Thursday, July 30, 2009
Re: Comment p5000etch SNF 2009-07-30 13:15:19: CH. C. pressure swing
Comment p5000etch SNF 2009-07-30 13:15:19: CH. C. pressure swing
Problem p5000etch SNF 2009-07-30 13:13:12: Endpoint PC cannot load program
Can't open /ENDPOINT/ENDPOINT.CAL
And stuck at the step "Calibrating Stepper B"
Wednesday, July 29, 2009
Problem p5000etch SNF 2009-07-29 13:06:39: CH. C. pressure swings wildly
Tuesday, July 28, 2009
Use of svgcoat and svgdev tracks
As you may know, particles and residue from the svgcoat tracks will
contaminate clean wafers. This not only causes defects on everyone's
wafers, but also can contaminate equipment. The ASML especially, will
fail when particles and residue are transferred to the wafer handling
system, causing bad focus and in severe cases, equipment failure. ASML
users are responsible for inspecting their own wafers before running on
the machine. But all users of the svgcoat and svgdev tracks are also
responsible for their use of those systems.
What you should do on the svgcoat or svgdev tracks:
1. Clean up after yourself, especially if you've dispensed thick
resist or did not use EBR or manually dispensed chemical. Cleaning
up means wiping down chuck, hot plate, and belts as needed. If you
are unsure how to clean, Staff would be glad to show you.
2. For wafers coated on both sides, bake the backside before coating
the frontside and make sure to bypass the hot plate (use an oven
bake.)
3. Inspect the track before you use it and after. If it's in bad
shape before you use it, contact the previous user to clean it up.
Or, clean it up yourself. Or, put it down for Staff to cleanup.
4. Do not use both coat tracks or both develop tracks when someone is
waiting.
Be aware the tracks will be inspected in the morning and evening. If
particles and residue are observed, everyone (yes, everyone) who has
enabled the tool since the last good inspection will be subject to
community service and possible disqualification. Please take a few extra
minutes to inspect the tracks when you are done. Your lab mates and
staff will greatly appreciate it.
Your SNF staff
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu
Monday, July 27, 2009
Missing wafer box with si pieces
Around 5pm I turned around to the table (between the RTAs and the
chemical transfer) where I left a couple of 4" wafer boxes with silicon
pieces only to find them missing! If you took these by accident, please
let me know. They contain diced silicon pieces on blue tape.
Best,
Tom
Problem p5000etch SNF 2009-07-27 03:35:49: ChA error
Comment p5000etch SNF 2009-07-27 01:03:15: Ch.C etch rate
Sunday, July 26, 2009
Re: Comment p5000etch SNF 2009-07-19 17:09:09: status UPdate please on Magnet for Chamber C
Re: Comment p5000etch SNF 2009-07-24 15:35:31: Ch.A is down
xReporter accounting reports ....
A couple of folks have pointed out that the "My accounting" report is
broken. It should be functional once again. However, there are some
changes to our accounting strategy that should not make any difference
in the amount that you are paying, but should provide you with some
better information. Let me explain:
For a number of years, we have used database stored procedures to
calculate your lab charges. They have the downside that they are not
terribly easy to find problems, not easy to modify, and not particularly
easy to see exactly what algorithm is used to calculate the charges. To
address these issues, Bill Murray has developed a system called XCRML
(for eXtensible Cost Recovery Markup Language) that, in particular,
allows the flexible specification of the algorithm that is used to
determine charges. Of course, if the numbers are the same, why am I
telling you this? There are a couple of things that you may notice and
may be of interest to you.
1. In the past, if you exceeded 160 hours of equipment usage in the
month, you would see a separate line item for both the "normal"
eq_activity charges and a separate line item for the equipment usage
beyond the 160 hour limit that was described as the "eq_surcharge".
From this point forward, you will see only a single eq_activity line
that represents both the "normal" and post-160-hour charges for
equipment usage.
2. We are now able to provide better accounting details that can provide
the effective cost of each and every equipment usage during the month.
Furthermore, this scales the cost of each equipment usage properly to
properly allocate the impact of the monthly cap to each individual
equipment activity.
So, under the Accounting section of the xReporter section, you used to
see one report named "My Accounting". That report is still there and
will provide the charges for a given month based on the old, stored
procedure calculations. If you wish, you can use that report to confirm
that the charges determined by that calculation are the same as you will
be charged by the new XCRML-based calculations.
