Sunday, January 31, 2010

Comment p5000etch SNF 2010-01-31 23:11:00: Chamber C

When running clean recipe on chamber C, is best to use
a brand new bare silicon..

Re: Shutdown p5000etch SNF 2010-01-30 13:54:13: wafer stuck Ch. B

Recovered wafer on blade, the cap sensors is already disable
it lost comunication. I had to reset the SBC pcb and it took a while
before it completely initialized. I checked the handoff from storage
elevator to chamber B and it looks good. I run dummy wafers
w/out problem.

Saturday, January 30, 2010

Shutdown p5000etch SNF 2010-01-30 13:54:13: wafer stuck Ch. B

Error messege saying wafer was not released from chamber B. Wafer was visually seen on handler, and tried to return all wafers to cassette, but gave another error. Will leave tool with full set of wafers in the elevator, and one on the handler.

Friday, January 29, 2010

TiN wet etch?

Dear SNF lab members,

I'm trying to etch Al+TiN layer in my metal contact process, and I know that Al can be removed by the Aluminum etchant without affecting the photoresist. Is there wet etchant that can etch TiN without doing damage to the photoresist areas?

Or do I have to resort to dry-etching?

Thanks,

Wooshik Jung

Thursday, January 28, 2010

Toxic/corrosive gases back on ....

SNF Lab Members:

As several of you are likely aware, SNF and the entire building
experienced three fire alarms last night at about midnight, 12:15 am,
and 12:35 am. All three were induced by a smoke alarm in Allen 213X.
For reasons that are still under investigation, the fire alarm panel was
not reset until a few minutes ago .... which resulted in all toxic and
corrosive gases as well as bulk hydrogen and oxygen gases being turned
off overnight. While Ed Myers was called in at about 2 a.m. last night,
this explains why he was unable to reset the system at that time.

In any event, all gases are back on and tools should be operating
normally this morning. Let us know if you observe any strange equipment
behavior.

Thank you for your continued support,

John

No Gases to FAB

All,

I received a call from work control reporting a Toxic Gas
Alarm. When I arrived, I found all gas cabinets to the fab have been
shut down. There also appears a number of other shutdowns, I don't
understand. As a result I am leaving all the gases off until I have
an understanding of the events.

So, until further notice no gases are available. These include the
epi, dry etch and furnace gases.

Sorry for the inconvenience.

Regards,
Ed

Wednesday, January 27, 2010

Comment p5000etch SNF 2010-01-27 17:09:51: Ch.C

Circular pattern on wafer due to uneven magnetic flux .
Circular pattern is offset.
ran clean recipe with 2 wafer.
problem still there

Tuesday, January 26, 2010

seminar: Tues 2/2 Allen 101X 4-5pm -- Rotary Micromotor Supported on Microball Bearings

Hello fellow labmembers,

Nima Ghalichechian from FormFactor Inc is giving a talk one week from
now. Please see below for details.

=============

Tuesday, Feb 2, 2010
Allen 101X 4:00–5:00pm

Design, Fabrication, and Characterization of a Rotary Micromotor
Supported on Microball Bearings

Nima Ghalichechian, Ph.D.
Senior Principal MEMS Engineer, FormFactor Inc.

Abstract: The design, fabrication, and characterization of a rotary
micromotor supported on microball bearings developed at the University
of Maryland will be presented. This has been the first demonstration of
a rotary micromachine with a robust mechanical support provided by
microball-bearing technology. One key challenge in the realization of a
reliable micromachine is the development of a bearing that would result
in high stability, low friction, and high resistance to wear. A
six-phase, rotary, bottom-drive, variable-capacitance micromotor is
designed, simulated, and fabricated on silicon using benzocyclobutene
low-k dielectric films. A characterization methodology is developed to
measure and extract the angular displacement, velocity, acceleration,
torque, mechanical power, coefficient of friction, and frictional force
through non-contact techniques. A top angular velocity of 517 rpm
corresponding to the linear tip velocity of 324 mm/s is measured.
Measurement of the transient response of the rotor indicated that the
torque is 5.62+/-0.5 micro N-m. Such a rotary micromotor can be used in
developing micropumps which are highly demanded microsystems for fuel
delivery, drug delivery, cooling, and vacuum applications. Examples of
successful applications of this work will be presented.

