ALL chamber B recipes were set to 4T, which will cause
unsuspecting users to destroy the resist mask.
Whoever is doing this is risking everyone's wafers. These
parameters should always be left set to 8T.
In early 2008, at least one user had a very expensive wafer trashed by
a reduction of all backside He set to 4T.
So, two questions: Who changed ALL chamber B recipes to 4T,
(and didn't report it ?), and why is this significant change not captured by a
qualification of the tool?
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