You will also see two new reports: one named "My XCRML Accounting" and
one named "My XCRML Accounting Detail". The "My XCRML Accounting"
should look very similar to the old "My Accounting" report in that it
will give you subtotals for equipment charges (type = 'eq_activity'),
training charges, staff activity charges, inventory charges and
subscription charges. The "My XCRML Accounting Detail" report will give
you the full details, including every activity during the month and the
amount that you will be charged for that month.
We hope that this additional detail will be of use to you by allowing
you to see the effective charge (including capping) of each individual
activity.
Please let is know if you have any questions or problems running these
new reports.
Thanks,
John
Friday, July 24, 2009
Comment p5000etch SNF 2009-07-24 15:35:31: Ch.A is down
PhD Orals - Ali Fatih Sarioglu, July 24, 2009, 3:45 pm, Packard 101
<mailto:sarioglu@stanford.edu>
Title: Time-resolved Tapping-mode Atomic Force Microscopy
Date: Friday, July 24, 2009
Time: 3:45 pm (Refreshments at 3:30 pm)
Location: Packard Room 101
Abstract:
There is an increasing interest in the use of atomic force microscopy
(AFM) for quantitative mapping of material specific surface properties.
However, methods that have been developed for local stiffness
measurements generally suffer from low operational speeds and they apply
large forces to the surface limiting their resolution and use on soft
materials such as polymers and biological samples. On the other hand,
tapping-mode AFM, which is well suited to soft materials due to its
gentle interaction with the surface, cannot be used to recover
information on the tip-sample interaction (and hence, on the material
properties) due to limited bandwidth of the AFM probe.
In this talk, a technique for rapid quantitative material
characterization with nanoscale spatial resolution will be introduced.
This technique is based on time-resolved measurement of tip-sample
interaction forces during tapping-mode AFM imaging by a special
micromachined AFM probe. In this probe, a high-bandwidth interferometric
force sensor at the end of the cantilever is coupled to the tip motion
and is used to resolve tip-sample interaction forces with high
sensitivity and temporal resolution. Combined with a real-time signal
processing software that we developed, these probes provide quantitative
maps of peak interaction forces and elastic properties simultaneously
with conventional AFM data. High-contrast compositional mapping,
quantitative peak force imaging and quantitative material
characterization by mapping surface Young's modulus acquired using this
system will be demonstrated on various samples.
Thursday, July 23, 2009
Re: Comment p5000etch SNF 2009-07-22 22:06:52: Problem with wafer loading
Comment p5000etch SNF 2009-07-23 14:59:26: Update Ch.C magnet driver
REMINDER EBEAM LAB TOWN HALL MEETING -- THURSDAY JULY 23, 2009 3:00 - 4:30 pm CIS 201
Nano-bowtie written using FIB on a RAITH IonLINE by Anika Kinkhabwala
Ebeam Town Hall Meeting Announcement:
TODAY Thursday July 23, 2009 from 3:00 to 4:30 PM we will be holding an Ebeam Town Hall Meeting for all interested SNF Ebeam Labs Users in CIS 201
1. Discussion on Ebeam Lab Policies in place with proposed changes, additions, or deletions to our lab policies... 10 minutes
-fast review of the reservation and equipment usage policies for the Ebeam tools.
2. SPECIAL SPEAKER: PAUL RISSMAN --- 45 + 15 minutes for Q&A.
Paul Rissman will give a presentation on details of Electron Beam Exposure Proximity Correction methodologies.
Paul has a wealth of experience in this area having modeled and developed methods for EPC since 1979.
He will show examples of several modeling and EPC design tools results.
It is hoped that all Ebeam Lab members will be able to attend and add to these discussions!
Thank you for your support!
James Conway
Stanford Nanofabrication Facility
Wednesday, July 22, 2009
Comment p5000etch SNF 2009-07-22 22:06:52: Problem with wafer loading
Tuesday, July 21, 2009
Re: Problem p5000etch SNF 2009-07-16 18:34:26: ch a helium leak rate too high error
Comment p5000etch SNF 2009-07-21 15:40:26: Magnet Driver
Will update as soon as we have an eta.
ANNOUNCEMENT EBEAM LAB TOWN HALL MEETING -- THIS THURSDAY JULY 23, 2009 3 - 4:30 pm CIS 201
Nano-bowtie written using FIB on a RAITH IonLINE by Anika Kinkhabwala
Ebeam Town Hall Meeting Announcement:
THIS Thursday July 23, 2009 from 3:00 to 4:30 PM we will be holding an Ebeam Town Hall Meeting for all interested SNF Ebeam Labs Users in CIS 201
1. Discussion on Ebeam Lab Policies in place with proposed changes, additions, or deletions to our lab policies... 10 minutes
-fast review of the reservation and equipment usage policies for the Ebeam tools.
