Am Vac Soc: CMPUG/PAG/TFUG Joint Meeting--December 9, 2009

Northern Calif Am Vac Soc (www.avsusergroups.org)
CMP USERS GROUP, PLASMA APPLICATIONS GROUP, THIN FILM USERS GROUP

FREE ADMISSION-No need to register, just show up!!
Topic: Back End Integration
Meeting Date: December 9, 2009

Location: SEMI Global Headquarters
Seminar Rooms 1, 2 & 3
3081 Zanker Road
San Jose, CA 95134
**Park in front or behind the vacant building across from SEMI**

EARLY START TIME: 1:30 - 5:00 pm
Chair: Kapila Wijekoon, Applied Materials, Kapila_wijekoon@amat.com;
Brett Cruden, NASA Ames UARC, brett.a.cruden@nasa.gov
Roc Blumenthal, roc@rocsolidsoln.com
AGENDA:
1:30-1:40 Welcome/Opening Remarks
1:40-2:10 "3D Imaging and Its Applications in CMP and Solar", Jim Xu, Zeta Technologies

2:10-2:40 "Effect of pad conditioning on CMP process performance for read
write magnetic heads", Ramin Emami, Hitachi

2:40-3:10 "Challenges in Porous Ultra Low-k for 22nm Dual Damascene Trench
Etch", K. Zhou, R. Patz, A. Darlak, Y. Zhou, J. Pender, M. Armacost, C.
Labelle, D. Horak, Applied Materials and IBM

3:10-3:30 Coffee Break

3:30-4:00 "Metallization Challenges in the Fabrication of Reliable
Interconnects for 2X Technology and Beyond", Emesh Ismail, Semitool Inc.

4:00-4:30 "Reducing Tungsten Contact and Line Resistance with advanced
Pulsed Nucleation Layer (PNLTM) and Low Resistivity Tungsten (LRW)
treatment", Raashina Humayun, Anand Chandrashekar, Feng Chen, Michal
Danek; Novellus Systems

4:30-5:00 " Effects of vacuum ultraviolet plasma emission on low-k
dielectrics", E. A. Hudson1, M. Moravej1, M. Block1, S. Sirard1, D. Wei1,
K. Takeshita1, B. Jinnai2 and S. Samukawa2, 1Lam Research Corp. and 2
Tohoku University

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Happy Holidays!!!