Friday, May 30, 2008

SNF Process Clinic - Monday, 6/2, 2-4 pm

Greetings Labmembers --

Process Clinic, this coming Monday, June 2, from 2-4 pm in the cubicle
area near CIS 41. Bring questions about processing and process flow,
mask layouts, and new materials and chemicals.

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Can I borrow a cool SEM sample?

Hi,

Next Friday, I'd like to give my solid state physics class an SEM demo.
Does anyone have any cool samples I could show them? Samples that
you wouldn't mind accidentally being destroyed would be best. :)

Thank you,
John

Gold Etchant?

Hi Labmembers,

Does anyone know if the gold etchant at CIS also etches lead (Pb)? I had a thin lead film on top of a patterned gold layer, and tried to lift off with gold etch, but the lead film seems to be gone after using the gold etchant... I'd appreciate it if anyone has an idea.

Thanks,
Takane

Ni Plating summary

Many thanks to the lab members who had vendors

www.prodigysurfacetech.com

Ask for David Roberts.

http://www.crea-labs.com/

Ask for Eric Sanjuan


Other plating vendors, but did not contact:

EEJA (Electroplating Engineers of Japan)Contact information:
Dean Shoemaker
Tel: (408)-782-6635
Fax: (408)-782-6678
E-mail: cusjca@carmelchem.com


Pre plating prep

100A Ti/W followed by 1000A Au

UHV Sputtering can do, ask for Terry

Thursday, May 29, 2008

HF tank has been emptied ....

SNF Lab Members:

As promised, the pump truck has arrived and emptied our HF collection
tank. As a result, normal wet bench operations, including HF disposal,
can resume.

Happy processing,

John

Reminder - Jim Turner, Acting Director, NIST Seminar TODAY 4pm

Reminder, and bonus -- we also have Dr. Willie May, NIST Director of Chemistry Science and Technology, and NIST staff member Dr. Mike Amos as guests for this seminar. See you in Hewlett201!
 
 
Optical Society of America/SPIE Stanford Student Chapter and Stanford Photonics Research Center Present

Dr. James M. Turner, Ph.D.
Deputy Director and Acting Director, National Institute of Standards and Technology

Measuring Up to the Global Competition: How NIST Advances Innovation and Industrial Competitiveness

Thursday, May 29, 2008
4:15 pm, Hewlett 201
Refreshments at 4:00pm

Abstract

Study after study asserts the importance of innovation to the economic futures of industries and nations.  Across the spectrum from R&D laboratory to marketplace, global competition to be first and best in developing and commercializing new technologies is intensifying.  The job of the National Institute of Standards and Technology (NIST), a science and technology agency in the U.S. Department of Commerce, is to work with companies, universities, and other organizations to develop and deliver  the advanced measurement capabilities that are among the essential ingredients of a 21st century innovation economy.  In this talk, I will describe the vital – but often overlooked – role that measurements and standards play in fostering technological progress under fast-changing circumstances of global competition and as new national needs arise.  Examples will be drawn from NIST's work in nanotechnology and biotechnology.

About our Speaker

Dr. James M. Turner is the Deputy Director of the U.S. Department of Commerce's National Institute of Standards and Technology (NIST). He is also carrying out the responsibilities of the Director. (The NIST Director position is vacant.) Turner provides high-level oversight and direction for NIST. The agency promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology. NIST's FY 2008 resources total $931.5 million and the agency employs about 2,800 scientists, engineers, technicians, support staff and administrative personnel at two main locations in Gaithersburg, MD and Boulder, CO. Along with the Department of Energy Office of Science, and the National Science Foundation, NIST is slated for substantial budget increases for its core research programs under the President's American Competitiveness Initiative.

Prior to joining NIST on April 16, 2007, Turner served as the Assistant Deputy Administrator for Nuclear Risk Reduction in the Department of Energy's National Nuclear Security Administration. In that position, he was responsible for major projects in Russia to permanently shutdown their last three weapons-grade plutonium-production reactors. He also worked with foreign governments and international agencies to reduce the consequences of nuclear accidents by strengthening their capability to respond to nuclear emergencies.

Prior to that assignment, Turner held several senior management posts at DOE concerned with laboratory oversight and with nuclear safety and the safeguarding of nuclear weapons both here and abroad.

He holds degrees in Physics from the Massachusetts Institute of Technology (Ph.D.) and Johns Hopkins University (B.A.), and taught for five years as an Associate Professor of Physics and Engineering at Morehouse College.

Among other honors, he has received the U.S. Government Presidential Rank Award for Meritorious Service, three times received the U.S. Department of Energy Exceptional Service Award, and earned the Secretary of Energy Gold Award and the National Nuclear Security Administration's Gold Medal. Dr. Turner is an active member of the American Physical Society, the American Chemical Society, the American Nuclear Society, the American Association for the Advancement of Science, ASTM, the Council on Foreign Relations, IEEE, Phi Beta Kappa, Sigma Xi, and the World Affairs Council.

Dr. Turner is a native of Washington, DC, is married, and has five children and one grandchild. He enjoys doing yoga and Tai Chi. He and his wife, Paulette, reside in Olney, Maryland.





--
--------------------------------------------------
Meredith M. Lee
Stanford University
Ph.D. Candidate, Dept. of Electrical Engineering
President, Stanford Student OSA/SPIE

Center for Integrated Systems
420 Via Ortega, Stanford, CA 94305-4075
Fax: (650) 723-4659
mmlee@stanford.edu

No HF draining today ....

SNF Lab Members (and users of labs in CIS-X that could drain HF):

At the moment, the 1000 gallon tank that collects HF waste is full and
we cannot drain any more HF at ANY drains that go into this system ....
including, but not limited to wbdiff, wbsilicide, and wbnonmetal.

This includes labs in the extension.

At the moment, we believe that the pumper truck should be here late this
afternoon to empty the system .... but we will send out another
announcement when it is OK to dump HF once again.

While we normally keep a close eye on the tank, the mechanical float
system that we can easily check got jammed and led us to believe that we
had more tank capacity than we, in fact, had.

Thank you for your cooperation in this matter .... draining any HF today
will overflow the tank and result in a greatly extended shutdown if we
have to clean up an overflow.

Thank you for your continued support,

John

Wednesday, May 28, 2008

Re: Comment p5000etch SNF 2008-05-27 18:57:58: trouble

Adjusted wafer lift speed and adjusted wafer handoff.

Re: Shutdown p5000etch SNF 2008-05-28 00:39:10: Problem

nstalled the clear lid on chamber A so that I can observe the wafer handling while its under vacuum. Noticed the wafer lift moved up a little faster in vacuum. Adjusted the lift speed.
After about 150 wafers, had a problem with the wafer sliding on the platten during clamping. Added 5 steps to wafer insertion into the chamber. Cycled about 8 wafers with no problems. Two users are currently running the system.

Comment p5000etch SNF 2008-05-28 10:58:07: Update

Installed the clear lid on chamber A so that I can observe the wafer handling while its under vacuum. Noticed the wafer lift moved up a little faster in vacuum. Adjusted the lift speed. So far I have cycled 72 wafers with no problems. I will contiue to cycle wafers until 2 pm and release the system at 3 pm.

Shutdown p5000etch SNF 2008-05-28 00:39:10: Problem

Gave an error - "Wafer did not drop on blade" after the etch in Chamber A.
Please look into this problem.

Re: Shutdown p5000etch SNF 2008-05-27 19:03:08:

Robot arm was jammed inside chamber during wafer
unload, found wafer fell off from the lifter pins, manually
removed wafer and checked wafer transfers from storage
elevator chamber and could not duplicate error.

Problem p5000etch SNF 2008-05-27 19:02:48: trouble

The robot spatura won't move.
The gate valve of chamber B might be opend.
I tried to reset the robot but there is no respond.

Comment p5000etch SNF 2008-05-27 18:57:58: trouble

I found a wafer from chamber A.
And.....
The robot spatura is stucked during the motion.
It might lose it's position.
The gate valve of chamber B seems to be opened.

Precision cutting

Hello,

I’m looking for a tool to cut a very thin copper sheet with sub millimeter precision, does anyone know where I can find/ use one?

 

Thanks,

Arash

 

----------------------------------------------------------------------------------

Arash Hazeghi

 

PhD Candidate

Stanford Center for Integrated Systems

CIS-X 300, 420 Via Palou Mall,

Stanford, CA 94305

 

phone: +1-650-725-0418

web: http://www.stanford.edu/~ahazeghi

 

Re: mini mechanical press

Hi,

I am trying to buy the press and put it in the glove box filled with nitrogen. Preferred ram size is ~ 2 inches (dia.)

Thanks!

On Tue, May 27, 2008 at 3:06 PM, Jung-Yong Lee <ljy@stanford.edu> wrote:
Hi,

I am looking for a small (each dimension < 30cm) mechanical press with approx. ~10 tons capacity. It would be great if it is motor-actuated. Please let me know if you know any companies or any infos. Thanks!