2. SPECIAL SPEAKER: PAUL RISSMAN --- 45 + 15 minutes for Q&A.
Paul Rissman will give a presentation on details of Electron Beam Exposure Proximity Correction methodologies.
Paul has a wealth of experience in this area having modeled and developed methods for EPC since 1979.
He will show examples of several modeling and EPC design tools results.
3. Additional Items To-Be-Added -- 20 minutes.
It is hoped that all Ebeam Lab members will be able to attend and add to these discussions!
Thank you for your support!
James Conway
Stanford Nanofabrication Facility
Re: Comment p5000etch SNF 2009-07-20 17:16:03: Backside He
Ch.A - He leak rate @ 8 Torr is 3.5 sccm
Re: Comment p5000etch SNF 2009-07-20 14:51:45: Update He rate high
Ch.A - He leak rate @ 8 Torr is 3.5 sccm
Re: Problem p5000etch SNF 2009-07-19 18:23:13: He rate high
Ch.A - He leak rate @ 8 Torr is 3.5 sccm
Monday, July 20, 2009
Comment p5000etch SNF 2009-07-20 17:16:03: Backside He
unsuspecting users to destroy the resist mask.
Whoever is doing this is risking everyone's wafers. These
parameters should always be left set to 8T.
In early 2008, at least one user had a very expensive wafer trashed by
a reduction of all backside He set to 4T.
So, two questions: Who changed ALL chamber B recipes to 4T,
(and didn't report it ?), and why is this significant change not captured by a
qualification of the tool?
Learn to save someone's life!
There are two spaces left in a First Aid/CPR/AED class to be
held at SNF on Wednesday, July 22, from 8 am-4 pm and enrollment
will be open to Stanford students and staff. If you are
interested in attending, please send me an email.
Mary
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu
Comment p5000etch SNF 2009-07-20 14:51:45: Update He rate high
PhD Orals - Jung-Yong Lee, July 23, 2009, 9:30am
Metal Nanostructures in Optoelectronic Devices
Jung-Yong Lee
Ph.D. Oral Examination
Department of Electrical Engineering
Stanford University
Advisor: Peter Peumans
Date: Thursday, July 23, 2009
Time: 9:30am (Refreshments at 9:15am)
Location: Paul G. Allen Building Auditorium
Abstract
In the first part, we consider the trade-off between optical absorption and internal quantum efficiency in thin-film photovoltaic (PV) cells. Metal nanoparticles (MNPs) have been used to alleviate this trade-off by enhancing optical absorption in thinner films. We extended Mie's approach to estimate the absorption and scattering efficiency of MNPs embedded in an absorbing medium. This theory predicts the spatially localized and spectrally broadband optical absorption enhancement. Experimentally, we show that incorporating MNPs in organic photovoltaic cells leads to an increase in power conversion efficiency by up to 40%.
In the second part of this talk, we focus on transparent conductors, which are essential components of thin-film optoelectronic devices. Sputtered Indium-Tin-Oxide (ITO) is currently the most commonly used transparent electrode material, but it has a number of shortcomings. I will discuss the possibility of using metal gratings and metal nanowires as a replacement for ITO. It is shown that random silver nanowire meshes have electrical and optical properties that are comparable to those of ITO (15 Ω/☐ sheet resistance and 85% solar spectral weighted transmission). We also show that silver nanowire meshes are compatible with flexible substrates and stable when encapsulated. We demonstrate organic photovoltaic cells grown on silver nanowire meshes with characteristics similar to those grown on ITO. Semi-transparent organic photovoltaic cells using laminated silver nanowire meshes are presented both as an important application in itself and as a stepping stone toward multi-terminal multi-junction (MTMJ) PV cells. As opposed to conventional multi-junction (MJ) PV cells, MTMJ PV cells are not restricted by current matching constraints. Therefore, MTMJ PV cells are more robust to fabrication imperfections and spectral changes. We discuss a MTMJ PV cell using P3HT:PCBM bottom cell and CuPc/C60 top cell. In organic light emitting devices (OLEDs), random metal nanowires meshes provide a simple and efficient way to extract more photons out of the devices while also providing a transparent contact.
Finally, we analyze the performance limits of silver nanowire meshes by modeling the sheet resistance of random wire networks, and show that it is dominated by the wire-wire contact resistance (estimated to be 200 Ω). We show that if the contact resistance can be reduced (<< 10 Ω), or if the nanowire length can be increased (>>20µm), the sheet resistance of silver nanowire meshes can be reduced to <2 Ω/☐ for a solar spectral weighted transmission >85%.
