Monday, October 31, 2011

Precious Metals Charging Policy Change

SNF Lab Members,

Starting tomorrow (11/1/11), SNF will begin charging for SNF purchased
precious metal used in our metal systems (Innotec, Metallica,
Intlvac_Evap and Intlvac_Sputter).

Please note the cost of the precious metals will not fall under the cap
and will be added as an additional charge each month.

We expect to purchase over $300,000 in metals this year and the cost
needs to be passed on to the users of those metals. Users will weigh
targets before and after usage and log those values in the logbook and
on Coral. Coral will require both weights before allowing users to
disable the metal deposition system.

We will be charging the metals at the spot price SNF paid. We will
update the charges as new batches of metals are purchased and released
for use. Currently, the metal price we paid results in a billing rate of:
Gold: $47.40 per gram
Platinum: $63.12 per gram
Palladium: $25.96 per gram
Iridium: $41.86 per gram

For reference a 100nm deposition requires approximately 4.5 grams of gold.


Coral is set up to input all metals used in the systems. Please weight
all of your targets and sources and input the data into Coral. We have
scales on order for each metal system, but they have not arrived. Until
the new scales arrive, please us the scale located on the Innotec work
bench for weighing your metals.
(Please report any Coral glitches, error or bugs that you see to me so
we can document them and get them addressed)

For the next four Mondays in November we will reserve extra time in our
Process clinics (2:00pm in the area near Mahnaz's desk) for users who
would like to talk about moving their processes to other metals.

Regards,
SNF Staff

Re: Shutdown p5000etch SNF 2011-10-31 05:28:59: tie in

Tie in compplete

Shutdown p5000etch SNF 2011-10-31 05:28:59: tie in

Down for flow meter tie in

Friday, October 28, 2011

Looking for Karlsuss Mask with Disks

Hi Labmembers,

I wondering if someone has a mask with disk structures around 2-25um (chrome disks, clear field). I'd like to use it with Karlsuss for a few samples.

Thanks,

Robert Chen
Electrical Engineering Ph.D. Candidate
Harris MBE Group, Stanford University
http://robochen.web.stanford.edu

Thursday, October 27, 2011

Re: Shutdown p5000etch SNF 2011-10-27 13:50:16: wafer stuck in Ch A

Recovered wafer from chamber A and adjusted sensor for
lifter position.

Shutdown p5000etch SNF 2011-10-27 13:50:16: wafer stuck in Ch A

2ND ANNOUNCEMENT: Ebeam Lab Town Hall Meeting Friday October 28th 2011 2:00 to 4:00 PM Packard 202 MOHAMMAD ALI MOHAMMAD -- NANOSCALE E BEAM PROCESSING AND APPLICATIONS and Carl Zeiss Microscopy

Greetings Raith Users and Members of the Stanford Ebeam Community:

Note: we have extended the meeting until 4:00 PM as we have a second speaker wishing to present in addition to our Visiting Speaker.

 The Ebeam Lab Town Hall Meeting will be held this Friday October 28th 2011 2:00 to 4:00 PM in Packard 202. Light refreshments will be served.

We have a very special guest visiting us at Stanford this Friday afternoon, and we hope you will be able to join us for his presentation. Everyone is welcome to attend.
Our Visiting Speaker is Mohammad Ali Mohammed from the National Institute for Nanotechnology whom will be speaking on 'Nanoscale Electron Beam Resist Processing and Applications'  from 2:10 till 3:00 PM.
After Mohammad's presentation we will have ample time for your Questions.

Our second speaker is Bill Thompson from Carl Zeiss Microscopy, formerly Carl Zeiss SMT, whom will present an update on the Orion He Ion Microscope for Imaging, Lithography, and Nanofabrication.
This presentation will start at 3:15 PM and we will wrap up the meeting with Questions and Answers by 4:00 PM.

All are welcome to attend and you may forward this message to your group members.

Thank you for your interest in Beam Technologies for Nanolithography here at Stanford,


James Conway
Ebeam Technology Group
Stanford Nanofabrication Facility


The final Agenda and both abstracts for your review are attached.



 

VISITING SPEAKER

 

Mohammad Ali Mohammad

National Institute for Nanotechnology

Edmonton, Canada

 

Nanoscale Electron Beam Resist Processing and Applications

 

Ebeam Town Hall Meeting
2:00 PM – 4:00 PM
 Friday, October 28, 2011

Packard 202

 

Electron beam lithography (EBL) is the technology of choice for fabricating nanostructures and devices at the 10 nm scale and below.  In addition to careful selection of materials, co-optimizing the EBL exposure and development stages are critical for achieving ultimate resolution, high throughput, and low line edge roughness.  In this presentation, nanopatterning with popular EBL resists PMMA, ZEP, and HSQ is discussed.  In particular the role of the development stage is highlighted and various processing strategies are presented. The capabilities and limitations of each resist are discussed in the context of fabricating nanoscale devices.  Various fabrication approaches for realizing sub-10 nm silicon carbon nitride (SiCN) doubly-clamped cantilevers are presented.  In addition, the role of modeling tools for enhancing the fabrication process is also presented.  Selected high-impact projects from various application areas involving EBL processing at the University of Alberta Nanofabrication facility will also be shown.

 

    


Re: Problem p5000etch SNF 2011-10-26 15:12:31: Chamber B is down for turbo controller

Found a loose plug at the back of the controller.

Re: Comment p5000etch SNF 2011-10-26 11:44:52: Ch.B is down for broken wafer

The wafer was chipped before it went into the chamber. It broke during clamping.

Wednesday, October 26, 2011

Re: Shutdown p5000etch SNF 2011-10-26 17:50:35: Cassette Cassette A sensed as unclamped even though clamped

Repaired broken wire on cassette A clamp position sensor.

