Sunday, May 30, 2010

Re: odor in litho area



As of Sunday 1pm, there is very little smell/odor left Litho area, mostly around Blue M/Yes

To me it feels like the insulation of an overheard transformer

Ludwig



On Sat, May 29, 2010 at 4:27 PM, Arunanshu Roy <amroy@stanford.edu> wrote:
Does anybody know if the odour has cleared? Is the litho area safe for working now?


On Sat, May 29, 2010 at 8:57 AM, SangMoo Jeong <popomoo@stanford.edu> wrote:
Hi, labmembers.

I smelled a strange odor in the litho area, especially near YES oven region.
I have no idea where it comes from. Please be careful.



--
Sangmoo Jeong

Graduate student
Department of Electrical Engineering
Stanford University
Email: popomoo@gmail.com
Phone: 650-704-3295


Litho odor update ...

SNF Lab Members:

As of 8:45 Sunday morning, I can detect no odors in the lithography
areas. Note: as this is hay fever season, I may not be in possession of
the most sensitive detector. Should you detect a recurrence of that
odor, please report it. If it is a strong odor it is always safest to
leave the area.

Thanks,

John

Saturday, May 29, 2010

Re: odor in litho area

Does anybody know if the odour has cleared? Is the litho area safe for working now?

On Sat, May 29, 2010 at 8:57 AM, SangMoo Jeong <popomoo@stanford.edu> wrote:
Hi, labmembers.

I smelled a strange odor in the litho area, especially near YES oven region.
I have no idea where it comes from. Please be careful.



--
Sangmoo Jeong

Graduate student
Department of Electrical Engineering
Stanford University
Email: popomoo@gmail.com
Phone: 650-704-3295

Re: odor in litho area

Hi Labmembers...

The odor/smell is in the L100 aisle of the Litho area. Mainly in the trianle between the Yes Oven, ASML Stepper and Large Blue M oven. It does not appear to be a solvent or resist smell. It is like a burning smell. Checked all tools. None appear to be malfunctioning. Could not find source of smell. Notified SNF after hours cell phone and Stanford work control. Work control will contact appropriate people and investigate.

..Gary

----- Original Message -----
From: "SangMoo Jeong" <popomoo@stanford.edu>
To: labmembers@snf.stanford.edu
Sent: Saturday, May 29, 2010 8:57:44 AM
Subject: odor in litho area

Hi, labmembers.

I smelled a strange odor in the litho area, especially near YES oven
region. I have no idea where it comes from. Please be careful.

-- Sangmoo Jeong

Graduate student
Department of Electrical Engineering
Stanford University
Email: popomoo@gmail.com
Phone: 650-704-3295

odor in litho area

Hi, labmembers.

I smelled a strange odor in the litho area, especially near YES oven region.
I have no idea where it comes from. Please be careful.



--
Sangmoo Jeong

Graduate student
Department of Electrical Engineering
Stanford University
Email: popomoo@gmail.com
Phone: 650-704-3295

Re: Problem p5000etch SNF 2010-05-28 11:15:25: Error: Cannot vent the load chamber

Adjusted atm switch..

Friday, May 28, 2010

Lab Water Shutdown Scheduled for Monday, June 7

Dear Labmembers --


Facilities is planning repairs which will require shutdown of the
Process Chilled Water (PCW) system in the building. This is currently
scheduled for Monday, June 7, starting at around 7 am and will take
several hours to complete. PCW is used on many tools and subsystems.
It is also used for the air compressors for CDA (Clean Dry Air) which is
used to drive valves on most tools. So we anticipate that most tools in
the lab may be unavailable for use during this time. Some tools will
also require additional time to recover following PCW loss.


We want you to be aware of this so that you can plan accordingly -- and
will inform you of any changes in plans.


Thanks for your patience --

Your SNF staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Flexures In MEMS seminar - Roman Gutierrez - Tuesday June 1 4-5pm Allen/CIS-101X

Flexures in MEMS
Tuesday, June 1, 2010   
4:00-5:00 pm Allen 101X Auditorium

Roman Gutierrez
Tessera
Arcadia, California


Abstract

Flexures are commonly used in Micro Electro Mechanical Systems (MEMS) to introduce compliance into sensors and resonators, allowing them to respond to physical excitations such as acceleration, pressure, or electrostatic force. However, MEMS flexures can be used to serve a variety of additional purposes, including motion control, thermal coefficient of expansion (TCE) compensation and alignment. In optical products, such as MEMS based cell phone cameras, flexures enable MEMS to interface seamlessly with separate components manufactured using more traditional processes, such as plastic injection molding. This talk will present some of these unique flexure systems, and describe some of the considerations in their design. As an example, the MEMS flexures used in the cell phone camera for Motorola's Ming A1600 will be described.

Speaker Bio 

After 10 years at NASA's Jet Propulsion Laboratory working on high precision laser metrology and MEMS based gyroscopes, Roman Gutierrez co-founded SiWave (aka Siimpel) in 2000 to develop MEMS optical switches. The company was acquired by Tessera in 2010, and Roman continues as CTO/VP Engineering for the MEMS division. Mr. Gutierrez is a pioneer in the application of MEMS and Optics to new product development and has authored 52 issued patents and over 30 patents pending. He received his BS in Applied Physics from the California Institute of Technology, and his MS in Electrical Engineering from the University of California Santa Barbara.

Problem p5000etch SNF 2010-05-28 11:15:25: Error: Cannot vent the load chamber

process itself works normally, but this error appears on the display.

Re: Shutdown p5000etch SNF 2010-05-28 10:13:36: wafer did not drop on blade from chamber C

Cleared the error and resumed the process

Shutdown p5000etch SNF 2010-05-28 10:13:36: wafer did not drop on blade from chamber C

This error occurred

Thursday, May 27, 2010

pdms question

Hello labmembers,

Does anyone have experience working with PDMS? I am trying to get a small volume for an experiment involving liquid tension/viscosity. Thank you in advance.

 

Best Regards,

SonnyV

---------------

"What makes the desert beautiful," said the Little Prince ,"is that somewhere it hides a well ."

