrical
equipment on the floor which can greatly increase the likelihood of a
shock hazard. This moring there was standing water at least 2 cm deep
just a few minutes after the line ruptured. How many of our labs have
energized power strips sitting on the floors?

I suggest that this would be a good time to look at some of those things
and improve our overall electrical safety before the next major flood
condition.

Thanks for your continued support,

John

Re: Security alert

I have seen many times these kids outside our building and chased them
away. We have to be very firm in not allowing them to use CIS steps
for skateboarding.

Krishna
---------

On Apr 5, 2008, at 5:20 PM, Eric Perozziello wrote:
>
> Today I noticed several of the skateboard kids inside of the
> building. They claim to be "just using the bathroom" but I
> observed them inside of individual cubicle areas.
>
> Please keep your eyes open...
>
> Thanks
> -Eric
>
>

Re: Security alert

As a follow up to Eric's note of yesterday: This morning I found
marker-pen graffiti on the partition walls of the men's room closest to
the skateboarder's "jumping area". While I know that correlation does
not constitute proof and that skateboarding is not a crime, it seems
mighty strange that graffiti would appear on the same afternoon,
particularly when the building is nominally locked.

I've cleaned up the graffiti, but would encourage folks entering the
building to not allow unknown persons to "tail gate" as they enter the
building, unless you know them, when the building is otherwise locked.
There are simply too many valuable things laying around if someone is
intent on looking for them.

Of course we should all be conscious about not leaving wallets,
cellphones, laptops, and other valuables in places where they can be
easily stolen.

Thanks for you attention,

John

Security alert

Today I noticed several of the skateboard kids inside of the
building. They claim to be "just using the bathroom" but I
observed them inside of individual cubicle areas.

Please keep your eyes open...

Thanks
-Eric

E341 MEMS Fabrication Class at SNF

Hi everyone!

It's that time of year again -- E341 begins in the lab next week. For
those who aren't familiar with this, E341 is a hands-on lab class where
students learn first hand how to run and are qualified on the equipment
at SNF needed to fabricate cantilevers. The formal training sessions in
the lab will be scheduled as follows:

Tuesdays/Thursdays - 1 pm - 5:30 pm
Wednesdays/Fridays - 8 am -12:30 pm

The class syllabus is aggressive -- we ask for your patience in
supporting these students -- they will be your fellow labmembers very
soon! If you have any questions, comments, or suggestions, please let
Staff know. The head TA for this term is Roozbeh Parsa (rparsa). If
you would like to learn more about this class, check out the website
at:

http://memsed.stanford.edu/e341/Main_Page

Thanks for your attention --

Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Mask Layout Clinic, Monday, 4/7, 3 pm

Greetings Labmembers:

Bill Martin -- who gave the excellent presentation about mask design a
few weeks ago -- will be here at SNF on Monday, April 7, at 3 pm. Bring
your mask layouts, maskmaking request forms, and mask questions -- he's
generously agreed to be on-hand to answer your questions. We'll also
have an intro to LEdit CAD layout session for anyone interested. We'll
be in or near the bullpen/cubicle area (between CIS 136 and CIS 143)
from 3 pm on.

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

ASM-L 3-D Align Install Rescheduled

Hi All

The 3-D align installation originally scheduled for the week of 4/7
through 4/11 and 4/14 through 4/18 has been rescheduled. The new
schedule is 4/14 through 4/18 and 4/21 through 4/25. Schedules have
been posted outside the lab and at the stepper. The stepper is up and
available for 4" wafer processing through next week.

Thanks.. Gary

Comment p5000etch SNF 2008-04-03 13:43:43: Update

New parts will arrive tomorrow. Field service will come in after they receive the parts.

ASM-L Stepper Status 4/3/2008

Hi All

The planned ASM-L demo for this week has been scratched(4/3 and
4/4). The stepper is configured for 4" wafer processing. All staff
reserevations for today and tomorrow have been removed and the tool is
ready for use.

Thanks.. Gary

Micronics Moving Out of the Lab

Hello All,
Just to let everyone know the Micronic will most likely be moved
out of the lab next Thursday. This may caouse some slight disruption as
it moves from its room down the aisle with SVG coater L102 to L100 and
out the door to the bumpy hallway. Thank you all for your understanding
and cooperation ted

Comment p5000etch SNF 2008-04-03 08:55:38: Update

Field service will replace a DI/DO and an opto board. They areordering the boards. Will update on the availability of the parts.

Comment p5000etch SNF 2008-04-02 19:03:41: Update

Field service will be in around 7:30pm to work on Chamber A lift problem and Ch. B electromagnet problem.

ASM-L Demo Update 4/2

Hi All...

The 8" demo scheduled for this week( 4/2 through 4/4 ) is currently
on hold. The tool is still configured for 4 inch wafers and is
available for use until 8:30 tomorrow morning(4/3). We will keep you
posted on any more changes in status or schedules.

Thanks.. Gary

Comment p5000etch SNF 2008-04-02 12:00:58: CH. C process quals run

Used two wafers 1) 3612 PR on Si with resolution mask and 2) blank themal ox wafer.
Results for 1; Si etch rate 2280A/min, PR etch rate 522A/min, selectivity Si:PR = 4.4:1
Results for 2; we need thicker themal ox (or the ox etch rate is more than 930A/min)

Re: Comment p5000etch SNF 2008-04-02 08:27:29: Update Ch.C

Process qual run. See comments.

Next SNF Process Grand Rounds, Friday, 4/4

Hi all --

Another Process Grand Rounds, scheduled for this Friday, 4/4, at 11:30,
in CIS 101. Lunch provided. Agenda:

1. Process Clinic: Everyone helps brainstorm process issues posed by
labmembers. If you've got a process flow problem or question, please
bring it to share with your fellow labmembers.

2. Quality Circle Update: Student representatives for each functional
area quality circle will present a brief summary of the first meetings.

3. Superuser plan: Based on the Quality Circle discussions, come up
with a proposal for the SNF Superuser program.

All labmembers and staff members are welcome. Hope to see you there!

Your SNF staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Comment p5000etch SNF 2008-04-02 08:27:29: Update Ch.C

Process 2 wafers using "Jim trench" recipe with no problems. Need to run qual.

Comment p5000etch SNF 2008-04-02 07:36:11: Update

Robot calibrations to the cassette , storage elevator chambers B and C have been doone. Chamber A and C pumps are not pumping down. Tried to run a process through Ch.B but it faulted for the magnet current. Looks like the electromagnet power supplies are not turning on. Will investigate.
Field service will be back today to work on the Ch.A lift problem.

Comment p5000etch SNF 2008-04-01 15:04:56: Update

Field service installed a new hard drive and reloaded all recipes. He will verify robot calibrations.

Ag dry etch recipe?

Hello labmembers -

Does anyone know of a well-controlled dry etch recipe for Ag?  Also, does anyone know of a good wet etch chemistry yielding low etch rates (~10 nm/minute or so) for Ag?  I'd appreciate any advice on the matter.

Cheers!

 - Aaron


--
Aaron Hryciw
Postdoctoral Scholar
Geballe Laboratory for Advanced Materials
Stanford University
476 Lomita Mall (04-490)
McCullough Building, Rm. 325
Stanford, CA 94305-4045

Tel.: (650) 723-5840
Fax.: (650) 736-1984