Re: Problem p5000etch SNF 2011-10-26 17:47:26: Machine can not load wafers

Repaired broken wire on cassette A clamp position sensor.

Shutdown p5000etch SNF 2011-10-26 17:50:35: Cassette Cassette A sensed as unclamped even though clamped

Cassette A is sensed as unclamped even though it's clamped, so no processing can be accomplished since machine just errors out and won't even take the wafers in.

Problem p5000etch SNF 2011-10-26 17:47:26: Machine can not load wafers

Problem p5000etch SNF 2011-10-26 15:12:31: Chamber B is down for turbo controller

Using phosphorus spin on dopant

Dear Labmembers,

Does anybody have experience of using phosphorus spin on dopants (SOD)? I have the P509 SOD (~ 10% Phos) from Filmtronics. Here is the process flow that I've tried on epi-Ge substrates:

1. Coat : 3000rpm for 10s
2. Bake : 200C, 2 mins on a hotplate
3. RTP : 600C, 10s, Forming Gas ambient
4. SOD removal : 6:1 BOE, 2 min.

Few issues that I'm facing right now:

1. The SOD film develops some cracks after baking.
2. It's hard to remove the SOD film after RTP. Even a longer BOE clean doesn't seem to get rid of all the residue.

Any suggestions/tips on how to work with this SOD will be much appreciated!

Thanks,
Suyog

Comment p5000etch SNF 2011-10-26 11:44:52: Ch.B is down for broken wafer

Missing Kindle in SNF

Hi Labmembers,

Has anyone seen or picked up an Amazon Kindle somewhere in SNF this week? It was left in SNF Saturday night.
Please email me if you know where it might be! 

Thanks,

--Katie

Tuesday, October 25, 2011

Re: Problem p5000etch SNF 2011-10-25 13:52:57: cannot select chamber

explained to user that she neded to log into the tool.

Problem p5000etch SNF 2011-10-25 13:52:57: cannot select chamber

When I select Chamber B --> Monitor Chamber, "Access denied" is shown on the screen.

Re: Problem p5000etch SNF 2011-10-24 18:53:09: My wafer stuck inside,

Recovered the wafer. Cycle wafers without problems.

TODAY: Stanford Optical Society Fall BBQ

You are cordially invited to the Stanford Optical Society's Fall BBQ,
which will be held TODAY, the 25th of October, in the CIS-X patio at
4:00pm. Please see attachment for invite and map.

Re: Shutdown p5000etch SNF 2011-10-24 18:54:25: one wafer stuck inside

recovered user's wafer

Monday, October 24, 2011

Re: Individual Tool Shutdowns over the next two weeks

Hi all --

Just to clarify, as several people have asked: the tool shutdowns
described below are for ONE DAY only as indicated, for pre-renovation
construction work on the water lines.

M

On 10/21/2011 4:08 PM, Mary Tang wrote:
> Dear labmembers --
>
> Pre-renovation construction begins Monday. One project will involve
> shutting down the process cooling water in different fingerwalls
> throughout the lab. Individual tools have been reserved according to
> the project schedule; we'll do our best to keep everyone informed of
> changes. The schedule for shutdown is as follows:
>
> Monday, 10/24 - tylans1-4, fga2 bank
> Tuesday, 10/25 - tylannitride, tylanbpsg, tylansige, teos2, tylanpoly,
> thermcolto, thermcopoly1/2, thermconitride1, thermco1/2
> Wed. 10/26 - drytek2, pquest, amtetcher
> Thur, 10/27 - lampoly, intlvac_evap, intlvac_sputter, tel
> Fri, 10/28 - stsetch, drytek4, mrc
> Mon, 10/31 - gryphon, innotec, p5000etch
> Tue, 11/1 - stsetch2, matrix, metalica, sts dep, savannah, fiji-l/r
> Thur, 11/3 - asml
>
> The contractors will begin work on the cooling water lines at 7 am and
> expect to end by 3 pm each day. Staff may need to shutdown tools
> earlier to prepare for the work and may need extra time to bring them
> back up afterward, depending on the individual tool. Updates for
> individual tools will be posted on Coral.
>
> Thanks for your patience -- after two years of planning, renovation
> construction begins!!
>
> Your SNF staff
>
>

Shutdown p5000etch SNF 2011-10-24 18:54:25: one wafer stuck inside

I finished my process with chamber B. After that one of my wafer was stuck inside and it shows that its in load lock but I couldn't see it there.Aafter that I heard a crashing sound from the system. I shut down the system.

Problem p5000etch SNF 2011-10-24 18:53:09: My wafer stuck inside,

I finished my process with chamber B. After that one of my wafer was stuck inside and it shows that its in load lock but I couldn't see it there.Aafter that I heard a crashing sound from the system. I shut down the system.

Fwd: FW: Technical Information on NR71-1000PY, NR71-1500PY, NR71-3000PY, NR71-6000PY, RD6 and RR41.

Hello all, 
I was wondering if anybody in the lab has any experience with NR71 resist and if they have a small bit (less than 2-3 ml) that I could borrow before I order some that will come in.  
thanks,
Mehdi

 

Please find enclosed Technical Information on Negative Resists NR71-1000PY, NR71-1500PY, NR71-3000PY and NR71-6000PY, Resist Developer RD6 and Resist Remover RR41. 

NR71-1000PY, NR71-1500PY, NR71-3000PY and NR71-6000PY are designed for lift-off applications, when temperature of resist pattern during metal deposition may exceed 100°C.

Lift-off with NR71-series resists is carried out in heated resist removers such as RR41.