    _.--.  _

   ;,-   `' (            ,,,

  (  E#=====#############=: ]

   :_"'  ,._(         ```

     `--'         rock on    

Sonny Vo

Ph.d candidate

Department of Applied Physics, Stanford University

(626) 216-4597

Harris Research Group: http://snow.stanford.edu/index.html

 

sputtering porous films

Does anyone know of a campus resource for sputtering porous metals?
Metallica may be an option, but I do not have experience depositing
porous films with it. Specifically I need porous PtRu.

Thanks!
Jason

TODAY, 4:15pm: Special seminar - Prof. Alan Willner, USC

 

Special Seminar

Presented by the Stanford Optical Society

 

Towards Robust and Reconfigurable Optical Communication Systems

 

Alan Willner

Professor, Ming Hsieh Dept. of Electrical Engineering,

University of Southern California

 

Thursday, May 27, 4:15 PM, Applied Physics 200

Refreshments at 4:00 PM

 

Optical communications has enjoyed dramatic growth in terms of technical achievement as well as commercial implementation. This presentation will highlight three main topics.  Firstly, a broad perspective will be given on some of the technical trends in optical communication systems.  Secondly, I will describe technical issues related to stable, robust optical networking, including: performance monitoring to determine the cause of any data degradations, non-static channel-degrading effects, spectrally efficient modulation formats, targeted optical and electrical signal processing, and photonic switching.  Finally, I will discuss adding tunability, flexibility and reconfigurability to different aspects of the base optical technologies.

 

About the speaker:

Alan Willner received the Ph.D. from Columbia University, has worked at AT&T Bell Labs and Bellcore, and is Professor of EE at USC. He has received the NSF Presidential Faculty Fellows Award from the White House, Packard Foundation Fellowship, NSF National Young Investigator Award, Fulbright Foundation Senior Scholars Award, OSA Leadership Award, IEEE Photonics Society Distinguished Traveling Lecturer Award, USC University-Wide Award for Excellence in Teaching, IEEE Fellow, OSA Fellow, Eddy Paper Award from Pennwell Publications for the Best Contributed Technical Article, and Armstrong Foundation Award. Prof. Willner has been President of IEEE Photonics Society, Editor-in-Chief of IEEE/OSA Journal of Lightwave Technology, Editor-in-Chief of Optics Letters, Editor-in-Chief of IEEE Journal of Selected Topics in Quantum Electronics, Co-Chair of OSA Science & Engineering Council, General Co-Chair of CLEO, General Chair of LEOS Annual Meeting, Program Co-Chair of OSA Annual Meeting, and Chair of IEEE TAB Ethics Committee. He has 800 publications, including 25 patents and 2 books.

 

 

 

Wednesday, May 26, 2010

Reminder: PhD Oral Defense : Der-Song (Elvis) Lin, Thursday, May 27, 2010; 1pm, Packard 202

Department of Mechanical Engineering
University PhD Dissertation Defense


Interface Engineering of Capacitive Micromachined Ultrasonic Transducers (CMUTs) for Medical Applications

Der-Song (Elvis) Lin
Research Advisor: Professor B. T. Khuri-Yakub

27 May 2010 @1:00 p.m.
in
Packard Building, Room 202
(Delicious food at 12:45 p.m.)

Abstract

      Over the last decade, capacitive micromachined ultrasonic transducers (CMUTs) have been widely studied in academia and industry. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield.  Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored.  Two important interfaces of packaging that this defense explores are the interface between CMUTs and patients, i.e., device encapsulation, and the interface between CMUTs and electronics, i.e., full electronic integration of large scale 2D arrays.

      In the first part of the talk I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy.  While many other MEMS devices can be protected by hermetic sealing, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criteria very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than the room-temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Three designs, providing lens focusing, acoustic crosstalk suppression and flexible substrate, using PDMS layer were also demonstrated.

      The second part of the talk presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity (s = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer.
     
      Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system.  With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.


--
------------------------------------------
Elvis Der-Song Lin
Stanford University
Ginzton Lab.
Khuri-Yakub's Group
Stanford CA, 94305
e-mail: elvislin@stanford.edu
------------------------------------------

PhD Oral Examination - Saeroonter Oh, Friday, May 28, 2010, 10:00AM


Stanford University EE PhD Oral Examination

 

Modeling of III-V FETs for Beyond-22nm Logic Circuits

 

Speaker: Saeroonter Oh

Advisor: Professor H.-S. Philip Wong

 

Department of Electrical Engineering, Stanford University


Date: Friday, May 28, 2010

Time: 10 AM (Refreshments served at 9:45AM)

Location: Paul Allen Auditorium (CISX-101)

  

Abstract

  For beyond-22nm CMOS technology, III-V FETs are considered a compelling candidate for extending the device scaling limit of low-power and high-speed operation, owing to their superb carrier transport properties and recent experimental advancements. In this talk, device modeling and circuit analysis are used to study the key considerations for III-V logic circuits to be viable. One of the requirements for VLSI logic is device density. A study on device footprint scaling and the impact of parasitic elements on circuit performance is presented. A physics-based compact model for III-V FETs is introduced for accurate circuit-level performance estimation and digital circuit design. The model encompasses effects essential for logic applications that are not generally considered in other III-V models, such as field-dependent quasi-ballistic ratios, trapezoidal quantum-well energies, and capacitances with 2D potential information. We apply the compact model in various circuit environments to demonstrate the capability of the model and also to project performance and power trends for beyond-22nm technology. In particular, we study the circuit performance of sub-22nm SRAM circuits using III-V MOSFETs with high-k dielectrics and propose a minimum requirement for the III-V PMOS strength for All-III-V SRAM to be viable.

Reminder: PhD Oral Examination :: Andrew Graham (Thursday, May 27th, 9:00am)

Title: Methods for the wafer-scale encapsulation of MEMS

Advisor: Thomas W. Kenny
Date: Thursday, May 27th, 2010

Time: 9:00am (refreshments/snacks served at 8:45am)

Location: Allen Building/CIS-X Auditorium

 

Abstract:

 

The packaging of microelectromechanical systems (MEMS) is one of the most important design considerations in taking a product from a research environment to a commercial application.  It must not only provide a suitably clean and stable environment for the device, but it should also withstand any harsh post-processing steps (such as wafer dicing and wire bonding) needed to integrate the device into its final system.  As a result, the cost of packaging is typically a large portion of the overall cost of any commercial MEMS product. 

