**Formerly: PLASMA ETCH USERS GROUP**
FREE ADMISSION-No need to register, just show up!!
Topic: Plasma-Assisted Surface Modification Processes
Date: October 8, 2009
EARLY Start Time: 1:30 - 5:00 pm
Location: SEMI Global Headquarters
Seminar rooms 1 & 2
3081 Zanker Road
San Jose, CA 95134
**Park in front or behind the
vacant building across from SEMI**
Co-Chairs: Lucia Feng, LMFENG@earthlink.net
Paul Werbaneth, pwerbane@tegal.com
AGENDA:
1:30 - 1:35 Welcome
1:35 - 2:05 "Diversification into adjacent thin film and surface
preparation equipment markets", Risto Puhakka, VLSI Research,
rjp@vlsiresearch.com
Abstract: The presentation focuses on the benefits that equipment
companies can achieve from diversification into adjacent surface
preparation and thin film equipment markets. Data about the counter
cyclical behavior of semiconductor, display, solar, MEMS and other
markets are presented. Additionally the presentation explores surface
preparation and thin film beyond classic applications.
Biography: As President of VLSI Research Inc, Risto Puhakka has
responsibility for subscription services, sales, marketing, and business
development. Mr. Puhakka oversees and contributes to ongoing research
projects and also spearheads product launches. He manages VLSI's advisory
activities and regularly supplies advice and analysis to leading companies
in the chip making industry, the financial community, the press, as well
as various government agencies. Joining VLSI in 1995, Mr. Puhakka has
been an important contributor to VLSI's success. Starting as a senior
analyst in Chip Making Markets, he has expanded his role through all
critical positions within the company. He has served as Vice President
since 1998. Mr. Puhakka's prior experience includes sales, marketing, and
engineering activities with a global capital equipment manufacturer in
Finland . He has earned his MBA from UC Berkeley and MS in Mining and
Process Engineering from Helsinki University of Technology in Finland.
2:05 - 2:35 "Non-thermal atmospheric pressure plasmas for biomedical
and dental disinfection", Professor Chunqi Jiang, Department of
Electrical Engineering - Electrophysics, University of Southern
California, chunqi@usc.edu
Abstract: Non-equilibrium atmospheric-pressure plasma has emerged as a
novel technology for biomedical, dental and environmental applications.
Different types of plasma sources for the generation of
atmospheric-pressure plasmas and their application in biomedical fields
are reviewed. Particular attention will be paid to pencil or needle-like
plasma plumes, generated with nanosecond pulsed plasma sources. The
observed plasma-mediated germicidal effects against microbial biofilms
imply promising applications of the cold plasma for root canal and wound
disinfection. Possible plasma bactericidal mechanisms including
oxidation with reactive chemical species (O, O3, OH, etc.), surface
detachment, electrostatic disruption, and UV radiation are discussed.
Biography: Chunqi Jiang received a B.S. degree in Electrical
Engineering from Changchun Institute of Optics and Fine Mechanics,
Changchun, China, in 1995, a M.S. degree from the University of
Electronic Science and Technology of China, Chengdu, China, in 1998, and
a Ph.D. degree from Old Dominion University, Norfolk, VA, in 2002. She
then joined the pulsed power research group at the University of
Southern California as a postdoctoral research associate. After working
in a research-oriented startup company, she returned to USC and was
appointed a research assistant professor in 2008. Her research interests
include high power, high voltage plasma switches and
atmospheric-pressure plasmas for biomedical applications. She has served
as a technical program committee member for the IEEE International Power
Modulator Conference, an overseas attendance chair for the IEEE
International Power Modulator and High Voltage Conference, and a guest
editor for the IEEE Transactions on Dielectrics and Electrical
Insulation. She was elected to IEEE senior membership in June of 2009.
2:35 - 3:05 "Super-Hydrophobic films With Sequential Surface
Modifications", Jeff Chinn, Integrated Surface Technologies,
jeff@insurftech.com
Abstract: Surface modification with a super-hydrophobic film has been
of interest for many commercial and military applications to overcome
failures and issues arising from water damage in unwanted places.
Traditional super-hydrophobic coatings are created by either roughening
the surface or by depositing a material with nanoscale roughness which
is subsequently modified with a low surface energy self-assembling
monolayer. The engineering challenge is the durability of the film
while the commercial challenge has been to engineer surface attributes
with an economical technique. We present a durability-improved
nano-composite super-hydrophobic film created using sequential surface
reactions. Current applications include printed circuit boards for
water-safe electronics in all environments.
Biography: Jeff Chinn, Ph.D. is the CTO and Founder of Integrated
Surface Technologies (www.InSurfTech.com), a supplier of surface
engineering tools for MEMS, Bio-tech and industrial applications. Prior
to founding InSurfTech, he was CEO and founder of Applied
MicroStructures (AMST). Dr. Chinn has over 25 years experience in
semiconductor processing and manufacturing and held technical management
positions at Applied Materials, Siliconix, IDT, Cypress and Fairchild
Semi during his career. Dr. Chinn received his doctorate from Cornell
University and has over 50 issued patents.
3:05 - 3:30 Break/Networking
3:30-4:00 "Surface Treatment of Materials with Atmospheric Pressure
Plasmas", Dr. Robert F. Hicks, Surfx Technologies LLC,
hicks@surfxtechnologies.com
Abstract: In this presentation, I will review our recent work on the
surface treatment of materials with atmospheric pressure, radio
frequency plasmas. A description will be given of the engineering
design, physics and chemistry of these novel plasma devices. Then we
will examine several applications, including the activation of polymer
surfaces for enhanced adhesion, the oxidation and passivation of
silicon, and the atmospheric plasma-enhanced chemical vapor deposition
of thin films.
Biography: Robert F. Hicks is the President of Surfx Technologies LLC,
a company that sells atmospheric pressure plasma tools for high-speed
surface treatment. He is also a Full Professor of Chemical and
Biomolecular Engineering and Materials Science and Engineering at the
University of California, Los Angeles. Robert received his B.S. and
Ph.D. degrees in chemical engineering from the University of Delaware in
1977 and the University of California, Berkeley, in 1984. He founded
Surfx Technologies in 1999, and he has been a faculty member at UCLA
since 1985. His research interests are in the physics, chemistry and
engineering of materials. Bob has authored over 170 scientific papers
throughout his career. He is a member of the AVS, TMS and AIChE. In
2001, he was elected Fellow of the American Vacuum Society. In 1999, he
received an R&D 100 Award for co-invention of the atmospheric pressure
plasma jet. Bob has been voted Professor of the Year, by the UCLA
chemical engineering students in 1993, 1995, 1999, 2001, 2002, 2006 and
2008.
4:00 - 4:30 "Advanced Plasma Treatments to Improve 4 Semiconductor
Device Packaging Applications: Die Attach, Wire Bonding, Mold &
Encapsulation, and Flip Chip Underfill", Scott D. Szymanski, March
Plasma Systems, sszymanski@marchplasma.com
Abstract: Advanced Semiconductor Packaging and Assembly (ASPA) is a
rapidly growing technology field, as the need for more and more advanced
packaged devices increases to meet new demands: in smart phones, game
consoles, laptop personal computers & netbooks, automotive applications,
wireless applications, medical & live science device applications, and
for many other markets. Accordingly, advanced plasma treatments have
been developed in order to improve many IC device/semiconductor
packaging applications. This talk will focus on four of the most common
(and important) device packaging and assembly applications, and how
advanced plasma treatments can improve them. Specifically, we will
discuss how advanced plasma treatments can be used (1) to improve the
bonding strength and reliability of the die attach step, (2) to increase
the strength and reliability of wire bonds, (3) to improve the adhesion
of mold & encapsulation material to the device in order to decrease
delamination, and (4) to increase fillet height on all sides of the die,
improve fillet uniformity around the die, improve underfill liquid flow
speeds under the die, and decrease voids under the die for flip chip
devices.
Biography: As the Global Marketing Manager for March Plasma Systems,
Scott D. Szymanski works to expand strategic customer alliances,
strengthen partnerships with technology suppliers, and develop future
product offerings tailored to March's target markets. He holds a B.S.
degree in Mechanical Engineering from UCLA, and an M.B.A. He has over
15 years of industry experience working for semiconductor equipment
companies in and around Silicon Valley.
4:30-5:00 Networking
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Corporate Sponsorship Opportunities available at NCCAVS User Group
Meetings!
For details please visit www.avsusergroups.org
<http://www.avsusergroups.org/> or contact Heather Korff, NCCAVS
Office,
530-896-0477, heather@avs.org.
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2009 PAG/PEUG Meeting Schedule: (www.avsusergroups.org
<http://www.avsusergroups.org/> - Dates subject to change)
November 8-13-AVS 56th International Symposium & Exhibition, San Jose,
CA. For details visit www.avs.org <http://www.avs.org/>
December 9-BEOL Integration, submit abstracts to Co-Chairs:
Brett Cruden, Roc Blumenthal, and Kapila Wijekoon; bcruden@arc.nasa.gov,
roc@rocsolidsoln.com, kapila.wijekoon@amat.com
2010 PAG January - June schedule also available, www.avsusergroups.org.
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