If you feel that further assistance is needed please do not hesitate to contact me at your earliest convenience.

 

E-mail: zpsobczak@futurrex.com
www.futurrex.com




--
Mehdi Javanmard, PhD
Engineering Research Associate
Stanford Genome Technology Center
(510)364-5147

ANNOUNCEMENT: Ebeam Lab Town Hall Meeting Friday October 28th 2011 2:00 to 3:30 PM Packard 202 -- VISITING SPEAKER: MOHAMMAD ALI MOHAMMAD -- NANOSCALE ELECTRON BEAM PROCESSING AND APPLICATIONS

Greetings Raith Users and Members of the Stanford Ebeam Community:

Our next Ebeam Lab Town Hall Meeting will be held this Friday October 28th 2011 2:00 to 3:30 PM in Packard 202. Light refreshments will be served.

We have a very special guest visiting us at Stanford this Friday afternoon, and we hope you will be able to join us for his presentation. Everyone is welcome to attend.

After Mohammad's presentation we will have ample time for your Questions and to get updated on Ebeam Lab activities.  The Agenda is still open for your additions.

James Conway
Ebeam Technology Group
Stanford Nanofabrication Facility




 

VISITING SPEAKER

 

Mohammad Ali Mohammad

National Institute for Nanotechnology

Edmonton, Canada

 

Nanoscale Electron Beam Resist Processing and Applications

 

Ebeam Town Hall Meeting
2:00 PM – 3:30 PM
 Friday, October 28, 2011

Packard 202

 

Electron beam lithography (EBL) is the technology of choice for fabricating nanostructures and devices at the 10 nm scale and below.  In addition to careful selection of materials, co-optimizing the EBL exposure and development stages are critical for achieving ultimate resolution, high throughput, and low line edge roughness.  In this presentation, nanopatterning with popular EBL resists PMMA, ZEP, and HSQ is discussed.  In particular the role of the development stage is highlighted and various processing strategies are presented. The capabilities and limitations of each resist are discussed in the context of fabricating nanoscale devices.  Various fabrication approaches for realizing sub-10 nm silicon carbon nitride (SiCN) doubly-clamped cantilevers are presented.  In addition, the role of modeling tools for enhancing the fabrication process is also presented.  Selected high-impact projects from various application areas involving EBL processing at the University of Alberta Nanofabrication facility will also be shown.

 

    

ME PhD Oral Examination - Dong Rip Kim (1pm, 10/28/2011, Nano Bldg. 232)

Ph.D. Dissertation Defense

Characterization and Optimization of Silicon Nanowires

for Biosensing and Photovoltaic Applications 

Dong Rip Kim

Department of Mechanical Engineering

Advisor: Prof. Xiaolin Zheng

Time: Friday, 28th October 2011, 1pm (Refreshments at 12:45pm)

Venue: Center for Nanoscale Science and Engineering (Nano Building)

Conference room # 232

Research Abstract

One-dimensional nanowires, due to their excellent electrical, optical, and chemical properties, and large surface to volume ratios, offer the promise of producing revolutionary advances in many areas of technology. This study investigates two application examples of Si nanowires (SiNWs) in the areas of biosensing and solar cells, respectively.

First, SiNWs have been highlighted as real-time, label-free, multiplexing, and femtomolar level accuracy biosensors. However, SiNWs are frequently placed on the bottom wall of a microfluidic channel in the sensing process where the convection velocity is almost zero such that the performance of SiNW biosensors is restrained by the analyte transport. Moreover, although the sensing is carried out in a microfluidic environment where the charged analytes coexist with charged ions of the electrolytic solution, efforts are lacking in understanding the effects of charged ions in the electrolytic solution on the sensing performance of SiNWs. Herein, this study focuses on the characterization and optimization of microfluidic sensing environment for SiNW biosensors in terms of the response time, sensitivity, and selectivity. Our numerical studies suggest that the diffusive analyte transport currently limits the response time of SiNW biosensors. Through microfluidic optimizations, about 17.4 times faster response time and doubled sensitivity are achievable in SiNW biosensing. In addition, our experimental investigation shows that SiNWs can also detect ionic movements and distributions other than targeted species inside the microfluidic channel, which can affect the selectivity of SiNW biosensors and lead to false signals.

Second, vertically aligned radial junction Si wire array solar cells can offer the opportunity to use lower grade material to produce efficient solar cells, due to the decoupling of light absorption and charge-carrier collection directions, and enhanced light trapping. Nevertheless, radial junction Si wire array solar cells still face critical challenges such as large junction and surface recombination losses of photogenerated charge carriers due to their inherent large surface area, which is one of the primary reasons responsible for the gap between reported experimental efficiencies (typically below 10%) and the estimated 17% theoretical efficiency. Therefore, we experimentally investigated junction and surface passivation strategies to effectively suppress large junction and surface recombinations of vertically aligned radial junction Si wire array solar cells. The inclusion of intrinsic polycrystalline Si layer between the p-n junction layers increases the efficiency by about 30% by reducing the dark current, and the top amorphous silicon nitride layer improves the efficiency by about 20% due to its combined surface passivation and antireflection effects. With the combination of both passivation layers, the maximum efficiency of our solar cells is improved from 7.2% to 11.0% under AM 1.5G illumination.

Comment p5000etch SNF 2011-10-24 10:17:45: Possible wafer transfer problem?

Kokab reports that the system aborted several times last night as she tried to load a wafer into ChB. It was a regular silicon substrates, but never made it into the chamber. If anyone sees this problem, please describe symptoms on Coral.
Thanks,
Team etch.

Friday, October 21, 2011

Re: no flammable gas

Thanks Yuniarto --

Right now, we should have all gases back online except for germane for
tylansige and thermcopoly1/2. (Epi2 germane is OK.) The toxic gas
detector for this particular cylinder failed so all the gases in the
vault were shut off for a little while.