 

Addressing these needs for electrostatic silicon MEMS, we have developed multiple wafer-scale encapsulation techniques that allow for a wide range of devices to be fabricated in a single fabrication process.  Expanding on the thin film, 'epi-seal' encapsulation technique developed jointly by Stanford University and Bosch, a packaging method was developed that makes use of a thick sacrificial oxide deposition and planarization to allow for large lateral deflection structures side-by-side with proven narrow gap devices. 

 

In an effort to further increase the capabilities of wafer-scale encapsulation, a process combining fusion wafer bonding and epitaxial reactor sealing was also developed.  Unlike many packaging techniques using wafer bonding, the overall package size is only slightly bigger than the device itself and results in a stable, clean environment for the device.  The final encapsulated part consists of a single crystal silicon structure free of native oxide inside a single crystal silicon cap layer.  In addition, this encapsulation can support numerous process variations, such as oxide-coated composite device structures and the first MEMS devices packaged at the wafer scale using silicon migration. 

 

 

PhD Orals - Gaurav Bahl, Thursday, May 27, 2010; 4:30pm

Stanford University PhD Oral Examination - Gaurav Bahl
Department of Electrical Engineering

Title: Charge and Frequency Drift Control in Resonant Electrostatic MEMS

Research Advisor: Prof. Thomas W. Kenny
Date: Thursday, May 27, 2010
Time: 4:30 pm
Location: CIS-X 101 (Auditorium)


Abstract :

Dielectrics play an important role as structural and electronic
materials in many kinds of micro/nanoscale systems (such as CMOS and
MEMS). However, it is also well known that dielectrics are susceptible
to various charging phenomena. Charge build-up and charge motion can
vary floating voltages, discharge electrodes, or screen electrode
potentials, affecting the overall properties of these devices. In MEMS,
these effects can include unpredictable actuation forces, frequency
drifts, and deteriorated signal transduction.

In our group, recent work has shown that SiO2-coated silicon MEMS
resonators have very desirable frequency vs. temperature
characteristics, making them ideal as a lower cost, lower power
replacement for quartz resonators, for the purpose of clocks and
frequency references. However, as SiO2 is a dielectric, these resonators
are also susceptible to adverse effects due to dielectric charge.

In this talk I will present a model describing the effects of fixed and
mobile dielectric charge on the frequency of these resonators. Further,
I will show how purely AC polarization of these resonators improves
frequency stability by eliminating charge drift, and removes the first
order dependence on fixed charge-induced offsets. Finally, I will
discuss oscillator design with these AC polarized resonators, including
a number of interesting implications regarding these oscillators.

Tuesday, May 25, 2010

Anita Flynn seminar: flying nanorobots, 4 pm Allen 101X!!

All,

Neat seminar -- one of the nano air vehicles arrived via fedex this
morning and you'll be able to see it.

Roger

Flapping Nano Air Vehicles
Anita Flynn
MicroPropulsion Corp.
Berkeley, California
Abstract

This talk will present Team MicroPropulsion's results and lessons
learned from the DARPA Nano Air
Vehicle program, a challenge focused on designing a complete system for
delivering a 2 g drop-off
payload to a 1 km line-of-sight target (and return) by an aircraft
capable of hovering for one minute at the
target while communicating to a basestation, and yet able to fit in a
7.5 cm dia. x 7.5 cm long cylinder.
MicroPropulsion led a team of 3 universities, 7 small companies, 2
divisions of a government laboratory
and 3 independent consultants. Our team proposed a flapping solution,
for the purpose of natural stealth.
This talk will delve into the repurcussions of that choice, the
scientific inquiries made in its pursuit, and
all the engineering tradeoffs involving guidance, electronics, power,
motors and control.
The Flapping Nano Air Vehicle final report is available freely online at:
http://www.micropropulsion.com/pubs/publications.htm

Special seminar - Prof. Alan Willner, USC -- Thurs, May 27, 4:15 PM, AP200

 

Special Seminar

Presented by the Stanford Optical Society

 

Towards Robust and Reconfigurable Optical Communication Systems

 

Alan Willner

Professor, Ming Hsieh Dept. of Electrical Engineering,

University of Southern California

 

Thursday, May 27, 4:15 PM, Applied Physics 200

Refreshments at 4:00 PM

 

Optical communications has enjoyed dramatic growth in terms of technical achievement as well as commercial implementation. This presentation will highlight three main topics.  Firstly, a broad perspective will be given on some of the technical trends in optical communication systems.  Secondly, I will describe technical issues related to stable, robust optical networking, including: performance monitoring to determine the cause of any data degradations, non-static channel-degrading effects, spectrally efficient modulation formats, targeted optical and electrical signal processing, and photonic switching.  Finally, I will discuss adding tunability, flexibility and reconfigurability to different aspects of the base optical technologies.

 

About the speaker:

Alan Willner received the Ph.D. from Columbia University, has worked at AT&T Bell Labs and Bellcore, and is Professor of EE at USC. He has received the NSF Presidential Faculty Fellows Award from the White House, Packard Foundation Fellowship, NSF National Young Investigator Award, Fulbright Foundation Senior Scholars Award, OSA Leadership Award, IEEE Photonics Society Distinguished Traveling Lecturer Award, USC University-Wide Award for Excellence in Teaching, IEEE Fellow, OSA Fellow, Eddy Paper Award from Pennwell Publications for the Best Contributed Technical Article, and Armstrong Foundation Award. Prof. Willner has been President of IEEE Photonics Society, Editor-in-Chief of IEEE/OSA Journal of Lightwave Technology, Editor-in-Chief of Optics Letters, Editor-in-Chief of IEEE Journal of Selected Topics in Quantum Electronics, Co-Chair of OSA Science & Engineering Council, General Co-Chair of CLEO, General Chair of LEOS Annual Meeting, Program Co-Chair of OSA Annual Meeting, and Chair of IEEE TAB Ethics Committee. He has 800 publications, including 25 patents and 2 books.

 

 

 

Facilities work this morning

Dear labmembers --

The Facilities group will be flushing the process chilled water system
this morning. We don't anticipate problems, but as water pressure may
momentarily increase, there is a possibility that some equipment
subsystems may error. Maintenance are aware and reservations have been
made on the sensitive equipment. If you encounter any problems this
morning, please let staff know. Things should be flushed by 10 am.

