ASML Presentation on 3D Align - Wed., 7/30, 1 pm CIS 101

Greetings labmembers:

Paul Yick, the ASML site engineer, will be giving a short presentation
about the 3-D align upgrade recently installed and qualified on the ASML
system here at SNF. 3D align, by the way, is a custom feature not
generally available on standard systems and we are fortunate that ASML
has chosen to showcase this capability here.

In brief:

3D-Align is an ASML Enabling Technology that combines Front-side
alignment (FSA) and back-side alignment (BSA). It comprises of a
special 3D-Align exposure table (with embedded optics for wafer
alignment) and the electronics (and software) to route the alignment
signal to the detector.

It is particularly useful for aligning device layers to thick epi, thick
plated metal (in the case of MEMS devices) and color photoresist. It is
cost effective as alignment marks are no longer printed on the
front-side of the wafer & the number of process steps may also be reduced.

Normally, FTFA (Front-to-Front Alignment) is used on critical layers &
BTBA (Back-to-Back Alignment) for non-critical layers. FTBA
(Front-to-Back Alignment) is also a good alternative.

Paul's presentation will be on Wednesday, July 30, at 1 pm in CIS 101.

Your ASML Team

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu