Hi labmembers,
We're experimenting with various options for wafer bonding, and someone has told me that photoresist can be used as a resilient adhesive if it is baked for a long period of time post-adhesion. Is there anyone who can provide me with more details on this process? Specifically, I'm interested in the temperature and time you bake the bonded samples and whether the bond holds up to subsequent later liftoff procedures, etc.
Thanks so much,
Stephanie Claussen
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