Thanks for your attention --

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Monday, May 24, 2010

Daniel Soto PhD Dissertation Defense



Department of Applied Physics
University PhD Dissertation Defense


Force Space Studies of Elastomeric Anisotropic Fibrillar Adhesives


Daniel Ruben Soto

Research Advisor: Professor Thomas Kenny

26 May 2010 @ 3:30 P.M.

Allen Building (Formerly CIS-X), Room 101



ABSTRACT
Research into the climbing ability of the gecko lizard revealed an adhesive system fundamentally different from existing synthetic adhesives.  Instead of using a soft material, the gecko uses a complex system of hairs of beta-keratin, a material that is not tacky.  This unique architecture affords the adhesive characteristics that make it well suited for climbing.

Borrowing themes from the gecko, we developed a synthetic adhesive possessing similar properties using molded arrays of micron-scale silicone pillars.  These arrays demonstrate the gecko property of frictional adhesion where increased shear stress at the interface leads to increased normal load capacity.  To distinguish between intrinsic and emergent behavior, we also isolated single pillars to test on a dual-axis force-sensing cantilever capable of micro-Newton resolution.  We observed that gecko-like properties were observed for tapered pillars but not for pillars of uniform cross-section.

Most synthetic adhesive architectures use a uniform cross-section beam but these results suggest such a design does not capture gecko-like behavior.  These results point to ways to optimize the type of adhesion demonstrated by the synthetic dry adhesives and to create adhesives tailored for the application.


Reminder: PhD Oral Examination: Shankar Swaminathan (Thursday, May 27th, 9:30AM)

                                                                                                                         Nanoscale atomic-layer-deposited high-gate oxides on Germanium:

Interface engineering for highly-scaled MOS devices 


 Shankar Swaminathan 

Department of Materials Science and Engineering


Advisor: Dr. Paul C. McIntyre

Location: Bldg. 200 Rm. 002 (History Corner 200-002)

Date: Thursday, May 27, 2010

Time: 9:30 AM (refreshments served at 9:15 AM)


Germanium (Ge) has emerged as a promising candidate for surface channels in highly-scaled field-effect-transistors (FETs), as performance and reliability issues are likely to limit the use of conventional Si-based complementary-metal-oxide-semiconductor transistors. Lack of a high quality and stable thermal oxide of germanium has prompted interest in the use of high-k (high dielectric-constant) gate dielectrics on Ge channels. An interface layer (IL) between the high-k film and the Ge substrate appears to be necessary to avoid large defect densities characteristic of atomically-abrupt high-k (ZrO2 or HfO2)/Ge interfaces. Atomic layer deposition (ALD) is a useful high-metal oxide film growth technique due to the precise nature of thickness control and uniformity of thickness for very thin films.  The use of ALD to synthesize deposited ILs interposed between the Ge channel and an overlying high-k layer has not been studied extensively. In this context, we present three highlights from our work: 

First, we show that a pre-ALD surface functionalization by oxidant dosing improves the electrical characteristics of Pt/4nm ALD-Al2O3/p-Ge devices, as opposed to a conventional precursor-first ALD process. In situ x-ray photoelectron spectroscopy in the ALD ambient reveals the influence of hydroxyl (-OH) termination of the Ge surface in passivating dangling bonds that lead to fast trapping. The evolution of Ge-O bonding states during this pre-pulsing process is correlated with the observed improvements in hysteresis, frequency dispersion of the gate capacitance, and the passivation of fast (band-edge) and slow (midgap) interface states.

Second, we present findings on the effects of scaling the physical thickness of the ALD-Al2O3 (down to 1 nm) on important electrical parameters such as interface state density (Dit), capacitance density, fixed charge and leakage current density. The ultrathin-ALD-Al2O3 / Ge interface shows no apparent interfacial suboxide (GeOx) while retaining a low Dit of 2x1011 cm-2 eV-1, indicating the potential of ALD-Al2O3 as an interface passivation layer.

Aggressive gate capacitance scaling necessitates the use of so-called "higher-k" dielectrics such as TiO2 (k > 25). However, the conduction band offset (CBO) of the TiO2/Ge interface is very low (~ 0.2eV), resulting in high gate leakage. We demonstrate that ultrathin (~ 1 nm) Al2O3 ILs, owing to their large bandgap (~ 6.6eV), enhance the CBO at the TiO2/Ge interface, and reduce the gate leakage by 4 to 6 orders of magnitude at flatband. The Pt-gated bilayer devices exhibit excellent C-V characteristics down to a capacitance-derived EOT of 1.2 nm. The permittivity of the amorphous/nanocrystalline ALD-TiO2 films was in the range of 32-35. Forming gas annealing is beneficial in lowering the interface state density via formation of monolayer-thickness interfacial GeO2. Post-annealed devices exhibited a minimum Dit ~ 3x1011 cm-2 eV-1 near midgap. Finally, we show that thermally activated electron transport into shallow defect states in the TiO2 (~0.25eV below the CB edge) near the TiO2/Al2O3 interface appears to be responsible for a temperature-dependent dispersion of the accumulation capacitance density. The passivation of these defects is important to fully realize the potential of novel bilayer high-kgate stacks on germanium channels.




Sunday, May 23, 2010

Comment p5000etch SNF 2010-05-23 03:56:57: ChA helium leak comparison SSP vs DSP

I have single-side polished and double-side polished wafers with identical stacks... in ChA SSP gets sub 1.0 leak, while DSP are > 1.5 then get hazy/burnt resist around the entire wafer outer radius. all wafers have clean backsides. does that imply clamping force is too high or too low?

Saturday, May 22, 2010

PhD Oral Defense : Der-Song (Elvis) Lin, Thursday, May 27, 2010; 1pm, Packard 202

Department of Mechanical Engineering
University PhD Dissertation Defense


Interface Engineering of Capacitive Micromachined Ultrasonic Transducers (CMUTs) for Medical Applications

Der-Song (Elvis) Lin
Research Advisor: Professor B. T. Khuri-Yakub

27 May 2010 @1:00 p.m.
in
Packard Building, Room 202
(Refreshments at 12:45 p.m.)

Abstract

      Over the last decade, capacitive micromachined ultrasonic transducers (CMUTs) have been widely studied in academia and industry. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield.  Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored.  Two important interfaces of packaging that this defense explores are the interface between CMUTs and patients, i.e., device encapsulation, and the interface between CMUTs and electronics, i.e., full electronic integration of large scale 2D arrays.

      In the first part of the talk I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy.  While many other MEMS devices can be protected by hermetic sealing, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criteria very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than the room-temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Three designs, providing lens focusing, acoustic crosstalk suppression and flexible substrate, using PDMS layer were also demonstrated.

      The second part of the talk presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity (s = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer.
     
      Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system.  With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.


--
------------------------------------------
Elvis Der-Song Lin
Stanford University
Ginzton Lab.
Khuri-Yakub's Group
Stanford CA, 94305
e-mail: elvislin@stanford.edu
------------------------------------------

PhD Oral Examination :: Andrew Graham (Thursday, May 27th, 9:00am)

Title: Methods for the wafer-scale encapsulation of MEMS
Advisor: Thomas W. Kenny
Date: Thursday, May 27th, 2010
Time: 9:00am
Location: Allen Building/CIS-X Auditorium

Abstract:

The packaging of microelectromechanical systems (MEMS) is one of the most important design considerations in taking a product from a research environment to a commercial application.  It must not only provide a suitably clean and stable environment for the device, but it should also withstand any harsh post-processing steps (such as wafer dicing and wire bonding) needed to integrate the device into its final system.  As a result, the cost of packaging is typically a large portion of the overall cost of any commercial MEMS product.  

Addressing these needs for electrostatic silicon MEMS, we have developed multiple wafer-scale encapsulation techniques that allow for a wide range of devices to be fabricated in a single fabrication process.  Expanding on the thin film, 'epi-seal' encapsulation technique developed jointly by Stanford University and Bosch, a packaging method was developed that makes use of a thick sacrificial oxide deposition and planarization to allow for large lateral deflection structures side-by-side with proven narrow gap devices.  

In an effort to further increase the capabilities of wafer-scale encapsulation, a process combining fusion wafer bonding and epitaxial reactor sealing was also developed.  Unlike many packaging techniques using wafer bonding, the overall package size is only slightly bigger than the device itself and results in a stable, clean environment for the device.  The final encapsulated part consists of a single crystal silicon structure free of native oxide inside a single crystal silicon cap layer.  In addition, this encapsulation can support numerous process variations, such as oxide-coated composite device structures and the first MEMS devices packaged at the wafer scale using silicon migration.  

Friday, May 21, 2010

Comment p5000etch SNF 2010-05-21 18:42:35: Ch. B DC bias and He leak look good

Ran 6 wafers, 3 blank LTO oxide coating, 3 LTO w/ resist. DC bias -335 +/- 15 sccm for blanks LTO wafers, -310 +/- 10 for resist coated. He leak < 0.5 sccm

Flapping Nano Air Vehicles - Dr. Anita Flynn - Tuesday May 25 4-5pm - Allen/CIS-101X

Flapping Nano Air Vehicles
Tuesday, May 25, 2010
4:00-5:00 Allen 101X

Anita Flynn
MicroPropulsion Corp.
Berkeley, California

This talk will present Team MicroPropulsion's results and lessons learned from the DARPA Nano Air Vehicle program, a challenge focused on designing a complete system for delivering a 2 g drop-off payload to a 1 km line-of-sight target (and return) by an aircraft capable of hovering for one minute at the target while communicating to a basestation, and yet able to fit in a 7.5 cm dia. x 7.5 cm long cylinder.

The Flapping Nano Air Vehicle final report is available freely online at:
http://www.micropropulsion.com/pubs/publications.htm

After receiving her Ph.D. in EECS from MIT in 1995, Anita Flynn spent two years as a post-doctoral researcher and
lecturer in UC Berkeley's EECS Department. Since then, she has variously consulted, worked in start-ups, started
MicroPropulsion, collaborated with UC Berkeley's Smart Dust Group, and spent a year in UC Berkeley's
Mechanical Engineering Department as a visiting professor teaching smart product design. From Oct06 to Mar08,
MicroPropusion was one of four prime contractors in the DARPA Nano Air Vehicle program.

Thursday, May 20, 2010

Re: Comment p5000etch SNF 2010-05-19 13:46:42: this thing needs some TLC badly...

Archive

Re: Shutdown p5000etch SNF 2010-05-19 11:05:19: wafer on top of transfer arm

Recovered the wafer. Ran 8 wafers using the user's recipe (changed etch time from 1000 sec to 500 sec) with no problems.

RTAGAAS Going down

Hello All,
As part of the lab capability upgrade the remaining 210 RTA
-RTAGAAS will be going down on Tuesday June 1 to be replaced with 2each
AW610 rtas we are hoping downtime will be as short as possible but 1 to
2 weeks is likely. Please plan in advance.
During this time STSDEP will also be down for a couple of days for
gas line tie ins . Thank you in advance for your understanding as the
lab grows. ted

Wednesday, May 19, 2010

Comment p5000etch SNF 2010-05-19 13:46:42: this thing needs some TLC badly...

Shutdown p5000etch SNF 2010-05-19 11:05:19: wafer on top of transfer arm

Odor in Litho

At 11:30 pm, two labmembers report a strange odor in the litho area
described varyingly as chlorine-like and skunk-like. Please avoid or
limit your time in the area until the odor dissipates.

Thanks,

Mary

Tuesday, May 18, 2010

Monday, May 17, 2010

Found Stanford Postal Office Receipt

Dear All,

 

Did someone just drop a Stanford Postal Office Receipt?  Also found was a United States Postal Service Delivery Confirmation ticket.  If you need these two items please come to my cubicle #41.  I am right by the doors that face Applied Physic Building.

 

Maureen

 

Maureen Baran

Stanford Nanofabrication Facility

Lab Services Administrator

mbaran@stanford.edu

650-725-3664

 

Comment p5000etch SNF 2010-05-17 08:41:32: Ch. A is down

Down for a vacuum pump change.

Comment p5000etch SNF 2010-05-17 08:01:39: Chamber A PUMP

Pump needs replacing

Sunday, May 16, 2010

Process Clinic, Monday, 2-3:30

Greetings labmembers --


Just a reminder that there is a Process Clinic today (Monday) from 2-3:30
pm in the cubicle area outside of Maureen's office.

Staff and senior labmembers will be on hand to answer questions and brainstorm ideas
to address process issues. Bring your ideas, process questions, your
process runsheets, SpecMat request, device layouts, and whatever else.


Your SNF staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Calibration of MKS Vacuum Gauges(Model: 116A)

Hi All,

I am wondering if anyone has a user manual in your group or knows to
calibrate MKS Vacuum Gauge. The model in our lab is TYPE 116A
baratron, which is probably the first generation product of this
manufacturer, MKS. It is too old to find calibration information
online. If you happen to know how to calibrate it, please let me know.
Your help is really appreciated.

Best,
Henry

Calibration of MKS Vacuum Gauges(Model: 116A)

Hi All,

I am wondering if anyone has a user manual in your group or knows to
calibrate MKS Vacuum Gauge. The model in our lab is TYPE 116A
baratron, which is probably the first generation product of this
manufacturer, MKS. It is too old to find calibration information
online. If you happen to know how to calibrate it, please let me know.
Your help is really appreciated.

Best,
Henry

Comment p5000etch SNF 2010-05-16 12:29:00: Please watch Cl2

The chlorine sensor in the vault is showing a lot of noise which could trigger Cl2 shutoff (a new sensor is on order). We don't think it's likely, but please be aware.

Need borrow LOR 10B for lift-off

Dear all,
I was just wondering if anyone could kindly spare some LOR 10B.
I am also ordering a new bottle so that you could share it back if you like.
Thanks in advance,

--
------------------------------------------
Elvis Der-Song Lin
Stanford University
Ginzton Lab.
Khuri-Yakub's Group
Stanford CA, 94305
e-mail: elvislin@stanford.edu
------------------------------------------

Re: Problem p5000etch SNF 2010-05-10 22:34:49: still helium leakage too high in Chamber A

Changed large lip seal.

Re: Problem p5000etch SNF 2010-05-12 12:20:45: touch-screen pen not working well

Re: Comment p5000etch SNF 2010-05-12 16:34:23: higher He leak rate, ch. A

Changed large lip seal.

Re: Problem p5000etch SNF 2010-05-15 14:57:09: hi He leak

Vented chamber and arcing on the large lip seal and
pedestal quartz. Changed large lip seal and wiped
down chamber with water and ipa.

Saturday, May 15, 2010

Problem p5000etch SNF 2010-05-15 14:57:09: hi He leak

in chamber A process, He leak is about 9.2

Friday, May 14, 2010

Re: Problem p5000etch SNF 2010-05-13 20:00:14: Cooked wafer

Replaced burnt out insulator ring and wet cleaned the chamber.
We believe the root cause of the burnt insulator and the intermittent low bias readings is the quartz clamp. The quartz clamp that we just replaced is about 1.5 mm thicker than our spare clamp. This created a gap between the insulator ring and the quartz liner (when the clamp is in the process position). I believe the gap allowed plasma to form between the ring and the quartz liner.
We ran 16 wafers with no problems.

Re: Problem p5000etch SNF 2010-05-13 20:00:14: Cooked wafer

Replaced burnt out insulator ring and wet cleaned the chamber.
We believe the root cause of the burnt insulator and the intermittent low bias readings is the quartz clamp. The quartz clamp that we just replaced is about 1.5 mm thicker than our spare clamp. This created a gap between the insulator ring and the quartz liner (when the clamp is in the process position). I believe the gap allowed plasma to form between the ring and the quartz liner.
We ran 16 wafers with no problems.

Re: Problem p5000etch SNF 2010-05-13 19:54:42: DC bias unstable on ch. B

Replaced burnt out insulator ring and wet cleaned the chamber.
We believe the root cause of the burnt insulator and the intermittent low bias readings is the quartz clamp. The quartz clamp that we just replaced is about 1.5 mm thicker than our spare clamp. This created a gap between the insulator ring and the quartz liner (when the clamp is in the process position). I believe the gap allowed plasma to form between the ring and the quartz liner.
We ran 16 wafers with no problems.

PhD Oral Examination: Shankar Swaminathan (Thursday, May 27th, 9:30AM)

                                                                      Nanoscale atomic-layer-deposited high-k gate oxides on Germanium:

Interface engineering for highly-scaled MOS devices


 Shankar Swaminathan 

Department of Materials Science and Engineering


Advisor: Dr. Paul C. McIntyre

Location: Bldg. 200 Rm. 002 (History Corner 200-002)

Date: Thursday, May 27, 2010

Time: 9:30 AM (refreshments served at 9:15 AM)


Germanium (Ge) has emerged as a promising candidate for surface channels in highly-scaled field-effect-transistors (FETs), as performance and reliability issues are likely to limit the use of conventional Si-based complementary-metal-oxide-semiconductor transistors. Lack of a high quality and stable thermal oxide of germanium has prompted interest in the use of high-k (high dielectric-constant) gate dielectrics on Ge channels. An interface layer (IL) between the high-k film and the Ge substrate appears to be necessary to avoid large defect densities characteristic of atomically-abrupt high-k (ZrO2 or HfO2)/Ge interfaces. Atomic layer deposition (ALD) is a useful high-k metal oxide film growth technique due to the precise nature of thickness control and uniformity of thickness for very thin films.  The use of ALD to synthesize deposited ILs interposed between the Ge channel and an overlying high-k layer has not been studied extensively. In this context, we present three highlights from our work:

First, we show that a pre-ALD surface functionalization by oxidant dosing improves the electrical characteristics of Pt/4nm ALD-Al2O3/p-Ge devices, as opposed to a conventional precursor-first ALD process. In situ x-ray photoelectron spectroscopy in the ALD ambient reveals the influence of hydroxyl (-OH) termination of the Ge surface in passivating dangling bonds that lead to fast trapping. The evolution of Ge-O bonding states during this pre-pulsing process is correlated with the observed improvements in hysteresis, frequency dispersion of the gate capacitance, and the passivation of fast (band-edge) and slow (midgap) interface states.

Second, we present findings on the effects of scaling the physical thickness of the ALD-Al2O3 (down to 1 nm) on important electrical parameters such as interface state density (Dit), capacitance density, fixed charge and leakage current density. The ultrathin-ALD-Al2O3 / Ge interface shows no apparent interfacial suboxide (GeOx) while retaining a low Dit of 2x1011 cm-2 eV-1, indicating the potential of ALD-Al2O3 as an interface passivation layer.

Aggressive gate capacitance scaling necessitates the use of so-called "higher-k" dielectrics such as TiO2 (k > 25). However, the conduction band offset (CBO) of the TiO2/Ge interface is very low (~ 0.2eV), resulting in high gate leakage. We demonstrate that ultrathin (~ 1 nm) Al2O3 ILs, owing to their large bandgap (~ 6.2 eV), enhance the CBO at the TiO2/Ge interface, and reduce the gate leakage by 4 to 6 orders of magnitude at flatband. The Pt-gated bilayer devices exhibit excellent C-V characteristics down to a capacitance-derived EOT of 1.2 nm. The permittivity of the amorphous/nanocrystalline ALD-TiO2 films was in the range of 32-35. Forming gas annealing is beneficial in lowering the interface state density via formation of monolayer-thickness interfacial GeO2. Post-annealed devices exhibited a minimum Dit ~ 3x1011 cm-2 eV-1 near midgap. Finally, we show that thermally activated electron transport into shallow defect states in the TiO2 (~0.25eV below the CB edge) near the TiO2/Al2O3 interface appears to be responsible for a temperature-dependent dispersion of the accumulation capacitance density. The passivation of these defects is important to fully realize the potential of novel bilayer high-k gate stacks on germanium channels.



--
Shankar Swaminathan
Stanford Graduate Fellow '05
McIntyre Research Group
203P, McCullough (G-LAM)
Stanford University, CA
Ph: 650 796 6929

Thursday, May 13, 2010

Problem p5000etch SNF 2010-05-13 20:00:14: Cooked wafer

massive DC bias fluctuations. Wafer was burnt at both major and minor flats. Faint sound near chamber while running, sounds like motor is dying or something.
Please don't ignore this problem!

Problem p5000etch SNF 2010-05-13 19:54:42: DC bias unstable on ch. B

ran 2 wafers, "ch. B Jim-ox" yesterday and DC bias was stable: ~ -450-500V.
ran 10 wafers, "ch. B. Jim-OX" today and 8 of 10 wafers had unstable DC bias ranging from -500V to +50V, roughly.

Wednesday, May 12, 2010

Comment p5000etch SNF 2010-05-12 16:34:23: higher He leak rate, ch. A

wafers ran on 5/11 had He leak rates of 0.3 to 1.3sccm.
wafers ran today (5/12) has He leak rates of 2 ~ 3 sccm.

Seminar: Towards High Performance III-V Semiconductor Nanowire FETs and Nanolasers (May17, 2-3pm, Allen 338X)

Towards High Performance III-V Semiconductor Nanowire FETs and Nanolasers

 

Prof. Xiuling Li

Department of Electrical and Computer Engineering

University of Illinois, Urbana-Champaign

http://mocvd.ece.illinois.edu

 

Monday, May 17, 2:00-3:00pm

Allen (CIS) 338X

 

This talk focuses on two types of III-V compound semiconductor nanotechnology building blocks and their potential applications in nanoelectronics, nanophotonics, and MEMS/NEMS: III-V semiconductor nanowires (NWs) and nanotubes (SNTs).

 

Interest in semiconductor NWs have increased exponentially over the past several years because of their unique optical and electrical properties and the capability of producing high quality heterostructures with large lattice mismatch on the nanometer scale. Integration of semiconductor nanowire based devices has been problematic and usually requires the technologically disadvantageous (111) substrate for vertical nanowire devices or ex-situ assembly techniques to align planar nanowire devices. In the first part of the talk, I will present our discovery of a type of NWs that are twin-defect free, high carrier mobility, self-aligned, and transfer-printable. The planar nanowire growth and doping mechanism by MOCVD, as well as the output and transfer characteristics of a long channel MESFET using such GaAs nanowire as the channel material will be analyzed.

 

SNT on the other hand is an emerging field that has only caught limited attention, yet possesses the potential to provide a wide range of functionalities. It is formed by a combination of top-down and bottom-up approach through the self-rolling of strained thin films. This allows feasible large area assembly and integration with existing semiconductor technology, while maintaining the control of the tube size and heterojunction formation in the tube wall. In the 2nd part of the talk, I will discuss the formation process, large area assembly, and optical characterization of InxGa1-xAs/GaAs micro and nanotubes with active light emitting media incorporated in the tube wall. Device prospects of SNTs for nanophotonics and MEMS will be explored.

Biography: Xiuling Li received her Ph.D. degree from the University of California at Los Angeles. She joined the faculty of the University of Illinois in 2007, after working at a startup company for six years. She is currently an assistant professor in the Department of Electrical and Computer Engineering, and an affiliate faculty member of the Department of Materials Science and Engineering and the Beckman Institute. Her current research interests are in the area of nanostructured semiconductor materials and devices. She has won the NSF CAREER award (2008) and DARPA Young Faculty Award (2009). Her group's work on the planar nanowires has won one of the best student paper awards at the 2008 IEEE LEOS annual meeting. The micro and nanotube work has been identified as an outstanding symposium paper presented at the 2008 MRS meeting.

 

Hosted by: Prof. H.-S. Philip Wong

 

Problem p5000etch SNF 2010-05-12 12:20:45: touch-screen pen not working well

especially in bottom corners, where we alway need to delete non-existent wafer slots

Tuesday, May 11, 2010

Re: seminar - Tues 5/11, 4-5pm, Allen 101X - Michel Maharbiz - Building interfaces from the synthetic to the organic: cyborg beetles, antibody zippers and other things

Reminder of the exciting talk this afternoon... thanks

On 5/8/2010 3:19 AM, Peter Chen wrote:
> Tuesday, May 11, 4:00-5:00
> Allen 101X Auditorium
>
> Building interfaces from the synthetic to the organic:
> cyborg beetles, antibody zippers and other things
>
> Prof. Michel Maharbiz
> Dept. of EECS, UC Berkeley
>
> Abstract:
> The ongoing miniaturization of computation, sensing and communication
> coupled with advances in the understanding of biological process will
> fuel a push to engineer systems at the interface of the organic and the
> solid-state. In this talk, I'll give a brief overview of efforts in my
> group in these directions, with an intent to delve deeply into two
> topics: so-called 'cyborg insects' (or the remote radio control of
> insect flight) and antibody zippers, a nanochemomechanical device
> recently developed in my group.
>
> Bio:
> Michel M. Maharbiz is an Associate Professor with the Department of
> Electrical Engineering and Computer Science at the University of
> California, Berkeley. He received his Ph.D. from the University of
> California at Berkeley for his work on microbioreactor systems under
> Prof. Roger T. Howe (EECS) and Prof. Jay D. Keasling (ChemE). His work
> let to the foundation of Microreactor Technologies, Inc. which was
> recently acquired by Pall Corporation. Dr. Maharbiz has been a GE
> Scholar and an Intel IMAP Fellow. Professor Maharbiz's current research
> interests include building micro/nano interfaces to cells and organisms
> and exploring bio-derived fabrication methods. His group is also known
> for developing the world's first remotely radio-controlled cyborg
> beetles; this was named one of the top ten emerging technologies of 2009
> by MIT's Technology Review (TR10). Michel's long-term goal is
> understanding developmental mechanisms as a way to engineer and
> fabricate machines.