Let me know if you observe any gas problems.

Mary

On 10/21/2011 9:44 PM, Yuniarto Widjaja wrote:
> FYI, just saw a note from Mary posted on the lab entrance door that some of
> the flammable gas (SiH4, DCS, etc.) are out for the time being. Just
> thought of sending out this email since I didn't see any emails regarding
> this matter. The tools status doesn't seem to be updated yet on coral.
>
> Yuniarto
>


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

no flammable gas

FYI, just saw a note from Mary posted on the lab entrance door that some of the flammable gas (SiH4, DCS, etc.) are out for the time being.  Just thought of sending out this email since I didn't see any emails regarding this matter.  The tools status doesn't seem to be updated yet on coral.

Yuniarto

Renovation Countdown: 55 days!

Labmembers --

Pre-renovation construction begins Monday.... And YOU can help!

CAD Room and SNF cubicle area cleanup- Monday, 10/24: Remove all
personal items from Allen 151 and the SNF cubicle farm. If you are
actively working in the lab and need access to these items, let a staff
member know and we'll make arrangements. Otherwise, anything that is
unclaimed may be disposed of. (Please note that the SNF cubicle area
refers only to the cube farm containing Maureen's office, not the
student office areas.)

Lab bin cleanup - Monday, 12/12: Remove all personal items from the lab
by this time. This includes items in lab bins, WIP racks, shared
storage, personal glass ware shelves, etc. Remember, there will be
heavy construction in the lab, so protect your belongings. Any items
left in the lab may and probably will be removed. Personal chemicals
can remain in flammables cabinets. The chemicals refrigerator, however,
will be without power during part of the renovation so contact staff
about protecting critical chemicals. There will be no lab bin charges
for Dec/Jan; bins will be reassigned when the lab reopens.

Red lockers - If you have a locker, you might want to empty it --
because on 12/15, the locker corridor will become the staging area for
lab construction and will be blocked.

Any questions or concerns, let us know -- plans are coming together, but
there are no doubt many details which still need to be worked out.

Thanks for your attention --

Your SNF Staff


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Individual Tool Shutdowns over the next two weeks

Dear labmembers --

Pre-renovation construction begins Monday. One project will involve
shutting down the process cooling water in different fingerwalls
throughout the lab. Individual tools have been reserved according to
the project schedule; we'll do our best to keep everyone informed of
changes. The schedule for shutdown is as follows:

Monday, 10/24 - tylans1-4, fga2 bank
Tuesday, 10/25 - tylannitride, tylanbpsg, tylansige, teos2, tylanpoly,
thermcolto, thermcopoly1/2, thermconitride1, thermco1/2
Wed. 10/26 - drytek2, pquest, amtetcher
Thur, 10/27 - lampoly, intlvac_evap, intlvac_sputter, tel
Fri, 10/28 - stsetch, drytek4, mrc
Mon, 10/31 - gryphon, innotec, p5000etch
Tue, 11/1 - stsetch2, matrix, metalica, sts dep, savannah, fiji-l/r
Thur, 11/3 - asml

The contractors will begin work on the cooling water lines at 7 am and
expect to end by 3 pm each day. Staff may need to shutdown tools
earlier to prepare for the work and may need extra time to bring them
back up afterward, depending on the individual tool. Updates for
individual tools will be posted on Coral.

Thanks for your patience -- after two years of planning, renovation
construction begins!!

Your SNF staff


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: Comment p5000etch SNF 2011-10-17 09:24:32: Ch.A now working

archived

Thursday, October 20, 2011

Wednesday, October 19, 2011

seminar next Monday 4-5 on next-gen PV

All,

Greg Nielson of Sandia - Albuquerque will be giving a seminar on
Sandia's microsystems-enabled PV project. See the attached flyer.

Allen 101X Auditorium, 4-5.

Roger

Problem p5000etch SNF 2011-10-19 13:49:49: CH A DETECTED HT EX FAULT

Tuesday, October 18, 2011

Potential Suppliers for Silicon Wafers with P-N Pattern

We need a silicon wafer with a large number of exposed lateral p-n junctions (10-100nm wide) on the surface of the wafer. The actual pattern is not so important but a simple design we could think of, was alternating p and n strips that extend laterally on the wafer surface (the longer the strips, the better), i.e. if you were to look on our wafer from the top, you should see a "zebra" pattern of p and n. In other words, the top view should look similar to the cross-section of a different wafer which has stacked p and n layers vertically. Dopant and orientation are not particularly important.

Do you know of any suppliers that would be able to fabricate this?

Thanks,
Yannis

Keyence Microscope Demo Wednesday 4:15 in Allen 101

Hi Everyone,

Keyence will be doing a demo of their digital microscopes tomorrow (Wednesday) at 4:15 in Allen 101.

I have requested a demo for two products: VH-Z500 (500x-5000x) and VH-Z100 (100x-1000x).  We hope they can demonstrate the imaging of some NEMS/MEMS devices while they are here, so perhaps bring some of your own devices if you are curious about their capabilities.   

For more information about Keyence's lenses: http://www.digitalmicroscope.com/solutions/vhx1000_lens/rzlens.php

Best,
Kim

Gram gauge for wirebonder force calibration?

Hi Labmembers -
Does anyone have a gram gauge that I could borrow to calibrate the force applied by a wirebonder? I'm using a Westbond 7400E to wirebond thin (50nm) metal bondpads, and the tool has a tendency to punch through the electrode and short to another layer below it. I've tried adjusting the power/time and switching from ultrasonic to thermocompression/thermosonic to no avail. If you have a gauge or experience working with thin bondpads please let me know. Thanks!

