Comment p5000etch SNF 2010-05-23 03:56:57: ChA helium leak comparison SSP vs DSP

I have single-side polished and double-side polished wafers with identical stacks... in ChA SSP gets sub 1.0 leak, while DSP are > 1.5 then get hazy/burnt resist around the entire wafer outer radius. all wafers have clean backsides. does that imply clamping force is too high or too low?