--
Jung-Yong



--
Jung-Yong

Problem p5000etch SNF 2008-05-27 16:01:53: wafer stuck in CH A

"wafer didn't drop on blade from CH. A"
wafer still inside. could someone please retrieve it?
Thanks.

mini mechanical press

Hi,

I am looking for a small (each dimension < 30cm) mechanical press with approx. ~10 tons capacity. It would be great if it is motor-actuated. Please let me know if you know any companies or any infos. Thanks!

--
Jung-Yong

Re: Problem p5000etch SNF 2008-05-25 20:25:12: Chamber A offline

Adjusted chamber wafer hand-off and cycled 16 wafers using Ch.A metal timed recipe with no problems.

Special Lunch with the speaker -- Jim Turner, Acting Director, NIST - Thurs May 29

 
The Stanford Photonics Research Center (SPRC)  will be hosting a lunch with Dr. Jim Turner, Deputy Director and Acting Director of the National Institute of Standards and Technology, and Dr. Willie May, NIST Director of Chemistry Science and Technology: Thursday, May 29 in AP 299 at 12 noon prior to our public seminar.
 
To join us for this limited-seating special lunch, email saracl@stanford.edu ASAP.
 
Thanks!
Stanford OSA/SPIE and SPRC 
 

 
Optical Society of America/SPIE Stanford Student Chapter and Stanford Photonics Research Center Present

Dr. James M. Turner, Ph.D.
Deputy Director and Acting Director, National Institute of Standards and Technology

Measuring Up to the Global Competition: How NIST Advances Innovation and Industrial Competitiveness

Thursday, May 29, 2008
4:15 pm, Hewlett 201
Refreshments at 4:00pm

Abstract

Study after study asserts the importance of innovation to the economic futures of industries and nations.  Across the spectrum from R&D laboratory to marketplace, global competition to be first and best in developing and commercializing new technologies is intensifying.  The job of the National Institute of Standards and Technology (NIST), a science and technology agency in the U.S. Department of Commerce, is to work with companies, universities, and other organizations to develop and deliver  the advanced measurement capabilities that are among the essential ingredients of a 21st century innovation economy.  In this talk, I will describe the vital – but often overlooked – role that measurements and standards play in fostering technological progress under fast-changing circumstances of global competition and as new national needs arise.  Examples will be drawn from NIST's work in nanotechnology and biotechnology.

About our Speaker

Dr. James M. Turner is the Deputy Director of the U.S. Department of Commerce's National Institute of Standards and Technology (NIST). He is also carrying out the responsibilities of the Director. (The NIST Director position is vacant.) Turner provides high-level oversight and direction for NIST. The agency promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology. NIST's FY 2008 resources total $931.5 million and the agency employs about 2,800 scientists, engineers, technicians, support staff and administrative personnel at two main locations in Gaithersburg, MD and Boulder, CO. Along with the Department of Energy Office of Science, and the National Science Foundation, NIST is slated for substantial budget increases for its core research programs under the President's American Competitiveness Initiative.

Prior to joining NIST on April 16, 2007, Turner served as the Assistant Deputy Administrator for Nuclear Risk Reduction in the Department of Energy's National Nuclear Security Administration. In that position, he was responsible for major projects in Russia to permanently shutdown their last three weapons-grade plutonium-production reactors. He also worked with foreign governments and international agencies to reduce the consequences of nuclear accidents by strengthening their capability to respond to nuclear emergencies.

Prior to that assignment, Turner held several senior management posts at DOE concerned with laboratory oversight and with nuclear safety and the safeguarding of nuclear weapons both here and abroad.

He holds degrees in Physics from the Massachusetts Institute of Technology (Ph.D.) and Johns Hopkins University (B.A.), and taught for five years as an Associate Professor of Physics and Engineering at Morehouse College.

Among other honors, he has received the U.S. Government Presidential Rank Award for Meritorious Service, three times received the U.S. Department of Energy Exceptional Service Award, and earned the Secretary of Energy Gold Award and the National Nuclear Security Administration's Gold Medal. Dr. Turner is an active member of the American Physical Society, the American Chemical Society, the American Nuclear Society, the American Association for the Advancement of Science, ASTM, the Council on Foreign Relations, IEEE, Phi Beta Kappa, Sigma Xi, and the World Affairs Council.

Dr. Turner is a native of Washington, DC, is married, and has five children and one grandchild. He enjoys doing yoga and Tai Chi. He and his wife, Paulette, reside in Olney, Maryland.





--
--------------------------------------------------
Meredith M. Lee
Stanford University
Ph.D. Candidate, Dept. of Electrical Engineering
President, Stanford Student OSA/SPIE

Center for Integrated Systems
420 Via Ortega, Stanford, CA 94305-4075
Fax: (650) 723-4659
mmlee@stanford.edu

SPRC and OSA/SPIE Seminar: Jim Turner, Acting Director, NIST - May 29

Optical Society of America/SPIE Stanford Student Chapter and Stanford
Photonics Research Center Present

Dr. James M. Turner, Ph.D.
Deputy Director and Acting Director, National Institute of Standards and
Technology

Measuring Up to the Global Competition: How NIST Advances Innovation and
Industrial Competitiveness

Thursday, May 29, 2008
4:15 pm, Hewlett 201
Refreshments at 4:00pm

Abstract

Study after study asserts the importance of innovation to the economic
futures of industries and nations. Across the spectrum from R&D
laboratory to marketplace, global competition to be first and best in
developing and commercializing new technologies is intensifying. The
job of the National Institute of Standards and Technology (NIST), a
science and technology agency in the U.S. Department of Commerce, is to
work with companies, universities, and other organizations to develop
and deliver the advanced measurement capabilities that are among the
essential ingredients of a 21st century innovation economy. In this
talk, I will describe the vital – but often overlooked – role that
measurements and standards play in fostering technological progress
under fast-changing circumstances of global competition and as new
national needs arise. Examples will be drawn from NIST's work in
nanotechnology and biotechnology.

About our Speaker

Dr. James M. Turner is the Deputy Director of the U.S. Department of
Commerce's National Institute of Standards and Technology (NIST). He is
also carrying out the responsibilities of the Director. (The NIST
Director position is vacant.) Turner provides high-level oversight and
direction for NIST. The agency promotes U.S. innovation and industrial
competitiveness by advancing measurement science, standards, and
technology. NIST's FY 2008 resources total $931.5 million and the agency
employs about 2,800 scientists, engineers, technicians, support staff
and administrative personnel at two main locations in Gaithersburg, MD
and Boulder, CO. Along with the Department of Energy Office of Science,
and the National Science Foundation, NIST is slated for substantial
budget increases for its core research programs under the President's
American Competitiveness Initiative.

Prior to joining NIST on April 16, 2007, Turner served as the Assistant
Deputy Administrator for Nuclear Risk Reduction in the Department of
Energy's National Nuclear Security Administration. In that position, he
was responsible for major projects in Russia to permanently shutdown
their last three weapons-grade plutonium-production reactors. He also
worked with foreign governments and international agencies to reduce the
consequences of nuclear accidents by strengthening their capability to
respond to nuclear emergencies.

Prior to that assignment, Turner held several senior management posts at
DOE concerned with laboratory oversight and with nuclear safety and the
safeguarding of nuclear weapons both here and abroad.

He holds degrees in Physics from the Massachusetts Institute of
Technology (Ph.D.) and Johns Hopkins University (B.A.), and taught for
five years as an Associate Professor of Physics and Engineering at
Morehouse College.

Among other honors, he has received the U.S. Government Presidential
Rank Award for Meritorious Service, three times received the U.S.
Department of Energy Exceptional Service Award, and earned the Secretary
of Energy Gold Award and the National Nuclear Security Administration's
Gold Medal. Dr. Turner is an active member of the American Physical
Society, the American Chemical Society, the American Nuclear Society,
the American Association for the Advancement of Science, ASTM, the
Council on Foreign Relations, IEEE, Phi Beta Kappa, Sigma Xi, and the
World Affairs Council.

Dr. Turner is a native of Washington, DC, is married, and has five
children and one grandchild. He enjoys doing yoga and Tai Chi. He and
his wife, Paulette, reside in Olney, Maryland.

Sunday, May 25, 2008

warning from p5000etch-pcs@snf.stanford.edu

Hi! This is the ezmlm program. I'm managing the
p5000etch-pcs@snf.stanford.edu mailing list.

I'm working for my owner, who can be reached
at p5000etch-pcs-owner@snf.stanford.edu.


Messages to you from the p5000etch-pcs mailing list seem to
have been bouncing. I've attached a copy of the first bounce
message I received.

If this message bounces too, I will send you a probe. If the probe bounces,
I will remove your address from the p5000etch-pcs mailing list,
without further notice.


I've kept a list of which messages from the p5000etch-pcs mailing list have
bounced from your address.

Copies of these messages may be in the archive.

To retrieve a set of messages 123-145 (a maximum of 100 per request),
send an empty message to:
<p5000etch-pcs-get.123_145@snf.stanford.edu>

To receive a subject and author list for the last 100 or so messages,
send an empty message to:
<p5000etch-pcs-index@snf.stanford.edu>

Here are the message numbers:

2061

--- Enclosed is a copy of the bounce message I received.