Jung-Yong
Sunday, July 19, 2009
Problem p5000etch SNF 2009-07-19 18:23:13: He rate high
It looks like the high helium rate was "fixed" by lowering the
Helium pressure to 4T.
This happened a year ago, and trashed a bunch of people's wafers, and I thought after that it was clear that this is not an acceptable "fix".
Comment p5000etch SNF 2009-07-19 17:09:09: status UPdate please on Magnet for Chamber C
Friday, July 17, 2009
Coral Outage
We have just recovered from a coral outage. Actually, all the
computers went down including the web site, email, ... A circuit was
blown will a plumbing repair was being made in the computer
room. The limited testing indicates we are back to normal.
Regards,
SNF Staff
Thursday, July 16, 2009
MF26A Developer back online
The SVG Developers have been converted back to MF26A developer for all developer processes. All needed program changes have been made and tested. Please continue to verify the programs against the laminated program sheets. Please contact us if you have any questions or concerns regarding the SVG Developers.
Thanks.. Gary
Wednesday, July 15, 2009
Re: Problem p5000etch SNF 2009-07-08 23:32:30: CH.A Error
flowing.
Re: Comment p5000etch SNF 2009-07-14 14:08:16: Update Ch.A pressure
at 200mt with bcl3 , cl2 and n2 flowing 40,30 and 40 sccm.
Re: Problem p5000etch SNF 2009-07-14 14:08:50: Ch.A down for vacuum pump
University Oral Examination: Pei-Chen Su (Friday, July 17, 3:45pm)
Thin Film Solid Oxide Fuel Cells for Intermediate Temperature Operation
Pei-Chen Su
Ph.D. University Oral Exam
Department of Mechanical Engineering, Rapid Prototyping Laboratory, Stanford University
Advisor: Fritz B. Prinz
Date & time: 7/17/2009 3:45 pm (Refreshment 3:30 pm)
Location: MERL 2nd Floor Conference Room
Abstract
Solid oxide fuel cells (SOFCs) efficiently convert chemical energy directly to electricity, with only water as product. SOFCs are typically built in large scale and for stationary applications, due to the high operating temperature (600 to 1000 °C). Several efforts have focused on reducing the operating temperature, either with thinner electrolyte or enhancement of catalyst/electrolyte interfaces. In particular, thin film electrolyte significantly reduces the ohmic resistance of SOFCs and allows intermediate temperature operations (300 to 500 °C).
In this talk, three fabrication methods for nano thin film electrolyte SOFCs will be presented. In the first, thin-film SOFC structures containing electrolyte membranes of only 50 nm thickness were fabricated with sputtering, lithography, and etching. The micro SOFCs were made of yttria-stabilized zirconia (YSZ) electrolyte and 80 nm thick porous Pt as cathode and anode. The peak power density at 350 °C was 131 mW/cm2. The high power densities achieved are not only due to the reduction of electrolyte thickness but also to the high charge-transfer reaction rates at the interfaces between the nanoporous electrodes (cathode and/or anode) and the nanocrystalline thin electrolyte.
In the second method, a low temperature micro SOFC with corrugated electrolyte membrane was developed and tested. To increase the electrochemically active surface area, yttria-stabilized zirconia membranes with thickness of 70 nm were deposited onto pre-patterned silicon substrates. Fuel cell performance of the corrugated electrolyte membranes released from silicon substrate showed an increase of power density relative to membranes with planar electrolytes. Maximum power densities of the corrugated fuel cells of 677 mW/cm2 and 861 mW/cm2 were obtained at 400 and 450 °C, respectively.
Finally, a design and fabrication of micro-SOFC array with high surface area density will be presented. The structure consists of a corrugated nano thin film electrolyte and a silicon supporting layer on a two-stage wafer through hole. The goal is to maximize the surface area within a given volume to obtain high absolute power output. An array of total 500 thousands fuel cells with 65 nm thick electrolyte was tested in parallel without a single membrane failure.
Tuesday, July 14, 2009
Comment p5000etch SNF 2009-07-14 14:08:16: Update Ch.A pressure
Monday, July 13, 2009
Process Clinic and the Metal And Furance Quality Circle Meetings Have Been CANCELLED
Dear All,
The Process Clinic and the Metal and Furnace Quality Circle Meetings have been cancelled for this week. Please excuse the short notice, they will be back on the schedule soon.
