Need advice for using underlayer of 3612 photoresist to prevent sidewalls

Hi lab,

Does anyone have experience depositing a preliminary layer of 3612 photoresist and overexposing it at the beginning of the photolithography process in order to prevent sidewalls during liftoff? The idea is to get an undercut around the exposed patterns during developing. I'd prefer to do this without LOL.

Thanks,
Phil Van Stockum