- joey

Monday, October 17, 2011

Re: Problem p5000etch SNF 2011-10-17 17:30:35: CH B AND CH C OFFLINE

Put chamber B and C online..

Problem p5000etch SNF 2011-10-17 17:30:35: CH B AND CH C OFFLINE

I was able to use Ch. A but not B and C

Cell Phone Found in the Ladies Bathroom on 1st Floor Across from the Gowning Room of the Lab

Dear All,

 

A cellular phone was found in the ladies room on the first floor of the Allen Building across from the entrance to the lab.  If it’s yours please come and pick it up from me.  I’m in cubicle # 41.  I’m closest to the side doors facing the construction site.

 

Thank you,

 

Maureen

Re: Problem p5000etch SNF 2011-10-16 16:18:18: Ch A stopped process

Re: Problem p5000etch SNF 2011-10-14 19:18:13: CHA Won't start process

Comment p5000etch SNF 2011-10-17 09:24:32: Ch.A now working

Elmer reset the heaters which had turned off. Ran 3 wafers without issue after they were up to temperature.

Sunday, October 16, 2011

Problem p5000etch SNF 2011-10-16 16:18:18: Ch A stopped process

the process stopped as soon as it started. Wafer coated with Al has long scratches so maybe gases did start.

Friday, October 14, 2011

Problem p5000etch SNF 2011-10-14 19:18:13: CHA Won't start process

Tried to run CHA METAL. The process won't start at all.

Maskmaking Clinic, Tuesday, 10/18/11

Hi all --

If you have any photomask making questions, you can pose them to an
expert. Bill Martin, who represents the qualified photomask providers
for SNF, will be here next Tuesday afternoon, from 3:15-4:30, to meet
with anyone interested in knowing about masks, how they are made, and
how to purchase them. He will be in the cubicle area next to Maureen's
office.

He can also be reached at: Billm@Compsus.com

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Comment p5000etch SNF 2011-10-14 13:40:53: BCl3 back- check etch rates

Just a heads up that after alot of purging and a test of CH.A METAL the BCl3 is back up.
Please check your etch rates and report any problems.

Re: Comment p5000etch SNF 2011-10-10 15:20:33: Possible BCl3 contamination

archived

Re: Comment p5000etch SNF 2011-10-11 10:33:48: NF3 qual

archived

Re: Comment p5000etch SNF 2011-10-11 13:28:01: Update BCl3

archived

Re: Problem p5000etch SNF 2011-10-13 13:51:28: BCL3

Tests look good. Nice clean etch, pretty trace on end point, clearing at 110 secs.
I did have to turn on the heat exchangers at the start and once they go to temp they turned off for low flow. I turned them back on and they were fine for the tests. Flow showed OK.

Renovation Countdown: 61 days!

Dear labmembers --

Please be reminded that the upcoming SNF renovation begins shortly
-- we need your help!

- CAD Room Storage by Oct. 24: This will become the new maintenance
workshop. Make sure to remove all your personal items from the CAD
room (Allen 151) by Oct. 24. Undated items or Items in boxes dated
> one year have been removed. Items not removed by Oct. 24 are
subject to disposal. If you are from off-campus, are NOW ACTIVELY
working in the lab and require access to your items, let us know and
we will find temporary storage space.

- ASML/SNF Visitor/Consultant Cubicle area by Oct. 24: This area
will be reconfigured to accommodate displaced staff members and
existing occupants. All personal items must be removed so planning
may begin. The area will remain available for use by visitors and
consultants until it is reconfigured, but all personal items should
be removed and stored safely off-site.

Part 2 of the lab storage cleanup will be on Dec. 12. By 9 am, all
personal items must be removed from the lab storage bins and wip racks.
The renovation involves extensive construction on the HEPA's and space
above them, so your personal items will be safer outside the lab. We
also need space to accommodate four new etchers, so storage bins will
be reconfigured and reassigned when the lab reopens.

Just a reminder that construction begins on 12/15/11. Individual tools
will be shut down before then as we stage for the long term shutdown; we
will post plans as they are finalized. The lab will be open for occupancy
on Feb. 1, 2012, but be aware that this is when staff is allowed back
into the lab. There will be a startup period as tools are brought back online.

If you have any questions, please contact any staff member.

Thanks for your attention --

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

STS Dep and Epi shutdown Wed. Oct. 19 for gas tie ins

Hello All,
STSdep and Epi will be shut down on Wed. Oct 19 for gas line tie
ins for the new CCP and ICP tools. Hopefully back up by the afternoon. Ted

Thursday, October 13, 2011

Problem p5000etch SNF 2011-10-13 13:51:28: BCL3

Still waiting for BCL3 gas for Chamber A..

Re: Problem p5000etch SNF 2011-10-12 14:31:31: No BCL3

Installed rebuild turbo controller and ramped up turbo pump
to speed.

Wednesday, October 12, 2011

Problem p5000etch SNF 2011-10-12 14:31:31: No BCL3

Chamber A is down for BCL3 gas cylinder and turbo controller.

Re: Problem p5000etch SNF 2011-10-06 02:15:39: Ch. B down.

Chamber is back up..

Re: Problem p5000etch SNF 2011-10-06 16:55:48: Chamber B turbo controller

Since chamber A is down for BCL3 gas cylinder, removed
the turbo controller and installed at chamber B. Also changed
the quartz clamp(new) on chamber B.

Volunteer Opportunity - Help BGC Students w/ College & Scholarship Applications

** Volunteer Opportunity **

Are you interested in helping high school students at the Boys and Girls Club with their college and scholarship application essays? Having been through the application process successfully, your help is exactly what these kids need! Trust us, you're qualified!!

