Friday, December 3, 2010

EE412 Final Process Presentations, Wed. 12/8, 4 pm, AllenX Auditorium

Dear Labmembers --  Please come hear presentations by members of the EE412 Advanced Nanofab  Processing class.  This is a team-project based course with the aim to  develop, characterize, and document processes of value to the SNF lab community.   Here is the schedule:  
4:00-4:15            Pizza

4:15-4:20            Introduction by the instructors (Profs. Howe and Solgaard)


4:20-4:35            STSEtch2 Profile Characterization
                           Undercut and Notching Elimination for Silicon Etching in STSetch2
                           Lele Wang, Dong Liang and Yu-Shuen Wang

 
4:40-4:55            STSEtch2: High Aspect Ratio Silicon Etching
                           High Aspect Ratio Si Etching in STS2
                           Jaewoong Jeong

 
5:00-5:15            Deep Trench Spray Coating
                           Process for spray coating and ASML patterning in deep trenches
                           Karthik Vijayraghaven

 
5:20-5:35            ALD Nitride
                           Developing ALD Nitride on the Savannah
                           Shingo Yoneoka, Yi-Hsuan Lin, Scott Lee, Chu-En Chang

 
5:40-5:55            ALD Nanolaminates
                           ALD Oxide Nanolaminates
                           Yi Wu, Shimeng Yu, Shuang Li

 
6:00-6:20            ALD Oxides and Germanium Passivation
                           High-k Film on Ge Characterization and Atomic Layer Removal (ALR) of Ge
                           Ze Yuan, Jason Lin, Woo Shik Jung, Ju Hyung Nam

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