Bio: Nima Ghalichechian received his Ph.D. in Electrical Engineering
from University of Maryland in 2007. At the MEMS Sensors and Actuators
Lab, he successfully developed rotary and linear electrostatic
micromotors supported on microball bearings. For his Master's research,
Nima developed new MEMS fabrication processes to fabricate an
electrostatic micromotor and performed metal-polymer adhesion and
interface studies. He received his Master's degree in May 2005 with
thesis titled "Integration of Benzocyclobutene Polymers and Silicon
Micromachined Structures Fabricated with Anisotropic Wet Etching". Since
2007, he has been with the MEMS R&D Department at FormFactor Inc,
Livermore, CA where he is involved with design, fabrication, and testing
of the microsprings for advanced wafer-level probe cards.

Monday, January 25, 2010

TUESDAY -- Special seminar: Federico Capasso (Harvard), Tues 1/26 5:15 PM

 

Special Seminar

 

The Bright Future of Sub-Wavelength Photonics:
From Light Manipulation to Quantum Levitation at the Nanoscale

 

Federico Capasso

School of Engineering and Applied Sciences

Harvard University

 

Tuesday, January 26, 5:15 PM, Applied Physics 200

Refreshments at 5:00 PM

Presented by the Stanford Student OSA/SPIE

 

Surface Plasmon Polaritons (SPPs) allow one to achieve concentration of light into sub-wavelength regions thus opening up rich new directions in physical optics and photonics.

A wide range of phenomena and applications enabled by SPPs and bridging several fields, will be presented in this talk: (a) plasmonic collimators that have allowed us to dramatically reduce the divergence of semiconductor lasers, creating  exciting opportunities in beam  engineering; (b) plasmonic polarizers for arbitrary control of laser polarization;  (c) new light sources such as plasmonic laser antennas, capable of creating intense nanospots for spatially resolved chemical imaging and ultra high density optical storage; (d)  antenna arrays for surface enhanced Raman scattering; (e) frequency selective surfaces enabled by a new soft lithography technique; (f) optomechanical forces between waveguides at sub-wavelength distances. Finally at this distance scale forces arising from quantum fluctuations of the electromagnetic field cannot be neglected give rising to both attractive and repulsive Casimir forces. The latter, recently measured by us for the first time, could lead to ultralow friction mechanical devices based on quantum levitation.

 

 

Federico Capasso is the Robert Wallace Professor of Applied Physics at Harvard University, which he joined in 2003 after a 27 year career at Bell Labs where he did research, became Bell Labs Fellow and held several management positions including Vice President for Physical Research.

His research has spanned a broad range of topics from applications to basic science in the areas of electronics, photonics, mesoscopic physics, nanotechnology and quantum electrodynamics. He is a co-inventor of the quantum cascade laser, a fundamentally new light source, which has now been commercialized.  In recent years, he has been involved in fundamental studies of the Casimir force, including the first measurement of a repulsive Casimir force. 

He is a member of the National Academy of Sciences, the National Academy of Engineering, a fellow of the American Academy of Arts and Sciences and an Honorary Member of the Franklin Institute. His awards include the King Faisal International Prize for Science, the American Physical Society Arthur Schawlow Prize, the IEEE Edison Medal, the Wetherill Medal of the Franklin Institute, the Optical Society of America Wood Prize, the Materials Research Society Medal, the Rank Prize in Optoelectronics, the IOP Duddell Medal, the Willis Lamb Medal, the IEEE David Sarnoff Award, the IEEE-LEOS Streifer Award, the LVMH Leonardo Da Vinci Prize, and the Welker Medal. He is a Fellow of the OSA, APS, IEEE, SPIE, IOP and AAAS.