We're currently seeking volunteer tutors for one-on-one mentoring to help students develop their ideas and personal histories into essays to be used in scholarship and college applications.

Commitment specifics:
*one hour of mentor training
*hour-long sessions with mentee (specific day tbd - please specify availability)
*sessions will be one evening per week
*program will last for the remainder of fall quarter


If you are interested in volunteering or learning more about the program please contact us at rsnyder@stanford.edu (Becky) or andreina@stanford.edu (Andreina). This is a great opportunity to pass on your own experiences and to help others achieve success!


--


Rebecca L. Snyder

Ph.D. Candidate
Department of Bioengineering
Heilshorn Biomaterials Group
Stanford University

Tuesday, October 11, 2011

Comment p5000etch SNF 2011-10-11 13:28:01: Update BCl3

Perfoming test to verify that the BCl3 gas in not contaminated. BCl3 gas line to the cylinder valve leak up rate was good. Gas panel pressure retention test was also good. Next test is to re-install the old cylinder.

Comment p5000etch SNF 2011-10-11 10:33:48: NF3 qual

Since NF3 is primarily used as a cleaning for CH C there is no standard qual for it. Did test amtetcher and results were as expected. This at least indicates that NF3 is NF3. Doesn't say much about delivery to p5000, but it is the correct gas at the cylinder.....

Monday, October 10, 2011

Comment p5000etch SNF 2011-10-10 15:20:33: Possible BCl3 contamination

Investigating the BCl3 line for a possible leak or contamination

Re: Problem p5000etch SNF 2011-10-10 15:18:41:

Problem p5000etch SNF 2011-10-10 15:18:41:

Investigating the BCl3 line for a possible leak or contamination

Re: Problem p5000etch SNF 2011-10-07 14:57:43: Still getting hazy/dusty wfs in CH A

Investigating the BCl3 line for a possible leak or contamination

Re: Etching Away HSQ

2% HF (1:50) like we have on wbnonmetal and BOE will both etch off HSQ.
I normally perform a Piranha clean in the 9:1 H2SO4:H2O2 before the HF
dip to remove organics...

See me if you have questions during my office hours.

James

On 10/9/2011 6:43 PM, Robert Chen wrote:
> Hi Labmembers,
>
> Does anyone have experience etching away HSQ masks patterned using
> e-beam? Looking for recipes, etch rates, and general considerations.
>
> Thanks,
>
> Robert Chen
> Electrical Engineering Ph.D. Candidate
> Harris MBE Group, Stanford University
> http://robochen.web.stanford.edu

RE: Etching Away HSQ

Robert,

 

HSQ is basically a very low quality SiOx after ebeam pattering so HF works great to remove it.  In my previous work in Si photonics this was complicated by the fact that the BOX layer of the SOI wafer was exposed when the HSQ was to be removed.  I found that an SC-1 clean followed by a 4 min dip in 0.125% solution of HF was enough to remove my HSQ etch mask without significantly etching the BOX.

 

How easy it is to remove the HSQ can vary significantly depending on the e-beam dose used and other processes the HSQ will see.  For example annealing the HSQ after development will make it significantly harder to remove.  My HSQ for the process above was exposed with a dose of 1500uC/cm^2 developed by 25% TMAH and used as an etch mask during RIE using HBr as the etch gas before I removed it.

 

Best regards,

Charles

 

From: robertatx@gmail.com [mailto:robertatx@gmail.com] On Behalf Of Robert Chen
Sent: Sunday, October 09, 2011 6:43 PM
To: labmembers@snf.stanford.edu
Subject: Etching Away HSQ

 

Hi Labmembers,

 

Does anyone have experience etching away HSQ masks patterned using e-beam? Looking for recipes, etch rates, and general considerations.

 

Thanks,


Robert Chen
Electrical Engineering Ph.D. Candidate
Harris MBE Group, Stanford University
http://robochen.web.stanford.edu

Sunday, October 9, 2011

Etching Away HSQ

Hi Labmembers,

Does anyone have experience etching away HSQ masks patterned using e-beam? Looking for recipes, etch rates, and general considerations.

Thanks,

Robert Chen
Electrical Engineering Ph.D. Candidate
Harris MBE Group, Stanford University
http://robochen.web.stanford.edu

Saturday, October 8, 2011

SNF Renovation: Lab Storage Cleanup,Part 1-Oct. 24

Dear labmembers --

Please be aware that the upcoming SNF renovation begins in two weeks --
and we need your help!

- CAD Room Storage by Oct. 24: This room will become the new
maintenance workshop. Make sure to remove all your personal items from
the CAD room (Allen 151) by Oct. 24. Undated items or Items in boxes
dated more than one year ago are subject to immediate removal. All
boxes and items not removed by Oct. 24 are subject to disposal. If you
are from off-campus, are NOW ACTIVELY working in the lab and require
access to your items, let us know and we will find temporary storage space.

- Cubicle area by Oct. 24: This area will be reconfigured to
accommodate displaced staff members and existing occupants. All
personal items must be removed so planning may begin. The area will
remain available for use by visitors and consultants until it is
reconfigured, but all personal items should be removed and stored safely
off-site.

Part 2 of the lab storage cleanup will be on Dec. 12. By 9 am, all
personal items must be removed from the lab storage bins and wip racks.
The renovation involves extensive construction on the HEPA's and space
above them, so your personal items will be safer outside the lab. We
also need space to accommodate four new etchers, so storage bins will be
reconfigured and reassigned when the lab reopens.

