I am inclined now to break up etches longer than 30 seconds into shorter etches and just leave the pump time at whatever the recommended minimum is?
I have been breaking etches longer than 300 seconds into "shorter" etches and always using very long pump times (> 600 seconds ) hoping that that would help with the capacitive sensors and thick dielectric on the front and back of my wafer.
Elmer, do you experience any wafer handling issues from short etches when there is thick dielectric on the front and back of the wafer?
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