Dr. Jeremy A. Theil
Abstract:
As CMOS process technology has matured over the past few years, a
novel trend that has emerged is one in which new materials and
structures are incorporated into or onto the integrated circuit to
create novel devices. Monolithic instruments are systems and that
combine conventional integrated circuits with novel solid-state
components so they can interact with the physical environment. Such
systems can achieve cost and performance enhancements through
integration and miniaturization. Examples include a-Si:H photodiode
arrays, OLED-based microdisplays, integrated biological and chemical
detection systems, integrated optical and photonic systems, and
digital micromirror displays. A non-exhaustive list of materials
include those that can be incorporated into integrated circuits such
as (i) deposited semiconductors including a-Si:H and microcrystalline
silicon; (ii) OLED materials; (iii) chemically active and inert
conductors; and (iv) organic conductors; (v) biocompatible materials;
and (vi) magnetic thin films. This presentation briefly touches upon
recent trend in monolithic instrument device and applications and new
fabrication techniques that are CMOS fab compatible.
BIOGRAPHY
Jeremy Theil works on high performance a-Si:H photovoltaic modules for
multi-MW solar farm installations. Previously, he has worked at
Agilent Technologies and Hewlett-Packard where his focus was on
advanced process technologies for mixed signal integrated circuits,
and monolithic instrument technology and applications. While there, he
developed the state-of-the-art a Si:H photodiode array technology for
advanced CMOS imager applications. Prior to joining Hewlett-Packard,
he worked at Johnson Controls developing thin film gas diffusion
barriers. He received his Ph.D. in Materials Science and Engineering
from North Carolina State University, and is an author of more than 33
papers and 43 patents.
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