Return-Path: <>
Received: (qmail 14983 invoked from network); 14 May 2008 05:28:46 -0000
Received: from smtp1.stanford.edu (171.67.22.28)
by snf.stanford.edu with SMTP; 14 May 2008 05:28:46 -0000
Received: by smtp1.stanford.edu (Postfix)
id 86F852729D6; Tue, 13 May 2008 22:28:46 -0700 (PDT)
Date: Tue, 13 May 2008 22:28:46 -0700 (PDT)
From: MAILER-DAEMON@stanford.edu (Mail Delivery System)
Subject: Undelivered Mail Returned to Sender
To: p5000etch-pcs-return-2061-snfblog.P5000=blogger.com@snf.stanford.edu
Auto-Submitted: auto-replied
MIME-Version: 1.0
Content-Type: multipart/report; report-type=delivery-status;
boundary="8B943272992.1210742926/smtp1.stanford.edu"
Message-Id: <20080514052846.86F852729D6@smtp1.stanford.edu>

Problem p5000etch SNF 2008-05-25 20:25:12: Chamber A offline

Chamber A (Metal) is offline for maintenance.

Re: Shutdown p5000etch SNF 2008-05-22 10:21:28: Handler issues

Adjusted pick up extension for chamber A unload.

Friday, May 23, 2008

missing sample holder left next to wbdiff

Hi everyone,

I left a sample holder next to wet bench diffusion on wednesday night
and I can't find it anymore.
It is basically a 2-3 inch metal disc with 2 clips.
It had a piece of dummy wafer cliped on it.

If you know where it is please let me know.
Thanks in advance and sorry for the spam.

Marlene

Labmembers' Meeting - NOW (11 am Friday)

Hi everyone --

Just a reminder of the Labmembers' meeting which starting in two
minutes. We're in the CISX auditorium.

John, Ed, Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Smoky smell in lab .... Santa Cruz fire

SNF Lab Members:

The wind must has shifted and we are now getting a smoky odor from the
Santa Cruz fires. This gets pulled into the building and into the lab,
so it will smell somewhat smoky as well in there.

While you can safely ignore that smell, this places additional
requirements on all of us to be alert for any smells that are NOT smoke
from the lab. So, please be extra alert as to smells in the lab during
the time while the forest fire smoke is in the area.

Thanks,

John

Thursday, May 22, 2008

high selective etching of SiO2 over SiN

Hi Labmembers,

 

I need to etch SiO2 film without affecting the SiN layer underneath. I wonder if you know any recipe that has highly etching selectivity of SiO2 to SiN. By the way, both oxide and nitride layers are deposited by PECVD. Thanks in advance!

 

Thanks,

Yuan

Reminder: Labmembers' Meeting, Friday, 11-12, CISX Auditorium

Greetings Labmembers -- A reminder --

You are invited to a Labmember's meeting, tomorrow, Friday, May 23, at 11 am in the CISX Auditorium. Topics to be covered should be of general interest to the lab community:

- Labmember programs (functional area Quality Circles, Community Service projects, Superusers)
- Projects at SNF (equipment installations and qualifications, process development and characterization, new capabilities, equipment wishlists.)
- Open discussion

Everyone in the lab community is welcome.

Hope to see you there!


Ed, John, & Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

University Ph.D. Oral Examination - Wei Hu

High-Moment Synthetic Magnetic Nanoparticles for Biomedical Applications

Wei Hu
Materials Science & Engineering
Advisor: Prof. Shan X. Wang

Thursday, June 5th, 2008
9:30 AM (Refreshments served at 9:15 AM)
McCullough Bldg. Room 335

Abstract:

Superparamagnetic nanoparticles are widely used in biology and
medicine for applications which include biomolecule purifications and
cell separations, magnetic resonance imaging (MRI) contrast agents,
and bio-magnetic sensing. These nanoparticles are usually synthesized
by chemical routes, which are powerful but the size of nanoparticles
are typically below 20 nm due to the superparamagnetic limit. Beyond
this size, it is difficult to attain monodispersity and the onset of
ferromagnetism results in coercivity, remanent magnetization and
consequently magnetically induced agglomeration. Magnetic
nanoparticles with higher moments are often desired to produce large
signals or to avoid restrictive requirements for high magnetic field
gradients in separations. One conventional solution is to incorporate
numerous magnetic nanoparticles into larger composites using matrices
comprised of dextran or silica. However, there are still limitations
associated with controlling the monodispersity, magnetic response and
variations in the number and size of the embedded nanoparticles.

In this talk, I?ll present the physical fabrication of sub-100 nm
monodisperse disk-shape synthetic nanoparticles with high
magnetization ferromagnetic multilayers (e.g. Co-Fe alloy) using
nanoimprint lithography (NIL) and high vacuum deposition, followed by
release and stabilization of nanoparticles in solution.
Antiferromagnetic interlayer interactions are exploited to achieve
zero remanence and thus these nanoparticles are termed synthetic
antiferromagnetic (SAF) nanoparticles, which posses magnetic moments
well above those typical of superparamagnetic nanoparticles.

Unlike the chemical synthesis of magnetic nanoparticles, physical
fabrication enables accurate control of particle shape, size and
composition, and thus synthetic nanoparticles possess a lot of
interesting properties which are not readily accessible to
conventional superparamagnetic nanoparticles. For example, I
demonstrate SAF nanoparticles with adjustable saturation fields, which
are desired for multiplex magnetic labeling in biodetection or
multiplex cell sorting. Their high magnetic moments afford great ease
for magnetic manipulation in solutions with only modest field
gradients, which is highly desired for magnetic sorting. Metallic
synthetic nanoparticles strongly scatter light and can be individually
tracked in solution under optical microscopy.

To further evaluate their application potential for biomedicine, we
performed bio-magnetic detection with streptavidin functionalized SAF
nanoparticles. A low concentration of analyte DNA molecules at 10 pM
was clearly detectable. MRI measurements of nanoparticle enhanced
proton transverse relaxation revealed that SAF nanoparticles are
promising as contrast enhancement agents. In addition, hysteresis
measurements indicate that magnetic nanoparticles with vortex domain
structure (a second type of synthetic nanoparticles) could be
efficient heating elements for magnetic nanoparticle hyperthermia.

Last but not least, large scale fabrication of SAF nanoparticles with
low cost and high throughput is achieved using self-assembled stamps
and a polymer sacrificial layer with the assistance of batch-process
thermal evaporation. This fabrication technique is ideal for producing
multi-modal nanoparticles by exploiting layers with unique magnetic,
optical, radioactive, or electronic properties.

Wet Bench Stand-byProcedure Improvement

Dear Wet Bench Users,

We now have a new stand-by procedure for the dump rinsers. As you
recall, the dump rinsers must be left filled with water after use. This
allows for the automatic flush of the DI water lines and is crucial for
keeping the system bacteria free.

Thanks to Jim Haydon, here is the new improved and _easier_ procedure to
put the dump rinsers into stand-by;


*After the dump rinse is complete-*

1) Press OPEN to drain the water
2) Remove cassette with wafers
3) Close lid
4) Press <UP ARROW> to refill with water


This new procedure will be posted at the benches.

*__*- Team Wet Benches (Uli, Nancy, Jim)

Missing SnapOn hand tools?

SNF lab members and CIS building occupants:

We are conducting a periodic inventory of the big red SnapOn tool box in
the shop area and find that we are missing a number of items ....
particularly wrenches in the 7/16" to 3/4" size. If you think that you
may have borrowed some of these, can you please check your labs and
offices and return any of our SnapOn tools?

Thanks for checking,

John

Shutdown p5000etch SNF 2008-05-22 10:21:28: Handler issues

Wafer not sensed on blade. I removed the wafer and it appears to be ok.

Re: Problem p5000etch SNF 2008-05-22 01:35:34: Failed to unload

Removed wafer and inspected it. It looks fine. Put tool in shutdown

SNF Enterprise Forum: Ask a VC - Thurs., 5/22, 4:30 pm, CIS 101 (TODAY)

Hi all --

Just a reminder -- This is today (Thursday, 5/22) at 4:30 in CIS 101.

*******************************************************************************

Greetings labmembers --

Due to popular demand, Shahin Farschi, from Lux Capital, will be back to meet with labmembers
and other researchers interested in learning about the VC process. As requested following
his previous visit, Shahin will present a short review some examples of VC financing:
"Ever-increasing market competition and narrow market windows further exacerbate the
challenge of commercializing a novel technology. This seminar will introduce the audience
to who VCs are, how they evaluate investment opportunities, and what innovators can
expect from the process, which will be followed by an example and Q&A session."

Background: Shahin Farshchi is an associate at Lux Capital, a venture capital firm that
invests in early-stage semiconductor, energy, materials, and biotechnology companies,
where he assists in the creation and evaluation of semiconductor and cleantech-related
companies for investment. Shahin earned his B.S. degree in EECS from the University
of California at Berkeley, followed by his M.S. and Ph.D. degrees in Electrical Engineering
with a focus on MEMS and analog IC design from the University of California at Los Angeles.