 

 

 

TaN film

Hi y'all

Does any member know of a vendor where I can deposit TaN film to make resistors? Specifically, I need to make 50-Ohm terminator for our RF circuit and want to find someone that can make film of controlled resistance of 25 to 50 Ohm/square.

Thanks,
Dinh Ton

Re: Quartz plate for transparency mask

I keep an blanket mask by the ks aligners.
do at least 2 seconds of exposure.
mahnaz

Arunanshu Roy wrote:
> Hi labmembers,
>
> Can someone tell me where I may find a quartz plate to stick my
> transparency mask on? Also can someone give me an estimate of the
> exposure time for 1um of 3612 resist using a transparency mask.
>
> Thanks a lot,
> Arunanshu
>

Quartz plate for transparency mask

Hi labmembers,

Can someone tell me where I may find a quartz plate to stick my
transparency mask on? Also can someone give me an estimate of the
exposure time for 1um of 3612 resist using a transparency mask.

Thanks a lot,
Arunanshu

Sunday, January 24, 2010

Process Clinic, Monday, 2 pm

Greetings labmembers --


Process clinic from 2-4 pm on Monday, Jan. 25, in the cubicle area near
Maureen's office. Bring process questions, process runsheets, layouts,
and ideas -- even SpecMat questions. Everyone is welcome -- especially
senior labmembers interested in brainstorming process questions.


Your SNF staff

Friday, January 22, 2010

Comment p5000etch SNF 2010-01-22 14:31:36: Update Ch.B

Cycled 24 wafers using the Jim Ox recipe with a 30 sec, 25 W, Argon plasma Declamp step and had no problems. A user ran 4 wafers using the same recipe (15 sec, 50 W) Declamp step. I will continue to test the chamber handling but if you need to use the chamber please contact a staff member and we can assist you in running your wafers. This will also help us collect information on which types of wafers and which processes tend to have handling problems.

Thursday, January 21, 2010

RE: Question about gold etching

If you bake resist (1165) and treat your features with au-etch, the rate is ~150nm/min. you can dip it in and out to visually see too. Make sure you rebake in hot plate (~1min at 110C) if you take it out to re-harden resist. It doesn’t etch si/sio2.

gluck

 

Best Regards,

Sonny !

__________________________________________________

 

"What makes the desert beautiful," said the Little Prince ,"is that somewhere it hides a well ."

    _.--.  _

   ;,-   `' (            ,,,

  (  E#=====#############=: ]

   :_"'  ,._(         ```

     `--'         rock on    

Sonny Vo

Ph.d candidate

Department of Applied Physics, Stanford University

(626) 202-8379

Harris Research Group: http://snow.stanford.edu/index.html

 

 

 

From: fanpy839 [mailto:fanpy839@stanford.edu]
Sent: Thursday, January 21, 2010 3:35 PM
To: labmembers
Subject: Question about gold etching

 

Hi Everyone,

 

I'm wondering if there is anyone have used the gold etchant in the lab (NaI), and could give me some information about its etching rate of gold and how it may attack silicon, oxide, resist (e.g. PMMA) and etc.

 

Thank you so much for your help!

 

Best,

Pengyu

 

2010-01-21


fanpy839

Question about gold etching

Hi Everyone,
 
I'm wondering if there is anyone have used the gold etchant in the lab (NaI), and could give me some information about its etching rate of gold and how it may attack silicon, oxide, resist (e.g. PMMA) and etc.
 
Thank you so much for your help!
 
Best,
Pengyu
 
2010-01-21

fanpy839

EE310 Seminar: Ge MOSFETs for High Performance CMOS Applications

............................................................................
EE310 Seminar
Date: Tuesday, January 26, 2010
Time: 4:15 - 5:05 pm
Place: Hewlett 102
Host: Prof. Yoshio Nishi