Reminder: Ph.D. Oral Examination: Mehmet Günhan Ertosun (May 14th, 10AM)

Title: Novel Capacitorless Single-Transistor DRAM Technologies
Research Advisor: Prof. Krishna Saraswat
Date: Friday, May 14, 2010
Time: 10:00 am
Location: CIS-X Auditorium (Allen Building)

Abstract:
The Dynamic random access memory (DRAM) industry has achieved miracles packing more and more memory bits onto ever smaller silicon die. But, the scaling of the conventional 1Transistor/1Capacitor (1T/1C) DRAM is becoming increasingly difficult, in particular due to the capacitor which has become harder to scale, as device geometries shrink.

Recently the capacitorless single-transistor (1T) DRAMs have attracted attention, due to its ability to achieve higher memory cell density and to solve the problems associated with the scaling of the capacitor. The information is stored as different charge levels at a capacitor in conventional 1T/1C DRAM, whereas the 1T DRAM employs floating body effects within the transistor to store the information without the need of the capacitor.

The absence of the capacitor is advantageous in terms of scalability, process and fabrication complexity, and compatibility with the logic processing steps, device density, yield and cost. Due to all these advantages of the capacitorless DRAM, and to solve the scaling problem of conventional 1T/1C DRAM, this work is focused on creating novel single transistor DRAM technologies.

The first device that is studied is vertical double-gate (DG) capacitorless single-transistor DRAM (1T VR DRAM). This device has advantages of being vertical with a small footprint, it can be integrated on bulk Si and being a double-gate device allows better electrostatic control of the channel and higher intrinsic device retention.

The second device that is investigated is a novel DRAM device: capacitorless single-transistor quantum well DRAM (1T QW DRAM), which employs energy-band engineering approach within the body of the transistor in order to create a "hole storage pocket" and "carrier distribution control layer" which results in superior device characteristics in terms of scalability and memory sensing window.

The third and the final device that is studied is also a novel DRAM device: capacitorless single-transistor charge trap DRAM (1T CT DRAM). The body of this device is engineered with the intentional charge traps so as to obtain a memory effect. This novel DRAM relies on the existence and absence of electrons within its body and uses a charge-trapping mechanism in its memory operation, unlike conventional 1T DRAMs that rely on holes and employ floating-body effects in its memory operation.

RSVP NOW! Alumni Careers Panel featuring Paul Wesling, Jeff Florendo, and Josh Baylor

Stanford MRS and Stanford IEEE
presents
Alumni Careers Panel

VIEWPOINTS
Insights from different career stages in MSE and EE

Thursday, May 13, 2010
In McCullough Bldg. Rm. 115
Starts at 5:30pm 

Limited Seating!  RSVP below by 5/11 for complementary dinner from Pluto's!

Wesling formal 2.jpg florando_jeff_150x193.jpg JB_headshot.jpg
Paul Wesling, Retired - 1966 BS Electrical Engr, 1968 MS Materials Sci/Engr
Jeff Florando, Engineer, LLNL – 1992 BS Ceramic Engr, 2002 PhD Materials Sci/Engr
Josh Baylor, Design Engineer, Intersil – 2006 BS Electrical Engr

If you have trouble viewing or submitting this form, you can fill it out online: 




Jammie Peng
Alumni Relations Director and E-Commerce Officer
Stanford Materials Research Society

Monday, May 10, 2010

Problem p5000etch SNF 2010-05-10 22:34:49: still helium leakage too high in Chamber A

Reminder: Ph.D. Oral Examination: Stefan Meister (May 12th, 10AM)

Title:
In situ TEM study of nanoscale phase-change memory cells

Advisor: Prof. Yi Cui
Time: Wednesday, May 12th at 10 AM (refreshments served at 9:45AM)
Location: CIS-X Auditorium

Abstract:
Phase-change memory (PCM) utilizes the large difference in resistivity
between the crystalline and amorphous phases of chalcogenide materials
to store information. Studies have shown excellent scalability, fast
switching speeds and high endurance making this technology a promising
candidate for future non-volatile memory. While industry is making
steady progress towards implementing PCM, there are still many open
questions concerning the operation of an actual device. For example, the
size and shape of the amorphous region in a working device is largely
unknown. Similarly, the critical threshold electric field required to
switch to the conductive state, is not well understood. Finally, PCM
devices often show large variability in their electrical behavior for
unclear reasons. To address these questions, we have developed a
technique to switch individual PCM cells inside a transmission electron
microscope allowing us to directly correlate electrical behavior with
structural changes. We demonstrate reversible switching of
Germanium-Antimony-Telluride (Ge2Sb2Te5) lateral phase-change cells and
show various degrees of amorphization which result in changes in
electrical behavior. Specifically, the electrical behavior is influenced
by the purity of the amorphous domain, which can vary from completely
amorphous to an amorphous matrix with a high density of nanocrystals
interspersed. We find that the makeup of the amorphous domain strongly
depends on the geometry of the bridge and the applied pulse. We measured
a threshold field of approximately 4 V/um, which is much smaller than
what has been reported by other experiments (30-55 V/um). These insights
can assist in the design of better lateral phase-change cells capable of
reproducible switching with minimal resistance fluctuation in each state.

Since it is not clear which material will ultimately show the best
properties for use in PCM and there is a need to make phase-change
materials in the nanoscale for fundamental investigations, we developed
the vapor-liquid-solid growth of GeTe phase-change nanowires (NWs). The
NWs show a large resistance contrast upon switching. With the in situ
TEM technique we discovered that the NWs can switch via a different
mechanism that consists of opening and closing of voids giving rise to
large differences in resistivity.