Maureen
Maureen Baran
Stanford Nanofabrication Facility
Lab Services Administrator
mbaran@stanford.edu
650-725-3664
Sunday, July 12, 2009
Problem p5000etch SNF 2009-07-12 05:23:42: CH.A Pressure Error and particles
Also still see particles, although better than last week.
Please help. Thanks!
Friday, July 10, 2009
Learn to save someone's life!
There will be a First Aid/CPR/AED class held at SNF on Wednesday, July
22, from 8 am-4 pm and enrollment will be open to Stanford students and
staff here. If you are interested in attending, please send me an email.
Mary
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu
ASML mask for optical waveguide
Thursday, July 9, 2009
Maskless Patterning: Presentation Today (Thurs), 7/9, 1:30 pm, 101X
Greetings labmembers: Our esteemed Gary Yama is hosting a presentation by Intelligent Micro Patterning, a company that manufactures the SF-100 maskless photolithography system. This is a UV-direct-write system which allows you to expose photosensitive substrates without a mask, with feature sizes down to one micron. The substrate surfaces can be curved as well as flat. This technical presentation will take place today, Thursday, July 9, at 1:30 pm in the Allen 101X auditorium. More information about this system can be found on the company website at: http://www.intelligentmp.com
-- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang@stanford.edu http://snf.stanford.edu
Problem p5000etch SNF 2009-07-09 02:25:28: particles
Wednesday, July 8, 2009
Problem p5000etch SNF 2009-07-08 23:32:30: CH.A Error
Tuesday, July 7, 2009
Gasonics
I'm looking for anyone who can show m how to use Gasonics Aura asher. You name the date and time and I'll bring the wafers. Many thanks.
Mike M (Maloney1)
Michael T. Maloney
Postdoctoral Scholar
Department of Neurology and Neurological Sciences
Stanford University School of Medicine
P222 MSLS
ph: (650) 498-8112
Fire Extinguisher Training Class, Friday, July 10, 1:30 pm
Alison Pena, from the Stanford Fire Marshall's office, will be giving a
one hour class on how to deal with lab and other fires. This will be held
this Friday, July 10, at 1:30 pm, in Allen 338X.
The training will take about one hour and consists of a brief
presentation and video, followed by hands-on practice with a fire
extinguisher on a controlled burn. It's fun -- and good skill to know in any
environment.
Space is still available. If interested, send me an email.
Thanks for your attention!
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu
Monday, July 6, 2009
Problem p5000etch SNF 2009-07-06 13:56:27: HBr is not available
Sunday, July 5, 2009
Re: Problem p5000etch SNF 2009-07-01 23:18:15: helium leakage failure
a couple of dummy wafers and b/s he leak is .3sccm.
Saturday, July 4, 2009
SNF gowning room sliding door
The sliding door between the gowning room and the lab appears to be
acting up. The door, however, can be slid open and shut by hand, so lab
access (and safety) are OK. Please do be gentle in sliding the door
side to side (it has a breakaway feature when pushed forward.) We have
asked Facilities to look at this Monday morning.
Thanks for your patience --
Your SNF staff
Thursday, July 2, 2009
Fire Extinguisher Training Class, Friday, July 10, 1:30 pm
Alison Pena, from the Stanford Fire Marshall's office, will be giving a
one hour class on how to deal with lab and other fires. This will be held
this Friday, July 10, at 1:30 pm, in Allen 338X.
The training will take about one hour and consists of a brief
presentation and video, followed by hands-on practice with a fire
extinguisher on a controlled burn. It's fun -- and good skill to know in any
environment.
Preregistration is required, with preference given to active labmembers
and building occupants. If interested, send me an email.
Thanks for your attention!
--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu
Wednesday, July 1, 2009
Problem p5000etch SNF 2009-07-01 23:18:15: helium leakage failure
Re: Problem p5000etch SNF 2009-07-01 12:46:17: Error: helium leak rate too high
o-rings
citric acid
Does anyone have a couple hundred mL of citric acid that I could use? I
desperately need some tomorrow and the chemical supplier is out of stock.
Thanks,
Tom
Problem p5000etch SNF 2009-07-01 12:46:17: Error: helium leak rate too high
Some of Raja's Treats are still available...
Dear All,
Raja still have a few items left to sell. I have them at my desk and I will be able to help you purchase them after 1:00P. I am in cubicle # 41 closest to the doors that face the Applied Physics Building.
Please remember it’s for a very good cause.
Maureen
Maureen Baran
Stanford Nanofabrication Facility
Lab Services Administrator
mbaran@stanford.edu
650-725-3664