Title: Ge MOSFETs for High Performance CMOS Applications

Speaker: Dr. Duygu Kuzum, Stanford University

Abstract:
As the semiconductor industry approaches the limits of traditional silicon
CMOS scaling, introduction of performance boosters like novel materials and
innovative device structures has become necessary for the future of CMOS.
High mobility materials are being considered to replace Si in the channel to
achieve higher drive currents and switching speeds. Ge has particularly
become of great interest as a channel material, owing to its high bulk hole
and electron mobilities. However, replacement of Si channel by Ge requires
several critical issues to be implemented in Ge MOS technology. High quality
gate dielectric for surface passivation, low parasitic source/drain
resistance and performance improvement in Ge NMOS are among the major
challenges in realizing Ge CMOS.
Direct formation of a high-k dielectric on Ge has not given good results in
the past. A good quality interface layer is required before the deposition
of a high-K dielectric. In this talk, we will present our technique to
engineer Ge/insulator interface. Characterization of gate dielectric/channel
interface and a deeper understanding of mobility degradation mechanisms in
Ge MOSFETs will be discussed. Ge N-MOSFETs have exhibited poor drive
currents and low mobility, as reported by several different research groups
worldwide. In spite of the increasing interest in Ge, the major mechanisms
behind poor Ge NMOS performance have not been completely understood yet.
Detailed characterizations are performed to identify the mechanisms behind
poor Ge NMOS performance in the past. Record high mobility exceeding Si
universality has been demonstrated for Ge NMOS devices fabricated with the
ozone-oxidation and the low temperature S/D activation processes. Novel
source/drain formation processes and strained-Ge architectures for nanoscale
Ge MOSFETs will be presented in the last part of the talk.

Biography:

Duygu Kuzum received her B. S. in Electrical Engineering from Bilkent
University, Turkiye, in 2004 and Ph.D. in Electrical Engineering from
Stanford University in 2009. She is currently a postdoctoral researcher in
Prof. H. -S. Philip Wong in Stanford Nanoelectronics Group. Her Ph.D.
research focused on design, fabrication and characterization of Ge MOSFETs
for future technology nodes. She is currently working on novel memory and
storage devices and nanoscale electronic devices for nano-bio applications.
She worked as a research intern at Translucent Inc. (2006) and Intel
Component Research (2008). She was a recipient of a number of awards,
including Texas Instruments Fellowship and Intel Foundation Fellowship.

Tuesday, January 19, 2010

Lab is open

Dear labmembers --


Following the power outage, the lab is now open for use. Not all tools
have yet recovered, so make sure to check Coral for tool status before
using.


Much appreciate and many thanks for FacOps and early bird SNF staffers
for doing what needs to get done to get everyone back on track!


Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

SNF Lab is close until furture notice! Jan 19th 2010

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fn:Jeannie Perez
n:Perez;Jeannie
org:Stanford University;Stanford Nanofabrication Facility
adr;dom:;;420 Via Palou Mall, CIS 146;Sanford;CA;94305-4070
email;internet:jperez@snf.stanford.edu
title:Techical Trainer
tel;work:650 723-7997
tel;fax:650 725-6278
x-mozilla-html:FALSE
url:https://spf.stanford.edu/SNF/
version:2.1
end:vcard

Hi Everyone,
Do to the power failure that occurred across campus, we will need to
power up most of the equipment,test and Regenerate others in our SNF
Lab. Please wait until further notice before entering our Lab.
Jeannie

Monday, January 18, 2010

Special seminar: Federico Capasso, Harvard -- Tues 1/26, 5:15 PM

Special Seminar

 

The Bright Future of Sub-Wavelength Photonics:
From Light Manipulation to Quantum Levitation at the Nanoscale

 

Federico Capasso

School of Engineering and Applied Sciences

Harvard University

 

Tuesday, January 26, 5:15 PM, Applied Physics 200

Refreshments at 5:00 PM

Presented by the Stanford Student OSA/SPIE

 

Surface Plasmon Polaritons (SPPs) allow one to achieve concentration of light into sub-wavelength regions thus opening up rich new directions in physical optics and photonics.

