As you may know, particles and residue from the svgcoat tracks will
contaminate clean wafers. This not only causes defects on everyone's
wafers, but also can contaminate equipment. The ASML especially, will
fail when particles and residue are transferred to the wafer handling
system, causing bad focus and in severe cases, equipment failure. ASML
users are responsible for inspecting their own wafers before running on
the machine. But all users of the svgcoat and svgdev tracks are also
responsible for their use of those systems.
What you should do on the svgcoat or svgdev tracks:
1. Clean up after yourself, especially if you've dispensed thick
resist or did not use EBR or manually dispensed chemical. Cleaning
up means wiping down chuck, hot plate, and belts as needed. If you
are unsure how to clean, Staff would be glad to show you.
2. For wafers coated on both sides, bake the backside before coating
the frontside and make sure to bypass the hot plate (use an oven
bake.)
3. Inspect the track before you use it and after. If it's in bad
shape before you use it, contact the previous user to clean it up.
Or, clean it up yourself. Or, put it down for Staff to cleanup.
4. Do not use both coat tracks or both develop tracks when someone is
waiting.
Be aware the tracks will be inspected in the morning and evening. If
particles and residue are observed, everyone (yes, everyone) who has
enabled the tool since the last good inspection will be subject to
community service and possible disqualification. Please take a few extra
minutes to inspect the tracks when you are done. Your lab mates and
staff will greatly appreciate it.
Your SNF staff
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu
No comments:
Post a Comment