Issue on wire bonding of my sample

Hi all,

 

I got lots of replies when I asked about the connection between wire and elctrode pad yesterday. Thanks.

But there is a issue in wire bonding my sample. My sample is ceramic, so it is kind of brittle, and very thin (~60um). I'm a little afraid that ultrasonic vibration of wire bonder might break it. Does anybody have experience in wire bonding with this kind of sample ?

Thank you, all

 

 

Best,

Jihwan

--
Jihwan An
Ph.D. Candidate
Nanoscale Prototyping Laboratory (NPL)
Department of Mechanical Engineering
Stanford University, CA

cell : 650-862-0414
e-mail: jihwanan@stanford.edu