A wide range of phenomena and applications enabled by SPPs and bridging several fields, will be presented in this talk: (a) plasmonic collimators that have allowed us to dramatically reduce the divergence of semiconductor lasers, creating  exciting opportunities in beam  engineering; (b) plasmonic polarizers for arbitrary control of laser polarization;  (c) new light sources such as plasmonic laser antennas, capable of creating intense nanospots for spatially resolved chemical imaging and ultra high density optical storage; (d)  antenna arrays for surface enhanced Raman scattering; (e) frequency selective surfaces enabled by a new soft lithography technique; (f) optomechanical forces between waveguides at sub-wavelength distances. Finally at this distance scale forces arising from quantum fluctuations of the electromagnetic field cannot be neglected give rising to both attractive and repulsive Casimir forces. The latter, recently measured by us for the first time, could lead to ultralow friction mechanical devices based on quantum levitation.

 

 

Federico Capasso is the Robert Wallace Professor of Applied Physics at Harvard University, which he joined in 2003 after a 27 year career at Bell Labs where he did research, became Bell Labs Fellow and held several management positions including Vice President for Physical Research.

His research has spanned a broad range of topics from applications to basic science in the areas of electronics, photonics, mesoscopic physics, nanotechnology and quantum electrodynamics. He is a co-inventor of the quantum cascade laser, a fundamentally new light source, which has now been commercialized.  In recent years, he has been involved in fundamental studies of the Casimir force, including the first measurement of a repulsive Casimir force. 

He is a member of the National Academy of Sciences, the National Academy of Engineering, a fellow of the American Academy of Arts and Sciences and an Honorary Member of the Franklin Institute. His awards include the King Faisal International Prize for Science, the American Physical Society Arthur Schawlow Prize, the IEEE Edison Medal, the Wetherill Medal of the Franklin Institute, the Optical Society of America Wood Prize, the Materials Research Society Medal, the Rank Prize in Optoelectronics, the IOP Duddell Medal, the Willis Lamb Medal, the IEEE David Sarnoff Award, the IEEE-LEOS Streifer Award, the LVMH Leonardo Da Vinci Prize, and the Welker Medal. He is a Fellow of the OSA, APS, IEEE, SPIE, IOP and AAAS.

 

 

 

Seminar on acoustic cell and particle handling in microfluidic systems

Cell and Particle handling using acoustics and microfluidics

 

Speaker: Professor Johan Nilsson, Lund University, Sweden

Date: Thursday, January 21th

Time: 2pm

Place: Allen 101X

 

Dr Johan Nilsson from Lund University in Sweden will be holding a seminar with the title "Cell and Particle handling using acoustics and microfluidics" this Thursday. Some information regarding the different topics of the talk can be found here: http://www.elmat.lth.se/forskning/nanobiotechnology_and_labonachip/research/

 

Johan Nilsson obtained his Ph.D. in 1993 in Electrical Measurements on the topic Ink Jet and Droplet Technology at the Department of Electrical Measurements, Lund University, Sweden. Following the Ph.D., he got a post-doc employment at the same department where he headed the research in droplet formation characterizations and silicon nozzle development. He developed the concept of flow-through microdispensing together with Prof. Thomas Laurell. He currently holds a position as Associate Professor at the Department of Measurement Technology and Industrial Electrical Engineering. The topics for his research are microfluidics and microstructures with a focus on microsystems for protein analysis using mass spectrometry and particle handling using acoustic forces.

 

Please spread the information to anyone you think might be interested in this talk.

 

Best regards

 

Mikael

___________________________________________

 

Mikael Evander, Ph.D.

Transducers Lab

Paul G. Allen Building

420 via Ortega, Room CISX-218X

Stanford, CA 94305-4075

USA

 

E-mail: evander@stanford.edu

Tel: +1 (650) 723-5646

Cell: +1 (650) 387-6323

Fax: +1 (650) 725-9020

 

Sunday, January 17, 2010

Lab temperature and humidity update

Dear labmembers --


Many apologies, but it looks like the nanobuilding tie in is taking much
longer than expected. The crew is working on restarting systems in the
Paul Allen/X Buildings right now and expects to be done in an hour. It
will then take a couple or a few hours for the temperature to come back
into normal range -- since it is an automated building control system,
this should start controlling as soon there is steam/heating water
available.


Most of the lab operations are unaffected -- people have been using the
Raith and ASML and other tools without problem. However, resist coating
problems have been reported (not spreading), because of the cold -
something we didn't anticipate.


The crew will confirm when tie in is complete and I've been assured that
Facilities will be monitoring the situation. . I'll post an update if
things change, but otherwise the building crews seem to believe we
should be OK shortly.


Mary

Friday, January 15, 2010

No temperature/humidity control in the lab until Sunday evening

Dear labmembers --


Because of facilities work to tie in the new Nanobuilding into the
campus facilities steam system, we are losing the ability to heat and
humidify the lab, starting now and extending until Sunday afternoon. In
terms of processing, this will likely affect the litho area the most,
but we do not anticipate serious issues (ASML users will receive "what
if" instructions shortly.)


The lab may be unusually cold in the late evening and early morning.
Things should be back to normal by Sunday evening.


If you have other concerns regarding this work, please let staff know.


Thanks for your attention --


Your SNF staff


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Comment p5000etch SNF 2010-01-15 10:22:09: Ch.B shutdown

To eliminate the risk of any miss handling in the chamber,I will leave the chamber offline until we optimize the declamp step and the problem has been resolved 100%.

Re: Comment p5000etch SNF 2010-01-04 15:00:56: Cycled 16 wafers/ ch.

Archived

Re: Comment p5000etch SNF 2010-01-13 13:48:41: Handling test

Archived

Re: Shutdown p5000etch SNF 2010-01-14 14:53:42: Wafer stuck in B

Ran 4 wafers using the user's recipe (Jim-ntr , 1800 sec etch) without any problems after increasing the "declamp" step (Argon plasma) from 10 sec to 30 sec.
I will leave the chamber B offline until we optimize the declamp step.

Thursday, January 14, 2010

Shutdown p5000etch SNF 2010-01-14 14:53:42: Wafer stuck in B

Given the previous comments, not that surprising.

Electrical Connection to a 1um wide feature


Dear Lab members,

I wanted to know of possible ways to make electrical contact to 1um wide stripe electrode of an edge emitting laser.

Any advice will be great.

Thanks alot,

--
Altamash Janjua,

Harris Group Stanford University

Wednesday, January 13, 2010

Comment p5000etch SNF 2010-01-13 13:48:41: Handling test

Ran 32 wafers through Ch.B using the Jim Ox recipe with no problems.

Tuesday, January 12, 2010

EE410 Class Arrival

Lab Members,

The annual EE410 class enters the fab this week for their crash
course in learning how to process CMOS wafers. The class is a 6 week
processing sprint to fully fabricate functional CMOS devices. The
lab sections are 1-5pm on Tuesday, Wednesday and Thursday and a 8-12
section on Wednesday.

You will see reservations appear on Coral reserving the necessary
tools for the lab section. Please note, the EE410 class and
reservations have priority over all other reservations. In addition,
a significant amount of processing is required between the weekly lab
sections. Please honor the EE410 reservations with the realization
the class may not arrive at the tool within the 15 minute window.

Please support the EE410 effort and please plan your work schedule
accordingly,

Regards,
EE410

Convenience Outlets

Dear labmembers:


Those of you who have been in the lab may have noticed some new, bright
aqua blue electrical outlets. These are here for you. They are
designed to power various personal electronics, such as laptops,
portable vacuum wands, portable ionizers -- small electronics that you
might need during a session in the lab. These have been placed along
work tables near wbgeneral/sts dep, lampoly/tel, and epi2. Please use
these outlets for your personal electronics (for safety reasons, do not
use outlets located inside fingerwalls nor unplug existing equipment.)


Let us know how these work for you.


Your SNF Staff


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: Shutdown p5000etch SNF 2010-01-11 18:56:16: Ch.B wafer didn't drop

wafer removed

Monday, January 11, 2010

Comment p5000etch SNF 2010-01-11 22:15:13: Also...

We used the suggested 15s Ar plasma step and still had this wafer handling problem.

Shutdown p5000etch SNF 2010-01-11 18:56:16: Ch.B wafer didn't drop

after recipe ended, wafer didn't drop on robot arm. arm is still in the chamber along with the wafer. two other wafers are in the elevator. please don't use the manual robot commands to retrieve the wafer as that has broken many wafers in the past and this is a fairly expensive/important wafer. the three test wafers all ran without issue before the tool decided to drop the first real wafer. I left a box for the wafers by the tool.

Re: Problem p5000etch SNF 2010-01-11 13:20:17: Handling problem

Replaced the wafer clamp. Cycled 16 wafers without any handling problems.

Problem p5000etch SNF 2010-01-11 13:20:17: Handling problem

Wafer did not drop in pocket from Ch.C

Clinics: Process (Monday) and Venture (Tuesday)

Greetings labmembers:


Just a reminder that there's a Process Clinic today at 2 pm. We meet in
the cubicle area outside Maureen's office. Bring your process
questions, SpecMat requests, mask layouts and runsheets. Staff members
will be available for consultation; experienced labmembers are invited
to offer advice and support.


There will also be a Venture Clinic with Shahin Farschi of Lux Capital,
Tuesday, at 5:30 pm in Allen 101 (note time change). Learn about the
current conditions in the venture world or discuss your startup ideas
with an experienced venturist. Coffee and snacks provided. Shahin may
also be contacted directly:


Shahin Farshchi, Ph.D.
Senior Associate
Lux Capital Management, LLC
C: 925.323.2784
http://www.luxcapital.com


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: Problem p5000etch SNF 2010-01-08 14:16:01: Ch.C is down

Vented chamber and adjusted wafer transfer from storage
elevator to chamber c wafer drop.

Friday, January 8, 2010

Problem p5000etch SNF 2010-01-08 14:16:01: Ch.C is down

Chamber is down due to wafer mis-handling.

Re: Comment p5000etch SNF 2009-12-11 15:00:06: Wet cleaned Ch.C

Archived

Re: Shutdown p5000etch SNF 2010-01-07 16:31:35: wafer did not fall on blade- ch c

Chamber C is down for wafer mis handling. Wafer seems to be sticking to the clamp during unload. Needs further troubleshooting.

Wednesday, January 6, 2010

Re: Problem p5000etch SNF 2009-11-29 11:49:19: Ch A: HT EX fault

Old problem- will check out during qual...

Monday, January 4, 2010

Tomorrow's SNF meeting: cancelled

Dear SNF user community,

It's not a great way to start off the New Year, but I've discovered
through the last couple of hours of discussions that the meeting
tomorrow is premature and should be rescheduled.

Roger

Roger T. Howe wrote:
> All --
>
> Just a reminder that you're invited to an "all-hands" meeting to look
> at the initial directions for the SNF in the new year (actually, new
> decade too).
>
> Here's the email Yoshio send on Dec. 16, which was only a couple of
> weeks ago but before the holidays.
>
> Roger
>
> Yoshio Nishi wrote:
>> Hi all,
>>
>> We'd like to have a meeting asap of SNF staff and interested faculty and
>> users in order to discuss plans for the SNF in 2010 and beyond, but
>> we're
>> out of time this year -- so we've scheduled it for Tuesday, January 5 at
>> 1:00 in Allen 101X. We're looking forward to a very challenging and
>> productive year, building on our successes over the last several months.
>>
>> Roger and Yoshio
>>
>>
>>
>>
>

Comment p5000etch SNF 2010-01-04 15:00:56: Cycled 16 wafers/ ch.

Ran 16 wafers per chamber with no problems.

SNF meeting: tomorrow 1-2 in Allen 101X

All --

Just a reminder that you're invited to an "all-hands" meeting to look at
the initial directions for the SNF in the new year (actually, new decade
too).

Here's the email Yoshio send on Dec. 16, which was only a couple of
weeks ago but before the holidays.

Roger

Yoshio Nishi wrote:
> Hi all,
>
> We'd like to have a meeting asap of SNF staff and interested faculty and
> users in order to discuss plans for the SNF in 2010 and beyond, but we're
> out of time this year -- so we've scheduled it for Tuesday, January 5 at
> 1:00 in Allen 101X. We're looking forward to a very challenging and
> productive year, building on our successes over the last several months.
>
> Roger and Yoshio
>
>
>
>

Fwd: [foundryoutreach] Call for Molecular Foundry Proposals


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Date: Tue, 22 Dec 2009 09:14:03 -0800
From: Molecular Foundry <foundry@lbl.gov>
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Subject: [foundryoutreach] Call for Molecular Foundry Proposals
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Call for User Proposals:  The Molecular Foundry

Call for Proposals Begins:  Monday, January 4, 2010

Submission Deadline:  Monday, February 1, 2010

Projected Award Date:  Friday, April 23, 2010


Dear Colleagues,

The Molecular Foundry at Lawrence Berkeley National Laboratory (LBNL), a Department of Energy (DOE) national nanoscience user facility, is currently accepting requests for user access to its instruments, capabilities and skilled technical staff from scientists and engineers who are seeking to enhance their own research projects.  Requests from potential users, in the form of web-based proposals, must be received not later than February 1, 2010 to be considered in our current call.

The mission of LBNL's Molecular Foundry is to provide researchers from academic, government and industrial laboratories from around the world access to instruments, materials, technical expertise and training in nanoscience.  Access to the Foundry is free of charge for research that is in the public domain and intended for open publication. Users wishing to generate as well as maintain confidential information and data will pay full-cost-recovery rate, but also have greater latitude regarding collaboratively generated intellectual property.

The Molecular Foundry hosts six Facilities focusing on the multidisciplinary development and understanding of "soft" (biological and polymeric) and "hard" (inorganic and microfabricated) nanostructured building blocks and their integration into complex functional assemblies. These research facilities serve as a particularly valuable resource for users pursuing multidisciplinary research in nanoscience (e.g., physicists interested in learning biological techniques, biologists seeking nanofabrication expertise, experimentalists pursing theoretical studies). All projects that may benefit from Foundry capabilities are welcome, particularly those which relate to our four research themes and reflect areas of expertise of the Molecular Foundry staff. The Foundry strongly encourages project submissions that take advantage of our other LBNL user facilities, including the Advanced Light Source, Energy Sciences Network, Joint Genome Institute, the National Energy Research Scientific Center, and the National Center for Electron Microscopy. The Foundry also maintains agreements with affiliated laboratories that can be requested within your proposal submission.

Prospective users are invited and strongly encouraged to contact Molecular Foundry staff in the respective theme areas to discuss proposal ideas and to learn more about special capabilities of particular interest (visit the "Our Staff" section at the Foundry web site). We encourage the discussion of your proposal's central ideas to ensure the Foundry has the appropriate facilities, equipment and staff to perform your requested research.

Decisions reached in this round of proposal submissions will be announced approximately ten weeks after submission deadline; for this call we anticipate a notification date of April 23, 2010.  All approved projects will receive user access and work may begin as soon as scheduled after this notification.

For further information, please visit:
 

The Molecular Foundry Home Page
http://foundry.lbl.gov

The User Program Description
http://foundry.lbl.gov/scientific/index.html

The User Proposal Process
http://foundry.lbl.gov/scientific/Proposal_Process.html

Molecular Foundry Staff Scientists 
http://foundry.lbl.gov/about/staff.html

LBNL User Facilities and Affiliated Laboratories
http://foundry.lbl.gov/six/affiliated.html

We look forward to receiving your new proposal.  Should you have any questions regarding this process, please contact the User Program Office by e-mail at foundry@lbl.gov or by telephone at 510-486-7493.

Sincerely,

David A. Bunzow
Molecular Foundry User Program Manager
dabunzow@lbl.gov
510-486-4574 (office)

--   The Molecular Foundry http://foundry.lbl.gov/ foundry@lbl.gov ph: 510.486.7493