Software thinks it's already in the cassette. I tried following the stop and recover procedure outlined in the binder. The last step (return wafers to cassette) didn't seem to work, so the wafer is still on the robot blade.
Was running CH. B. NIT-SPACER on Chamber B for 4 min 35 sec. Have one wafer in the system. Process successfully run. Wafer is double-polished, thickness is around 360um. No resist. 340nm nitride on top of 750nm oxide on back side of the wafer. The other side was just etched and should have no films.
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