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Reminder: PhD Oral Examination - Xiaobo Yin (Today, May 22, 2008, 1:00pm)

Department of Electrical Engineering

University Oral Examination

 

Optical Nonspecular Effects at Surface Plasmon Resonance and their Applications

 

Xiaobo Yin

 

Research Advisor: Lambertus Hesselink

 

1:00pm May 22nd 2008 (Refreshment at 12:45pm)

 

Hansen Experimental Physics Laboratory (HEPL), Room 102 (The New Attachment to the Varian Physics Building)

 

Abstract

The experimental observation of the Goos-Hänchen effect, a lateral beam shift at total internal reflection, has stimulated many interesting studies on optical nonspecular phenomena. These include the angular shift of the beam axis and the secondary nonspecular effects of shift in beam focus and beam waist modification. However, most of these investigations are focused on the geometrical parameters which lead to spatial nonspecular effects. In this talk, the temporal nonspecular effect as well as its spatial counterparts will be analyzed in an attenuated total internal reflection device where surface plasmon resonance (SPR) is optically excited. The physical quantities associated with these phenomena are identified and examined experimentally. New observations such as negative Goos-Hänchen displacement and superluminal pulse propagation at plasmon resonance will be discussed.

 

With improved and new understanding of the nonspecular effects at resonance, several applications of the effects will be proposed. Specifically, a Goos-Hänchen effect based biochemical SPR sensor (ghSPR) will be discussed in detail. Due to the singular behavior of the effect at plasmon resonance, the sensor achieves a superior sensitivity (up to 100x) compared to the conventional, reflectivity based SPR sensor. Two prototypes of ghSPR sensors with and without optical amplifications are demonstrated. Such sensors are potentially very useful in many applications such as disease marker screening and drug purification. As an example, low affinity antigen recognition is performed as a proof-of-principle experiment.

Problem p5000etch SNF 2008-05-22 01:35:34: Failed to unload

Wafer is stuck in loadlock chamber. Please help to place the wafer into the wafer container. Thanks...

Wednesday, May 21, 2008

RE-610 surfactant for Copper Electroless Plating

Dear labmembers,

I am looking to do copper electroless plating. RE-610 is a
surfactant used in all of the recipes I have found. Does anyone have
on hand a small quantity that I might be able to use.

If anyone has experience in copper electroless plating in general I
would be very eager to learn from you.

Best regards,
Justin Snapp

PhD Oral Examination - Shinichi Koseki (Friday, May 23, 2008, 1:30pm)

Department of Electrical Engineering
University Oral Examination

Monolithic Waveguide Coupled GaAs Microdisk Microcavity
Containing In0.3Ga0.7As Quantum Dots

Shinichi Koseki
Department of Electrical Engineering
Advisor: Professor Yoshihisa Yamamoto

Friday, May 23, 2008, 1:30 pm, CIS-X Auditorium
(Refreshment to be served at 1:15 pm)

Abstract:

After the intensive development of dielectric microcavities
containing semiconductor quantum dots (QDs), a variety of
cavity quantum electrodynamics (CQED) effects have been
demonstrated such as Purcell effect, Rabi splitting, or
single photon emission in the strong-coupling regime.
To enable more complicated functionality, the main interest
of such devices is now shifting to construct a microphotonics
circuit that consists of arrays of cavities and waveguide
structures for interconnection. Entanglement distribution
based quantum repeater protocol for long-distance quantum
communication is proposed based on such a system. Among the
microcavity structures, microdisk microcavity that supports
whispering gallery mode (WGM) has high quality (Q) factor
and small mode volume. For the entanglement distribution,
cavities with high quality factor, small mode volume (V),
large Purcell factor (Fp), as well as with the overcoupling
to the waveguide, are required.

In this talk, I will present our experimental effort to
fabricate and characterize our monolithic waveguide coupled
GaAs microdisk microcavity structure, where light is coupled
by the grating coupler. In the first part, I will introduce
our device design and process flow. In the second part, I
will present the results of the microphotoluminescence
spectroscopy of isolated microdisks, where we observed strong
coupling of CQED by the temperature tuning of the cavity.
In the third part, I will present the results of the optical
spectroscopy of waveguide coupled microdisks. Out-coupling
from the disk to the waveguide is evidenced by extracting
the cavity mode photon from the output port. In-coupling
into the disk from the waveguide is evidenced by the
transmission measurement between input and output ports,
where we observed 35% dip in the transmission spectra.
This system should play an important role in realizing
the entanglement distribution, and photonic quantum
information processor.

Tuesday, May 20, 2008

Differential probes for tektronics oscilloscope

Dear labmembers,
 
 Does anyone have differential probes for tektronics oscilloscope that I can borrow for a few days? I would like to test it before purchasing it.
 
 Any of P6246, P6247, and P6248 should work for my TDS3014B oscilloscope.
 
Thanks,
SangBum

thin copper sheet

Hello,

I’m looking for a very thin (<50um) perfectly flat copper sheet to shield my probes, does anyone know where I can get one?

 

Thanks,

Arash

 

----------------------------------------------------------------------------------

Arash Hazeghi

 

PhD Candidate

Stanford Center for Integrated Systems

CIS-X 300, 420 Via Palou Mall,

Stanford, CA 94305

 

phone: +1-650-725-0418

web: http://www.stanford.edu/~ahazeghi

 

SNF Enterprise Forum: Ask a VC - Thurs., 5/22, 4:30 pm, CIS 101 (NOTE THE DATE-THIS WEEK)

Hi all --

Sorry, I'd sent the announcement out last week with the wrong date. It's Thursday, May 22, THIS WEEK,
not next. So, I'm resending. My apologies.

*******************************************************************************

Greetings labmembers --

Due to popular demand, Shahin Farschi, from Lux Capital, will be back to meet with labmembers
and other researchers interested in learning about the VC process. As requested following
his previous visit, Shahin will present a short review some examples of VC financing:
"Ever-increasing market competition and narrow market windows further exacerbate the
challenge of commercializing a novel technology. This seminar will introduce the audience
to who VCs are, how they evaluate investment opportunities, and what innovators can
expect from the process, which will be followed by an example and Q&A session."

Background: Shahin Farshchi is an associate at Lux Capital, a venture capital firm that
invests in early-stage semiconductor, energy, materials, and biotechnology companies,
where he assists in the creation and evaluation of semiconductor and cleantech-related
companies for investment. Shahin earned his B.S. degree in EECS from the University
of California at Berkeley, followed by his M.S. and Ph.D. degrees in Electrical Engineering
with a focus on MEMS and analog IC design from the University of California at Los Angeles.


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

REMINDER: seminar in cis 101x: Materials and Technology for Monolithic Instruments

a potentially interesting talk today in a few minutes in CIS 101X:

Materials and Technology for Monolithic Instruments
Dr. Jeremy A. Theil

Abstract:
As CMOS process technology has matured over the past few years, a
novel trend that has emerged is one in which new materials and
structures are incorporated into or onto the integrated circuit to
create novel devices. Monolithic instruments are systems and that
combine conventional integrated circuits with novel solid-state
components so they can interact with the physical environment. Such
systems can achieve cost and performance enhancements through
integration and miniaturization. Examples include a-Si:H photodiode
arrays, OLED-based microdisplays, integrated biological and chemical
detection systems, integrated optical and photonic systems, and
digital micromirror displays. A non-exhaustive list of materials
include those that can be incorporated into integrated circuits such
as (i) deposited semiconductors including a-Si:H and microcrystalline
silicon; (ii) OLED materials; (iii) chemically active and inert
conductors; and (iv) organic conductors; (v) biocompatible materials;
and (vi) magnetic thin films. This presentation briefly touches upon
recent trend in monolithic instrument device and applications and new
fabrication techniques that are CMOS fab compatible.


~j

Acid Waste System yellow alarm ....

SNF Lab Members:

The yellow acid waste alarm began flashing some where between 2 p.m. and
2:15 p.m. this afternoon.

We have manually neutralized the system to bring it back into range and
have contacted the facilities folks responsible for that system. Normal
processing can resume at this point. If it goes into alarm again, make
sure that you contact that staff immediately so that we can manually
neutralize the system. If that happens during the night call the lab
emergency number: 650 521-7306 .... I can say that without annoying my
colleagues, because I'm carrying that phone at the moment.

It appears as if one of the valves that injects sodium hydroxide into
the tank to neutralize acids is leaking and will need to be replaced.
We will work with facilities to insure that this repair is effected with
minimal downtime and inconvenience .... but there may be a short period
during the coming days when that system will be offline for a short time.

Thank you for your continued response,

John

Reminder: PhD Oral Examination - Xiaobo Yin (Thursday, May 22, 2008, 1:00pm)

Department of Electrical Engineering

University Oral Examination

 

Optical Nonspecular Effects at Surface Plasmon Resonance and their Applications

 

Xiaobo Yin

 

Research Advisor: Lambertus Hesselink

 

1:00pm May 22nd 2008 (Refreshment at 12:45pm)

 

Hansen Experimental Physics Laboratory (HEPL), Room 102 (The New attachment to the Varian Physics Building)

 

Abstract

The experimental observation of the Goos-Hänchen effect, a lateral beam shift at total internal reflection, has stimulated many interesting studies on optical nonspecular phenomena. These include the angular shift of the beam axis and the secondary nonspecular effects of shift in beam focus and beam waist modification. However, most of these investigations are focused on the geometrical parameters which lead to spatial nonspecular effects. In this talk, the temporal nonspecular effect as well as its spatial counterparts will be analyzed in an attenuated total internal reflection device where surface plasmon resonance (SPR) is optically excited. The physical quantities associated with these phenomena are identified and examined experimentally. New observations such as negative Goos-Hänchen displacement and superluminal pulse propagation at plasmon resonance will be discussed.