Just a reminder that construction begins on 12/15/11. Individual tools
will be shut down before then as we stage for the long term shutdown; we
will post plans as they are finalized. The lab will be open for
occupancy on Feb. 1, 2012, but be aware that this is when staff is
allowed back into the lab. There will be a startup period as tools are
brought back online.

If you have any questions, please contact any staff member. Regular lab
renovation updates will be posted on the website starting next week.

Thanks for your attention --

Your SNF Staff

Friday, October 7, 2011

Re: Wet etching TiW?

I used to etch off pallets coated with TiW and Au with heated H2O2 at
40 degrees C followed by Au Anodic etch.
This was on a SLOAN sputter tool.

JWC

On Oct 4, 2011, at 5:35 AM, Suyog Gupta <suyog@stanford.edu> wrote:

> Dear Labmembers,
>
> I was wondering if anybody has tried wet etching TiW? I have about
> 100nm of TiW on Al2O3 that I need to wet etch.
> H2O2 seems to work but the etch rate at room temperature turned out
> to be too slow ~ 3 nm/min. If you have any suggestions, please let
> me know!
>
> Thanks,
> Suyog

Problem p5000etch SNF 2011-10-07 14:57:43: Still getting hazy/dusty wfs in CH A

Cesar wet cleaned the chamber, it pumped down over night. I ran 4 wafers and still got hazy and dusty surfaces. The etches took a bit longer, too, about 20 secs.
Not sure what is going on yet.

Re: Problem p5000etch SNF 2011-10-05 17:04:13: ran ChA qual

ran more wafers. new problem comment posted

Thursday, October 6, 2011

Problem p5000etch SNF 2011-10-06 16:55:48: Chamber B turbo controller

The turbo controller is bad, failure with turbo bearing control.
Will order a replacement turbo controller(340NT Turbotronic).

Re: Shutdown p5000etch SNF 2011-10-06 11:51:47: Ch.A wet clean, Ch.B clamp

Wet cleaned chamber A completed...

Re: Problem p5000etch SNF 2011-10-05 16:14:17: Needs NF3 process qual

Since NF3 is primarily used as a cleaning for CH C there is no standard qual for it. Did test amtetcher and results were as expected. This at least indicates that NF3 is NF3. Doesn't say much about delivery to p5000, but it is the correct gas at the cylinder.....

Shutdown p5000etch SNF 2011-10-06 11:51:47: Ch.A wet clean, Ch.B clamp

Need to replace Ch.B wafer clamp and perform Ch.A wet clean

Re: Comment p5000etch SNF 2011-10-05 21:39:50:

Problem p5000etch SNF 2011-10-06 02:15:39: Ch. B down.

Looks like the previous user's wafer is broken inside the chamber...there are a million pieces everywhere.
Fault: turbo at speed signal went off.

Wednesday, October 5, 2011

Comment p5000etch SNF 2011-10-05 21:39:50:

Problem p5000etch SNF 2011-10-05 17:04:13: ran ChA qual

Used CH.A METAL and wafers cleared at 123 secs for two wfs. However, there was a hazy, almost dust like layer left behind. We need to look into this more.

Re: Problem p5000etch SNF 2011-10-05 11:12:58: Needs a process qual.

ran qual- see next problem....

Reminder: SNF Venture Clinic, today at 5 pm

Dear labmembers --

If you are interested in learning about the whole mysterious
business of venture capital, Gavin McCraley from Morrison& Foerster and
Shahin Farschi from Lux Capital will be on hand to answer your questions.

The Venture clinic will be Wednesday, 10/5 at 5 pm in the Allen 101
conference room and is open to all.

Contact info for our guest hosts:

Shahin Farshchi, Ph.D.
http://www.luxcapital.com
C: 925.323.2784

and

Gavin McCraley
Morrison& Foerster LLP
Direct: 650-813-4105
gmccraley@mofo.com

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Problem p5000etch SNF 2011-10-05 16:14:17: Needs NF3 process qual

Re: Problem p5000etch SNF 2011-09-02 15:02:29: NF3 cylinder almost empty

Replaced NF3 cylinder. Changed the Standby recipe (#2) back to standard settings. Needs a process qual.

Problem p5000etch SNF 2011-10-05 11:12:58: Needs a process qual.

Re: Problem p5000etch SNF 2011-10-05 09:37:34: Wafers stuck in machine

User forgot to load a chamber recipe.

Re: Comment p5000etch SNF 2011-10-04 15:16:01: Broken wafer on chamber B

Archived.

Re: Problem p5000etch SNF 2011-09-27 10:04:33: BCl3 gas low- Ch.A

Replaced BCl3 cylinder. Flowed gas to the tool. Needs a process qual.

Re: Shutdown p5000etch SNF 2011-10-05 10:23:32: Can't manually move wafers

Enabled the system and unloaded the user's wafer.

Shutdown p5000etch SNF 2011-10-05 10:23:32: Can't manually move wafers

User had the wrong chamber specified and no program in specifed slot. I was able to get correct chamber back online (C), but after I manually moved one wafer from the load lock to the cassette ( to start the whole mess over) I got a 'service program running' error.... ??.....

Problem p5000etch SNF 2011-10-05 09:37:34: Wafers stuck in machine

Unfortunately, I selected the wrong sequence selection which resulted in a shutdown of Ch. B.

Tuesday, October 4, 2011

Venture Clinic, Wed, 10/5, 5 pm, Allen 101

Dear labmembers --

If you are interested in learning about the whole mysterious
business of venture capital, Gavin McCraley from Morrison& Foerster and
Shahin Farschi from Lux Capital will be on hand to answer your questions.

The Venture clinic will be Wednesday, 10/5 at 5 pm in the Allen 101
conference room and is open to all.

