Dear labmembers:
At the invitation of one of your fellow labmembers, representatives from Disco Hi-Tec will be here Wednesday, April 27 at 2 pm for a technical presentation about advances in laser dicing. This will be in the Allen 101/Linvill conference room. Here is a description of the presentation:
With recent advances in cutting, grinding, and polishing processes beyond abrasives, there is a great deal of enabling technologies suited to next generation products. Examples include Stealth Dicing, a completely dry, nearly particle free, high edge quality process using laser to singulate sensitive devices such as MEMS. Additionally, the drive for ultra thin wafers has produced several thinning and stress relief methods resulting in die thinner than 25um. This presentation will provide an overview of several new processes geared towards the unique requirements of cutting edge technologies.
All are welcome.
Your SNF Staff
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