 

With improved and new understanding of the nonspecular effects at resonance, several applications of the effects will be proposed. Specifically, a Goos-Hänchen effect based biochemical SPR sensor (ghSPR) will be discussed in detail. Due to the singular behavior of the effect at plasmon resonance, the sensor achieves a superior sensitivity (up to 100x) compared to the conventional, reflectivity based SPR sensor. Two prototypes of ghSPR sensors with and without optical amplifications are demonstrated. Such sensors are potentially very useful in many applications such as disease marker screening and drug purification. As an example, low affinity antigen recognition is performed as a proof-of-principle experiment.

Monday, May 19, 2008

Comment p5000etch SNF 2008-05-19 19:52:21: Loadlock error

Will have to run it in manual mode. Loadlock error during wafer unloading.

Reminder: Fire Department Safety Exercise today ....

SNF Lab Members and CIS Building Occupants:

This is a reminder that Palo Alto Fire and Campus EH&S Emergency
Response teams will be here starting at noon to simulate and practice
their response to a corrosive gas leak.

We believe that there will be NO actual alarms sounded and there will be
NO building evacuation as a result of this exercise. If, however, you
do see a lot of activity in the loading dock including fire trucks, fire
personnel and other emergency responders wearing breathing apparatus and
other protective equipment, do not be alarmed .... this is a planned
part of the drill. Most of the activity will be in the loading dock
area .... although fire equipment may be stationed at several locations
close to the building.

If fire alarms sound, toxic gas alarms sound, or you feel an earthquake
during this time .... please evacuate promptly as that should be treated
as a part of a real incident.

Thank you for your cooperation,

John

Fwd: Ellipsometry Workshop - FCSE 2008

>Dear J.A. Woollam Co. Customers,
>
>On Wednesday, June 4th, the J.A. Woollam Co.
>will be teaching a one day workshop at the FCSE
>(Functional Coatings and Surface Engineering)
>2008 Conference in Montreal, Canada. The
>workshop will begin at 8:30am. Please see workshop details below:
>
>"Optical Characterization and Reverse
>Engineering by Spectroscopic Ellipsometry"
>
>Ellipsometry is used to optically characterize
>all material types: semiconductors, dielectrics,
>metals, and organics possessing various
>structures, such as multi-layers and
>nanostructured thin films. With recent advances
>in optical instrumentation, many systems now
>rely on the high accuracy of spectroscopic
>ellipsometry (SE) for the measurement of film
>thickness and optical properties from VUV to IR.
>Shorter wavelengths increase sensitivity to
>ultra-thin films, while IR data allow
>identification and quantification of chemical
>bonds, as well as accurate n and k determination.
>
>This one day workshop will feature the following:
>
>* Introduction to spectroscopic ellipsometry: basic theory
>* Standard applications: thin films and bulk materials
>* Advanced applications: anisotropy and graded refractive index
>* Alternate capabilities of SE for R&D: IR
>ellipsometry and in situ ellipsometry
>* Hands-on laboratory session using the M-2000® and IR-VASE® instruments
>
>You may the website: www.fcse-montreal.ca for
>all the information about the FCSE 2008 Conference.
>
>Best regards,
>Veronica Inlow
>
>
>*******************************
>Veronica Inlow
>Marketing Coordinator
>J. A. Woollam Co., Inc.
>645 M Street, Suite 102
>Lincoln, NE 68508
>vinlow@jawoollam.com
>Phone: (402)477-7501 x101
>Fax: (402)477-8214

Re: Problem p5000etch SNF 2008-05-18 10:51:43: wafer dropped in loadlock

Recovered the user's wafer. Will leave chamber down to check wafer handoff and to cycle wafers

Re: Problem p5000etch SNF 2008-05-17 04:13:30: Wafer stuck in Ch.A

Recovered the user's wafer and placed his wafer in his container. Will leave chamber to check wafer handoff and to cycle wafers.

SNF Process Clinic, today (Monday), 2-4 pm

Hi all --

Just a reminder of the Process Clinic, today, from 2-4 pm, in the CIS
cubicle area. Bring your process questions for discussion; get your
mask layout checked; present your SpecMat request when the group
convenes at 3 pm.

Your SNF process staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Seminar reminder: Materials and Technology for Monolithic Instruments May 20 (Tue) 4-5pm CISX-101

Materials and Technology for Monolithic Instruments
Dr. Jeremy A. Theil

Abstract:
As CMOS process technology has matured over the past few years, a
novel trend that has emerged is one in which new materials and
structures are incorporated into or onto the integrated circuit to
create novel devices. Monolithic instruments are systems and that
combine conventional integrated circuits with novel solid-state
components so they can interact with the physical environment. Such
systems can achieve cost and performance enhancements through
integration and miniaturization. Examples include a-Si:H photodiode
arrays, OLED-based microdisplays, integrated biological and chemical
detection systems, integrated optical and photonic systems, and
digital micromirror displays. A non-exhaustive list of materials
include those that can be incorporated into integrated circuits such
as (i) deposited semiconductors including a-Si:H and microcrystalline
silicon; (ii) OLED materials; (iii) chemically active and inert
conductors; and (iv) organic conductors; (v) biocompatible materials;
and (vi) magnetic thin films. This presentation briefly touches upon
recent trend in monolithic instrument device and applications and new
fabrication techniques that are CMOS fab compatible.

BIOGRAPHY
Jeremy Theil works on high performance a-Si:H photovoltaic modules for
multi-MW solar farm installations. Previously, he has worked at
Agilent Technologies and Hewlett-Packard where his focus was on
advanced process technologies for mixed signal integrated circuits,
and monolithic instrument technology and applications. While there, he
developed the state-of-the-art a Si:H photodiode array technology for
advanced CMOS imager applications. Prior to joining Hewlett-Packard,
he worked at Johnson Controls developing thin film gas diffusion
barriers. He received his Ph.D. in Materials Science and Engineering
from North Carolina State University, and is an author of more than 33
papers and 43 patents.

Sunday, May 18, 2008

Comment p5000etch SNF 2008-05-18 11:46:51: Stuck wafer on chamber A

Unable to recover wafer on chamber A, need maint
password, tried using master password but is also disable
on system config.

Saturday, May 17, 2008

Problem p5000etch SNF 2008-05-17 04:13:30: Wafer stuck in Ch.A

"Wafer did not drop onto blade" error. If recovered, please kindly place the wafer in the container. Thanks!

Friday, May 16, 2008

Labmembers' Mtg: Fri, 5/23 at 11 am in the CISX Auditorium

Greetings labmembers --

You are invited to a Labmember's meeting to be held Friday, May 23, 11
am - noon in the CISX Auditorium. Topics of general interest to the SNF
labmembers and staff alike will be covered. Everyone in the SNF
community is welcome.

Ed, John, & Mary

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Hazmat drill at Noon Monday, 5-19-08

The University's hazardous materials response group will be
conducting a drill in conjunction with our annual refresher training
on Monday 5/19 at Noon. This will take place in the toxic gas
storage room and in space at the CIS dock. Palo Alto Fire plan to be
present to observe, we anticipate the drill will take less than 2
hours and should not impact any activities within the building.

If you've any questions contact me at 3-5069 or on my cell phone 650-444-5858.

Thanks in advance,

Kevin Kinast
E.H. & S.
Hazardous Materials Response Coordinator / Chemist
650-444-5858

Looking for SOI wafer vendors

Dear labmembers,

I want to buy some SOI wafers with the following specs:
4" SOI Wafers, Si thickness 1 micron, n-type, low resistivity

If you know of vendors other than Soitec or Okmetic, can you please email it
to me?
Also if you are interested in perhaps pooling together orders, let me know.

Thanks,

Srikant

A couple of things ....

SNF Lab Members:

There are a couple of things that I wanted to pass on to everyone:

1. We have arranged to hire Cesar Baxter on a contract basis to help us
during weekends and some evenings. While we may adjust timing and may
need to accommodate Cesar's other commitments, we currently are hoping
to use Cesar during the day on weekends and during the evenings on
Monday, Tuesday and Wednesday. Hopefully, this will provide improved
responses to equipment issues during many of the times when the lab is
active, but our staff is no longer on duty.

2. I've had individual chats with a number of long-time SNF users in
hopes of getting their candid assessment of things that we need to be
addressing most urgently in the lab. I'd like to invite any of you who
are so inclined to stop by and share your thoughts along these lines.
You are welcome to drop in at anytime or, if you can't seem to find me,
drop me a note and I'd be more than happy to set up a time to meet you.

3. I have asked our staff and a number of these long-time users to
generate their list of the top 10 things that they would like us to
address and/or resolve during the coming 90 days. While I cannot
guarantee that we will be able to address the things on everyones'
lists, I'd like to invite each of you to send me your list of issues
that you would like to see resolved in the coming 90 days. Having such
inputs from a broad range of the SNF community will be of use to me in
developing plans that will, hopefully, address these needs.

3. In general, if you are having issues with equipment, I want (and
need) to hear about them. Send me email, stop by ..... whatever it takes.

Thank you for you continued support .... and have a pleasant weekend.

John

Thursday, May 15, 2008

LAST CHANCE TO REGISTER! - CPN Annual Workshop on Metrology, May 23, 2008

Dear SNF Labmembers,

Next Friday, May 23rd, will be an exciting one-day workshop on campus,
with speakers from industry and academia discussing cutting-edge
metrology challenges and tools (in magnetics, semiconductors, biology,
etc.). Some of you will have received notice about this before. For
those who haven't, I apologize for the short notice, but the deadline
to register is tomorrow, Friday May 16. Details below.

Best wishes,
David

REGISTRATION CLOSES TOMORROW 5/16/08
Stanford University's Center for Probing the Nanoscale (CPN) 4th Annual Workshop
Friday, May 23, 2008
FREE REGISTRATION FOR STUDENTS & POSTDOCS
8:30-6, with continental breakfast and lunch included.
Poster session from 4-6, with hors d'oeuvres served- CASH PRIZES FOR
BEST POSTERS!
Frances C. Arillaga Alumni Center, McCaw Hall, 326 Galvez Street,
Stanford University.
http://www.stanfordalumni.org/aboutsaa/alumni_center/home.html

Registration http://www.stanford.edu/group/cpn/research/anworkshop_reg.html

Questions:
Laraine Lietz-Lucas, lietz@stanford.edu

Speakers:

Speakers:

C. Michael Garner, Ph.D., Intel Corporation
"Metrology Challenges for Beyond CMOS Devices and Materials"

Thomas F. Kelly, Ph.D. , Imago Scientific Instruments Corporation
"LEAP Tomography of Materials"

Jeff Hawthorne, M.S., Qcept Technologies Inc.
"Semiconductor Wafer Inspection Using Scanning Potential Difference Imaging"

Sang-il Park, Ph.D., Park Systems Corp.
"Probing the Nanoscale with Advanced AFM/SPM"

Andy Erickson, M.S., MultiProbe Inc.
"Nanoscale Probing Applications for a Multiple Probe AFM"

Liesl Folks, Ph.D., Hitachi Global Storage Technology
"Localized Magnetic Field Sensitivity of Shallow InAs Nanoscale Hall Crosses"

Ozgur Sahin, Ph.D., Rowland Institute at Harvard
"Microsecond Force Spectroscopy of Molecules and Nanomaterials"

Harald F. Hess, Ph.D., Janelia Farms, Howard Hughes Medical Institute
"Nanoscale Measurement Examples in Biology: Sub-Diffractive Imaging
and the Fly Brain Challenge"

Jeff Rosner, Ph.D., Agilent Technologies
"Biophysics Looking Forward from the Past: Single Cells and Statistics"


-----------------------------------------------------------------
David Goldhaber-Gordon goldhaber-gordon@stanford.edu
Assistant Professor of Physics davidg@post.harvard.edu
and Deputy Director, (permanent forwarding)
Center for Probing the Nanoscale www.goldhaber-gordon.com
Stanford University www.stanford.edu/group/cpn/
(650) 725-2047 (lab) (650) 724-3709 (office)

Address for letters or packages: Administrative Associate:
David Goldhaber-Gordon Roberta Edwards
Geballe Laboratory for Advanced Materials McCullough, Rm. 338
McCullough Building, Room 346 Phone: (650) 723-8028
476 Lomita Mall Fax: (650) 724-3681
Stanford, CA 94305-4045 email: redward@stanford.edu

SNF Process Clinic, Monday, 5/19, 2-4 pm

Hi everyone --

The next SNF Process Clinic will be Monday, 5/19, from 2-4 pm in the cubicle area near Maureen's office.

Bring your process flows and process questions. Experienced labmembers are especially welcome to help with consultations. There will be a laptop with Tanner LEdit, so bring your mask layouts and any LEdit questions. SpecMat will convene at about 3 pm, so bring your new material/new process requests. We'll
have snacks -- it'll be fun --

See you there --

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

SNF Enterprise Forum: Ask a VC - Thurs., 5/29, 4:30 pm, CIS 101

Greetings labmembers --

Due to popular demand, Shahin Farschi, from Lux Capital, will be back to meet with labmembers and other researchers interested in learning about the VC process. As requested following his previous visit, Shahin will present a short review some examples of VC financing: "Ever-increasing market competition and narrow market windows further exacerbate the challenge of commercializing a novel technology. This seminar will introduce the audience to who VCs are, how they evaluate investment opportunities, and what innovators can expect from the process, which will be followed by an example and Q&A session."

Background: Shahin Farshchi is an associate at Lux Capital, a venture capital firm that invests in early-stage semiconductor, energy, materials, and biotechnology companies, where he assists in the creation and evaluation of semiconductor and cleantech-related companies for investment. Shahin earned his B.S. degree in EECS from the University of California at Berkeley, followed by his M.S. and Ph.D. degrees in Electrical Engineering with a focus on MEMS and analog IC design from the University of California at Los Angeles.


--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Wednesday, May 14, 2008

Thermal annealing of bulk copper

Venerable labmembers -

Does anyone know a of a good resource (commercial or on-campus) for
thermal annealing at 1000C of bulk copper wires?

Thanks,
-Kam

--
Kam Arnold
Graduate Student Researcher
UC Berkeley Physics Department
351 LeConte Hall
Berkeley, CA 94720-7300
Office: 1 510 643 8161
Fax: 1 510 643 5204

Re: Comment p5000etch SNF 2008-05-14 08:56:56: Ch.A reliability testing

Ran 21 wafers using Ch.A metal timed recipe without any problems

seminar: Materials and Technology for Monolithic Instruments May 20 (Tue) 4-5pm CISX-101

Materials and Technology for Monolithic Instruments

Speaker:
Dr. Jeremy A. Theil, Process Integration Manager, Optisolar, Hayward, CA
94544

Abstract:
As CMOS process technology has matured over the past few years, a novel
trend that has emerged is one in which new materials and structures are
incorporated into or onto the integrated circuit to create novel
devices. Monolithic instruments are systems that combine conventional
integrated circuits with novel solid-state components so they can
interact with the physical environment. Such systems can achieve cost
and performance enhancements through integration and miniaturization.
Examples include a-Si:H photodiode arrays, OLED-based microdisplays,
integrated biological and chemical detection systems, integrated optical
and photonic systems, and digital micromirror displays. A non-exhaustive
list of materials include those that can be incorporated into
integrated circuits such as (i) deposited semiconductors including
a-Si:H and microcrystalline silicon; (ii) OLED materials; (iii)
chemically active and inert conductors; and (iv) organic conductors; (v)
biocompatible materials; and (vi) magnetic thin films. This presentation
briefly touches upon recent trend in monolithic instrument device and
applications and new fabrication techniques that are CMOS fab compatible.

BIOGRAPHY
Jeremy Theil is senior scientist and process integration manager at
Optisolar, Inc., where he works on high performance a-Si:H photovoltaic
modules for multi-MW solar farm installations.
Previously, he has worked at Agilent Technologies and Hewlett-Packard
where his focus was on advanced process technologies for mixed signal
integrated circuits, and monolithic instrument technology and
applications. While there, he developed the state-of-the-art a Si:H
photodiode array technology for advanced CMOS imager applications. Prior
to joining Hewlett-Packard, he worked at Johnson Controls developing
thin film gas diffusion barriers. He received his Ph.D. in Materials
Science and Engineering from North Carolina State University, and is an
author of more than 33 papers and 43 patents.

Tuesday, May 13, 2008

Re: Problem p5000etch SNF 2008-05-12 14:10:53: Ch.C is down

Replaced 4 small lip seals. Ran 25 wafers using Jim DP Trnch recipe without any problems.

Re: Shutdown p5000etch SNF 2008-05-13 10:27:27: Reliability testing

Ran 25 wafers through Ch.C and 25 wafers though Ch.B without any problems.

Re: Problem p5000etch SNF 2008-05-12 16:17:44: Ch. B. Got 4 black ring marks on the back of my wafers

Heavy resist build-up on the platten. Cleaned the platten and replaced all the lip seal o-rings (4 small + 1 large). Helium backside leak is < 2 sccm.

Shutdown p5000etch SNF 2008-05-13 10:27:27: Reliability testing

Cycling 25 wafers through Ch.B using the Jim OX recipe, after repair of chamber.

Reminder: PhD Oral Examination - Shuhong Liu (Wednesday, May 14, 2008, 1:30 pm)

Controlled Deposition of Organic Semiconductor Single Crystals and its
Application in Field-Effect Transistors

Shuhong Liu
Department of Materials Science and Engineering
Advisor: Professor Zhenan Bao

Wednesday, May 14, 2008, 1:30 pm, David Packard Electrical
Engineering, Room 101
(Refershment to be served at 1:15 pm)

Abstract:

The search for low-cost, large area, flexible devices has led to a
remarkable increase in the research and development of organic
semiconductors. Single-crystal organic field-effect transistors are
ideal device structures for studying fundamental science associated
with charge transport in organic materials and have demonstrated high
mobility and outstanding electrical characteristics. For example, an
exceptionally high carrier mobility of 20 cm2/Vs has been demonstrated
for rubrene single crystal field effect transistors. However, it
remains a technical challenge to integrate single-crystal devices into
practical electronic applications. A key difficulty is that organic
single-crystal devices are usually fabricated one device at a time by
handpicking a single crystal and placing it onto the device substrate.
This makes it impossible to mass-produce at high density with
reasonable throughput. Therefore, there is a great need for a
high-throughput method for depositing large arrays of organic
semiconductor single crystals directly onto device structures.

In this talk, I will present several approaches towards realizing this
goal. In the first part, I will introduce a solution-processing
technique that relies on solvent wetting and de-wetting on substrates
with patterned wettability to selectively direct the deposition or
removal of organic crystals. The assembly of different organic
crystals over centimeter-squared areas on Au, SiO2 and flexible
plastic substrates is demonstrated. By designing line features on the
substrate, alignment of needle-like crystals is also achieved. As a
demonstration of the potential application of this approach, arrays of
organic single crystal FETs are fabricated by patterning organic
single crystals directly onto and between transistor source and drain
electrodes. Besides organic single crystals, our self-assembly
strategy is also be applicable for patterning other objects such as
metallic nanowires.

In the second part, I will present a vapor-processing technique that
patterns organic single crystals using carbon nanotube (CNT) bundles
as templates. Several organic semiconductor materials are successfully
patterned, including p-type pentacene, tetracene, sexiphenylene, and
sexithiophene, as well as n-type tetracyanoquinodimethane (TCNQ). This
study suggests that the selective growth of crystals onto patterned
carbon nanotubes is most likely due to the coarse topography of the
CNT bundles. Moreover, we observe that the crystals nucleate from CNT
bundles and grow onto CNT bundles in a conformal fashion. The crystal
growth can be directly applied onto transistor source-drain electrodes
and arrays of organic single-crystal field effect transistors are
demonstrated. To investigate the impact of CNTs on device performance,
CNT bundles are incorporated into thin-film FETs and a mobility
enhancement of organic semiconductors is observed.

In the third part, I will present a method that offers the control of
the size and shape of organic single crystals using patterned Au films
as templates. It is observed that sexithiophene (6T) crystals nucleate
from the edge or the top surface of Au films and then grow two
dimensionally on SiO2 surface. The sizes and shapes of 6T crystals are
precisely determined by that of the Au patterns. After removing Au
templates, large arrays of 6T crystals with controlled sizes and
various shapes such as stripes, squares, hexagons, etc. are achieved.
Top-contact FETs made of 6T ribbons are demonstrated. Besides organic
single crystals, Au templates can also act as templates to pattern
vapor- and solution-deposited organic semiconductor thin films.
Patterned organic thin-film FETs exhibit superior performance compared
to unpatterned devices.

warning from labmembers@snf.stanford.edu

Hi! This is the ezmlm program. I'm managing the
labmembers@snf.stanford.edu mailing list.

I'm working for my owner, who can be reached
at labmembers-owner@snf.stanford.edu.


Messages to you from the labmembers mailing list seem to
have been bouncing. I've attached a copy of the first bounce
message I received.

If this message bounces too, I will send you a probe. If the probe bounces,
I will remove your address from the labmembers mailing list,
without further notice.


I've kept a list of which messages from the labmembers mailing list have
bounced from your address.

Copies of these messages may be in the archive.

To retrieve a set of messages 123-145 (a maximum of 100 per request),
send an empty message to:
<labmembers-get.123_145@snf.stanford.edu>

To receive a subject and author list for the last 100 or so messages,
send an empty message to:
<labmembers-index@snf.stanford.edu>

Here are the message numbers:

3193

--- Enclosed is a copy of the bounce message I received.

Return-Path: <>
Received: (qmail 32300 invoked from network); 1 May 2008 12:39:57 -0000
Received: from smtp1.stanford.edu (171.67.22.28)
by snf.stanford.edu with SMTP; 1 May 2008 12:39:57 -0000
Received: by smtp1.stanford.edu (Postfix)
id 3C1C92D6B03; Thu, 1 May 2008 05:39:57 -0700 (PDT)
Date: Thu, 1 May 2008 05:39:57 -0700 (PDT)
From: MAILER-DAEMON@stanford.edu (Mail Delivery System)
Subject: Undelivered Mail Returned to Sender
To: labmembers-return-3193-snfblog.P5000=blogger.com@snf.stanford.edu
Auto-Submitted: auto-replied
MIME-Version: 1.0
Content-Type: multipart/report; report-type=delivery-status;
boundary="01AA92D6B92.1209645597/smtp1.stanford.edu"
Message-Id: <20080501123957.3C1C92D6B03@smtp1.stanford.edu>

Monday, May 12, 2008

Problem p5000etch SNF 2008-05-12 16:17:44: Ch. B. Got 4 black ring marks on the back of my wafers

One of the o-rings was stuck to the last wafer. I left it on a napkin in front of the machine.

Problem p5000etch SNF 2008-05-12 14:10:53: Ch.C is down

Left chamber C offline because I did not have time to test it after wet cleaning the chamber and replacing the lip seal.

Re: Problem p5000etch SNF 2008-05-10 06:47:29: Update

The backside of the wafer inside the loadlock had a spot of thick resist (??). Wet cleaned the chamber and cycled wafers. Chamber kept faulting for backside helium flow. Reopened the chamber and replaced the lip seal. Leaving the chamber offline because I did not have time to test it.

Re: Problem p5000etch SNF 2008-05-12 07:13:34: Wafer sitting inside loadlock chamber

The backside of the wafer inside the loadlock had a spot of thick resist (??). Wet cleaned the chamber and cycled wafers. Chamber kept faulting for backside helium flow. Reopened the chamber and replaced the lip seal. Leaving the chamber offline because I did not have time to test it.

Problem p5000etch SNF 2008-05-12 07:13:34: Wafer sitting inside loadlock chamber

I was about to use p5000 but looks like the a wafer came out of chamber C but it's stuck inside loadlock and falling off the blade.

Saturday, May 10, 2008

Problem p5000etch SNF 2008-05-10 06:47:29: Update

Managed to clear Ch.B and ran 10 wafers on it. However, it is now Ch.C that has issues. During unload, it says "Wafer did not drop on blade". Wafer (dummy) is still inside Ch.C.

Friday, May 9, 2008

Problem p5000etch SNF 2008-05-09 17:10:58: Ch.B Problem

After finishing 4 wafers beatifully, Ch. B had RF fault, which might be due to the position of the wafer. When we tried to retrieve the wafer, the arm couldn't sense the wafer although the wafer was sitting on the arm. Nancy helped me get the wafer out so the machine now is free of wafer but the Ch. B is still showing "wait for the wafer out." Put into yellow light because experienced user might know how to clear it.

Comment p5000etch SNF 2008-05-09 10:47:42: wafer found in cassette A

Wafer from previous user was left in cassette A. I put it on a clean wipe on the table.

Comment p5000etch SNF 2008-05-09 07:49:54: Wafer handling reliability check

Cycling wafers through chamber C. Please contact me or unload my dummy wafers if you need to use the system.

Re: Problem p5000etch SNF 2008-05-09 06:03:35: Ch.B is offline

Placed system back online.
A frequent cause of a chamber going offline is a mismatch of the Serial Sequence recipe and the Wafer Process recipe. For example, on the System Control Screen, if the Serial Sequence selected is "C only" and under the Wafer Process no recipe is selected for chamber C. Chamber C would automatically be taken offline as soon as the wafer(s) are loaded.
Please verify that you have a recipe selected for the chamber that you specified under the Serial Sequence heading.

Re: Comment p5000etch SNF 2008-05-02 14:16:59: Use only Cassette B

Adjusted the cassette A level. Ran 20 wafers from the cassette through Ch.A with no problems (one wafer had an MFC13 flow warning).

Re: Comment p5000etch SNF 2008-05-08 07:16:37: Verifying cassette A is operational

Adjusted the cassette A level. Ran 20 wafers from the cassette through Ch.A with no problems (one wafer had an MFC13 flow warning).

Wednesday, May 7, 2008

Comment p5000etch SNF 2008-05-07 15:00:38: Ch.C reliability check

Ran 60 wafers using Jim dp trench recipe. Had two wafers fault for low RF.

SNF Process Grand Rounds, Friday, 3/9, 11:30 am.

Hi all --

A reminder that the Process Grand Rounds is this Friday, at 11:30 am, in
CIS 101. The agenda:

1. STSetch2 process characterization study, by Ed (20 min)
2. Open the floor for process discussion (20 min)
3. Quality Circle updates

All labmembers are welcome to attend. If you'd like to present a
process question to the group, let me know and we'll allot time
accordingly. Lunch provided.

Your Process Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: Problem p5000etch SNF 2008-05-07 03:18:06: Error message:

This is not real error, the system does not have a liquid source. Disabled the alarms.

Problem p5000etch SNF 2008-05-07 03:18:06: Error message:

Remote liquid source 1 line temperature above 100, remote liquid source 1 vapor pressure 759.

Tuesday, May 6, 2008

Gael Close's PhD oral examination --- Monday May 12 @ 10am

PhD oral examination
Title: On-Chip Demonstration of Carbon Nanotube Interconnects

Gael Close
Advisor: Prof. H.-S. Philip Wong

Date: Monday, May 12 at 10am, refreshments served at 9:45am
Location: Packard 101

ABSTRACT

Miniaturization in Electronics does not result in smaller high-performance chips.
Instead the chips remain the same in size, but they become exponentially
more complex-more devices and more complex wiring. An electronic chip
is only as good as its wiring. Today, copper interconnect wires are increasingly
becoming performance bottlenecks in integrated circuits. Copper was introduced
by chip makers in the late 90's to replace aluminum when the aluminum wires
started to limit chip performances, marking the beginning of the
"interconnect-centric era". What material is next beyond copper? Due to their
excellent electrical properties and small size, metallic carbon nanotubes (CNTs)
are promising materials for interconnect wires in future integrated circuits.
Indeed, simulations have firmly established CNTs as strong contenders
for replacing or complementing copper interconnects.

This talk builds on these modeling promises, and explores the use of CNT
interconnects from an experimental point of view. As a proof of concept,
this work culminates in the realization of the first digital integrated circuit
with CNT interconnects and silicon CMOS transistors. There remain
formidable challenges before a competitive CNT interconnect technology
can be implemented. However, the prototype chip described in the talk sets
a milestone by operating above 1 GHz, paving the way for future
multi-GHz nanoelectronics.


--
Gael Close
PhD Candidate
Center for Integrated Systems, CISX-300
Stanford University, California
+1-650-796-1241

Re: Problem p5000etch SNF 2008-05-02 14:07:38: Ch.C down

Ch.C is up. Ran 43 wafers with no problems. Will continue to monitor the system

Re: Comment p5000etch SNF 2008-05-06 08:02:23: Ch.C reliability check

Ran 43 wafers through chamber C using the Jim dp trench recipe.

Comment p5000etch SNF 2008-05-06 08:02:23: Ch.C reliability check

Reseated robot cable. Will try to cycle as many wafers as I can today. If you want to run the system, please contact me or just unload my dummy wafers and place them in the clear wafer box.

Monday, May 5, 2008

Comment p5000etch SNF 2008-05-05 14:47:32: "Red" wafer indicator

Please disregard the red wafer indicated in cassette B, slot#4.It does not effect how the wafers are processed through the system. Slot 4 is processed like a regular wafer. I will attempt to clear it out tomorrow.

Re: Comment p5000etch SNF 2008-05-05 10:16:13: Reliability check

Ran 80 wafers through Ch.A using "Ch.A metal" recipe (30 sec main etch) and 33 wafer through Ch.B "Jim Ox" recipe (30 sec) with no problems.

Comment p5000etch SNF 2008-05-05 10:16:13: Reliability check

Will continue to cycle wafers through both Ch.A and B. all day. Please let me know if you want to use the system.

Re: Shutdown p5000etch SNF 2008-05-03 23:35:10: Wafer was dropped in the load chamber

Adjusted wafer lift speed and wafer placement in the chamber. So far I have cycled 40 wafers without any problems.

Solaris upgrade ....

SNF Lab Members:

Over the weekend, we completed the upgrade from Solaris 10 update 4 to
Solaris 10 update 5 on flare (the machine which supports the Sun Rays in
the lab).

I believe that there should be very few differences for you. However,
if you see any changes or encounter any problems, please let me know.

One change that you will notice is that Star Office 7 has been upgraded
to Star Office 8.

Thank you for your continued support,

John

Saturday, May 3, 2008

Shutdown p5000etch SNF 2008-05-03 23:35:10: Wafer was dropped in the load chamber

There was a alarm during the unload that the wafer did not drop on the blade. Tried the recovery from STOP process and the blade dropped the wafer while trying to unload it. My device wafer is underneath the back of the transfer arm in the load lock right beside Chamber A door.

MEMS seminar by prof. senturia, Thu May 8

Peanuts vs. Pyramids: Two Perspectives on MEMS
Stephen D. Senturia
Professor of Electrical Engineering, Emeritus, MIT
Chairman and CTO, Polychromix

Mechanics Seminar at Stanford University
Thursday May 8, 2008, 4:15 pm
refreshments at 4 pm
Room 300-300

ABSTRACT
MEMS, the acronym for Microelectromechanical Systems, also known simply as "Microsystems," come in two main types: commodity products (the peanuts) and MEMS-enabled products (the pyramids, or, more correctly, the inverted pyramids). The economics of scale greatly affect how these two classes of products are designed, built, manufactured, and sold. The contrast is illustrated with two real-world examples: The Knowles SiSonicTM silicon cell-phone microphone, and the Polychromix PhazIRTM, a fully portable battery-operated hand-held near-infrared spectrometer. At the denouement, we will discover that in spite of their apparent differences, these two types of MEMS have something very much in common.

Friday, May 2, 2008

Comment p5000etch SNF 2008-05-02 14:09:49: Ch.A and B are UP

Ch.A - Vigorously re-cleaned the chamber interconnect cables. Also field services adjusted the wafer lift position sensors. Ran 16 wafers with no problems.
Ch.B - Cycled 8 wafers to verify operations.

Problem p5000etch SNF 2008-05-02 14:07:38: Ch.C down

Still intermittently faulting for an encoder when the robot arm extends into the chamber.

Re: Comment p5000etch SNF 2008-04-30 00:38:07: Ch.C was down when I enabled machine

h.A - Vigorously re-cleaned the chamber interconnect cables. Also field services adjusted the wafer lift position sensors. Ran 16 wafers with no problems.
Ch.C - Still intermittently faulting for an encoder when the robot arm extends into the chamber.

Re: Problem p5000etch SNF 2008-04-28 14:55:44: Ch.A is down for wafer lift

h.A - Vigorously re-cleaned the chamber interconnect cables. Also field services adjusted the wafer lift position sensors. Ran 16 wafers with no problems.
Ch.C - Still intermittently faulting for an encoder when the robot arm extends into the chamber.

Re: Comment p5000etch SNF 2008-04-30 19:28:45: Update

h.A - Vigorously re-cleaned the chamber interconnect cables. Also field services adjusted the wafer lift position sensors. Ran 16 wafers with no problems.
Ch.C - Still intermittently faulting for an encoder when the robot arm extends into the chamber.

Re: Comment p5000etch SNF 2008-05-01 12:36:43: Ch.C and Ch.A are down, Ch.B up

h.A - Vigorously re-cleaned the chamber interconnect cables. Also field services adjusted the wafer lift position sensors. Ran 16 wafers with no problems.
Ch.C - Still intermittently faulting for an encoder when the robot arm extends into the chamber.

Re: Problem p5000etch SNF 2008-05-01 12:38:20: Ch.A and C are down

Ch.A - Vigorously re-cleaned the chamber interconnect cables. Also field services adjusted the wafer lift position sensors. Ran 16 wafers with no problems.
Ch.C - Still intermittently faulting for an encoder when the robot arm extends into the chamber.

Thursday, May 1, 2008

SNF Process Clinic, Monday, 2-4 pm, with a special guest from ASML

Hi everyone --

The next SNF Process Clinic will be Monday, 5/5, from 2-4 pm in the
cubicle area near Maureen's office. Process staff will be on hand -- as
well as Keith Best, from ASML. Keith is (I think) Director of Special
Applications and would like to meet labmembers wanting to do some wild
and amazing things with the ASML -- especially those who might have a
need for the precision front-to-back overlay capability of the newly
installed and nearly qualified 3-D align upgrade.

Bring your process flows and process questions. Experienced labmembers
are especially welcome to help with consultations. SpecMat will convene
at about 3 pm, so bring your new material/new process requests. We'll
have snacks -- it'll be fun --

See you there --

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Comment p5000etch SNF 2008-05-01 12:36:43: Ch.C and Ch.A are down, Ch.B up

Ch.B is up, need to run process qual
Ch.C is down because of intermittent wafer extension faults when arm goes into the chamber. Replaced a robot cable but stil having intermittent errors. Will check if robot is physically hitting something .
Ch.A is still down for the lift sensor. Ordered new cables, no ETA yet. Field service will also come in tomorrow to further troubleshoot the problems.

Re: Problem p5000etch SNF 2008-04-29 13:10:40: chamber B magnet fault

Changed syscon 4080 from 3 to 7 and syscon 4081 from 2 to 6. Ran 16 wafers using JimOx recipe at 60 gauss with no problems.

Re: Shutdown p5000etch SNF 2008-04-30 00:37:37: Wafer fell off blade in machine

Broken wafer in Ch.B. Also heavy resist build-up in the chamber. Wet cleaned the chamber and adjusted the wafer hand-off position. Changed syscon 4080 from 3 to 7 and syscon 4081 from 2 to 6. Ran 16 wafers using Jim OX at 60 Gauss with no problems.

etching LTO

Like thermal oxide:

  - can LTO be etched with HF based wet etchants?

- can LTO be etched with RIE?

 

Is there any known difficulties with the above etch techniques and known workarounds?

 

Thanks

 

____________________________________

Hector Cavazos

Asylum Research