Contact info for our guest hosts:

Shahin Farshchi, Ph.D.
http://www.luxcapital.com
C: 925.323.2784

and

Gavin McCraley
Morrison& Foerster LLP
Direct: 650-813-4105
gmccraley@mofo.com

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Comment p5000etch SNF 2011-10-04 15:16:01: Broken wafer on chamber B

Vented chamber B and removed broken wafer, also rechanged
one of the small lips seal.

Re: Problem p5000etch SNF 2011-10-03 22:44:29: wafer stuck in chamber B

recovered the user's wafer. cycled 8 wafers with no problems.

Re: Wet etching TiW?

Heat to 40 or 50 C for greater rate is standard.
Resist adhesion may be an issue, re-bake on a hot plate just before etch and repeat if you dry it off for inspection and then etch more.

jim


From: Suyog Gupta <suyog@stanford.edu>
To: labmembers@snf.stanford.edu
Sent: Tuesday, October 4, 2011 5:35 AM
Subject: Wet etching TiW?

Dear Labmembers,

I was wondering if anybody has tried wet etching TiW? I have about 100nm of TiW on Al2O3 that I need to wet etch.
H2O2 seems to work but the etch rate at room temperature turned out to be too slow ~ 3 nm/min. If you have any suggestions, please let me know!

Thanks,
Suyog


Wet etching TiW?

Dear Labmembers,

I was wondering if anybody has tried wet etching TiW? I have about 100nm of TiW on Al2O3 that I need to wet etch.
H2O2 seems to work but the etch rate at room temperature turned out to be too slow ~ 3 nm/min. If you have any suggestions, please let me know!

Thanks,
Suyog

Monday, October 3, 2011

Problem p5000etch SNF 2011-10-03 22:44:29: wafer stuck in chamber B

Robot seemed unloaded the wafer from chamber B and the symbol of complete processed wafer appeared in the transfer cassette but there isn't a physical wafer on the transfer cassette.

Re: Problem p5000etch SNF 2011-09-23 16:31:48: Ch B Process Stopped

Re: Problem p5000etch SNF 2011-10-03 12:00:39: Process keep stopping

Problem p5000etch SNF 2011-10-03 12:00:39: Process keep stopping

The last time the process was stopped because for some reason the heat exchanger was turned off. The exact same thing happened again today (process topeed at the same position), but the staff is currently not around.
A wafer is currently inside chamber A. The sample box is left on the machine, with name jpmailoa on it. (Please put it in there if someone can take it out)

PhD Oral Examination - Design and Fabrication of Nanostructures for Light Manipulation in Solar Cells and MicroElectroMechanical Systems (Mon. Oct10, 3:00pm, CIS-X 101)


Department of Applied Physics
University PhD Dissertation Defense

Design and Fabrication of Nanostructures for Light Manipulation in Solar Cells and MicroElectroMechanical Systems

Shrestha Basu Mallick
Research Advisor: Professor Mark Brongersma

Monday October 10, 2011 @3:00 pm
(Refreshments served @2:45 pm)

Location: Allen Building, (Formerly CIS-X), Room 101

ABSTRACT
This talk is about nano-structuring of semiconductor devices for the improvement of their optical properties. The phenomenon of guided resonances in photonic crystal (PC) slabs will be discussed and ways of engineering these guided resonances for a variety of applications such as improved reflectivity in micro-electro-mechanical (MEMS) mirrors and increased absorption in thin-film solar cells will be discussed.
The first part of the talk will focus on the application of PCs in MEMS. A new process (GOPHER) that was developed to make low stress PCs out of monolithic silicon will be discussed. The advantage and ease of making multilayer PCs with Gopher will be illustrated and experimental results showing Gopher structures having spectra with broadband reflectivity (suitable for mirror applications) as well as sharp peaks ( suitable for sensors) will be presented. Other applications of Gopher such as making waveguides etc will be briefly discussed.  The integration of a high quality PC mirror with a 1D resonant MEMS scanner will be demonstrated. Finally, the results of fabrication of a prototype wafer-scale encapsulated optical device will be shown. The Gopher process has a lot of potential for facilitating the integration of micro and nanoscale photonics with CMOS circuitry.

                        The second part of the talk will focus on the application of PCs for light-trapping in solar cells. Thin-film photovoltaics has the potential to reduce cost by reducing the amount of photoactive material required and allowing for the use of material of poorer quality. Crystalline Silicon (c-Si) is an attractive material for photovoltaic cells due to its natural abundance, nearly ideal band gap, and leverage of existing process and materials knowledge. However, the poor optical absorption in the near-infrared spectral range requires the use of very efficient light trapping techniques. One such technique that is explored is to pattern the active layer into a 2D PC.  Electromagnetic simulations are performed to show that an enhancement in integrated short-circuit current by a factor of 3 is possible when compared to a planar slab of equivalent volume. This is because the PC supports guided resonances into which incident radiation can couple which increases the absorption. Finally, the fabrication of an ultrathin c-Si solar cell where the active material is patterned into a square-lattice 2D PC is demonstrated. Both short-circuit current and external quantum efficiency measurements show an enhancement in optical absorption, especially at longer wavelengths. Scanning photocurrent maps confirm the improved optical absorption in the photonic crystal regions. Future applications of nanostructuring to thin-film cells that can be commercially realized will be discussed.

Reminder: Labmembers' meeting today, 2 pm

Dear Labmembers --

Just a reminder that there is a Labmember Community meeting today, at 2
pm, in the Allen X Auditorium. On the agenda:

- Welcome and state of the lab
-12/14/11-1/31/12 lab shutdown/renovation and what it means to you
- New tools in the lab
- New organizational chart
- Lab safety
- Open Q&A

Hope you can make it -- slides will be posted for those who can't.'

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu