Recovered the user's wafer and placed in slot 24 of his cassette.
Replaced the wafer clamp. Now running wafers using the user's recipe (200 sec etch). Previous maintenance tests were ran for only 30 secs. It appears that longer etches have more problems with wafer handling.
Note: I enabled the robot's capacitive sensor last week to minimize wafer breakages when there is a wafer mis-handling (I don't know who disabled it). The down side is that there will be more handling faults. Instead of the system continuing to process wafers even with a broken wafer in the chamber, the loading operation is stopped.
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