Wednesday, November 30, 2011

Comment p5000etch SNF 2011-11-30 20:20:49: No PR burning after two dummy wafers

Comment p5000etch SNF 2011-11-30 20:19:37: No PR burning after two dummy wafers

Comment p5000etch SNF 2011-11-30 19:21:49: resist burn in chamber B

I ran a few wafers with recipe Jim_Ox for 150 sec.

new fiji ald system brought into the snf this am

with assistance from mike dickey, scott lee, and chaitanya gupta we got the new fiji3 ald system into the snf this morning.  you will see it sitting by the epi2.  it is still on its moving wheels to accommodate easy positioning, so note that it is not anchored down yet.  we expect this tool to be outfitted and come online in the spring of 2012 to complement the other ald systems by providing more ald (plasma or thermal) of oxides with an open cleanliness classification similar to fiji2.

j

Re: Problem p5000etch SNF 2011-11-30 02:28:13: Ch A - BCl3 stabilization problem

Reset the gas cylinder chiller.

Problem p5000etch SNF 2011-11-30 02:28:13: Ch A - BCl3 stabilization problem

Ran Ch A Metal recipe but the BCl3 flow varied greatly (30sccm to 90sccm) and the pressure was not stable. Since the process gases never stabilized, I could not run the recipe.

Tuesday, November 29, 2011

Bake Sale for a Good Cause - Here in the Allen Building

www.insightworldaid.org

 

What:  BAKE SALE…I know what you’re thinking wow, when the last time we had a bake sale.  We were thinking the same thing so; we decided to have a bake sale.   

 

Who:  Friends of SNF are putting together this incredible eatable bake sale

 

When:  Tuesday, December 6th from 8:00A to 1:00P

 

Why:  Because this is the season to do good things for those less fortunate

 

Where:  Nancy Latta’s Office #145 on the first floor of the Allen Building

 

 

Please come by and support your SNF Staff and Friends and purchase often through the morning and lunch hour.

 

Sincerely,

 

Maureen

 

On behalf of the SNF Staff and Friends of SNF

 

 

 

 

Annual Holiday Party! Friday, Dec. 2, 1-3 pm

Greetings!

You are invited to the annual Allen Building holiday party, this Friday, Dec. 2, from 1-3 pm.
This will be in the Allen building, just outside the yellow window area of the lab.
Enjoy snacks, traditional games (the famous "wafer toss"), create your own silicon wafer
ornament, and just spend some time reconnecting before heading off for the holidays.
Stop on by for an afternoon break (generously sponsored by the CIS Affiliates.)


Your CIS party committee

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Monday, November 28, 2011

Tool Shutdown Schedule

Dear labmembers --

Renovation Countdown: 16 days!

As you know, the lab becomes a construction zone starting Thursday, Dec.
15. In preparation for construction, staff will need to ensure that all
equipment is safe (all toxic gases are purged from tools and process
lines, wet benches decontaminated) and ready for an extended shutdown
(chambers cleaned, pumps PM'ed, etc.) Also, all small tools, like
microscopes, will be removed from the lab. With over 100 tools in the
lab, we'll need to stage all these activities to ensure a smooth,
on-time handover. Attached is the current plan for tool shutdown.
Hopefully, this will help in your planning for any activities in
December -- please be aware this schedule is subject to change, but that
any changes will be communicated via regular updates and on Coral.


Thanks for your patience as we ramp up our shutdown plans.

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: Shutdown p5000etch SNF 2011-11-26 00:37:48: wafer slipped off in tranfer chamber

Recovered the wafer. Cycled 4 wafers with no problems.

Re: Comment p5000etch SNF 2010-12-06 14:38:26: Installed a new clamp in Ch.B

Archived

Re: Comment p5000etch SNF 2010-09-24 14:18:50: Qual for CH A

Archived

Saturday, November 26, 2011

Friday, November 25, 2011

Re: Problem p5000etch SNF 2011-11-24 04:33:57: Ch. C handler timeout

No problem found. Ran wafers using Ch.C Jim DP trch with no problems.

Thursday, November 24, 2011

Infra-red imaging solutions

Dear Labmembers,

Happy Thanksgiving!

May I know if anyone has access to an infra-red imaging camera or know
if any such facility exists on campus?

Thanks in advance for any replies!
Ben

--
Benjamin Tee
Ph.D Candidate, Electrical Engineering
Stanford University
Cell: 650-704-4300
M.S (EE) Stanford University '07
B.S.E (EE) University of Michigan - Ann Arbor '06
Bao Research Group - http://baogroup.stanford.edu
Address:
381 North South Mall Rm 209
Stanford CA 94305
USA

Problem p5000etch SNF 2011-11-24 04:33:57: Ch. C handler timeout

After processing in Ch C (Si), wafers took a long time to come out, sometimes with timeout errors:
"Ch C valve did not open in maximum allowed time"
"Ch C wafer lifter did cannot reach release position within timeout"
"Process chamber failed with error code 236"
Had to abort automatic mode and manually return the wafers. Chamber was also sometimes stuck "waiting for blade in" and had to be reset.

Wednesday, November 23, 2011

Re: Problem p5000etch SNF 2011-11-22 16:50:11: HT EX fault in Chamber B

Reset the heat exchanger. Cycled wafer without problems.

Re: Problem p5000etch SNF 2011-11-22 17:48:22: Ch B has HT EX fault error, won't run

Reset the heat exchanger. Cycled wafer without problems.

Imina Technologies miBots Nanomanipulation Workshop

All,

While you are resting up over the long weekend, now would be a great
time to sign up for the miBots Workshop.

The SNF Staff in conjunction with Imina Technologies is pleased to present:

NANOMANIPULATION WORKSHOP

Monday December 5, 2011

The miBots™ are coming! Do you have a need for manipulation or sensing
small samples in a microscope? If so, we invite you to see these novel
nanopositioners for yourself at the Stanford NanoFabrication Facility in
a FREE, hands-on workshop on December 5th in the Paul Allen Building,
Auditorium Room 101X. Designed especially for light microscopy, SEMs and
FIBs, these affordable, easy-to-use mini robots are virtually untethered
and free to move independently, opening new vistas for manipulation and
testing at the macro, micro, or nanoscale. Working individually or in
groups, the miBot™ uses a variety of tools such as grippers, probes, and
optical fibers so that, in addition to manipulating the sample, they can
illuminate a nano workspace and conduct force or electrical
measurements. Robust, mechanically and thermally stable, and
vacuum-ready, these tiny trojans are a great, customizable solution for
maneuvering and testing cells, nanostructures, semiconductor devices,
LEDs, and MEMs.

miBots will be working in the Paul Allen Building, Auditorium Room 101X
from 10 AM till Noon.

For more information, or to register for workshop, click here
http://imina.ch/events/registration-form-workshops-california-december-2011.
Imina will contact you in the week before the workshop to confirm and
provide a map and directions.

Want to learn more? Visit us at www.imina.ch or give Tom Levesque a call
at (972) 318-0196.

Regards, SNF Staff

High pressure and High Temp Anneal

Hi all,

 

I would like to have some wafers to be annealed in High pressure (>=100bar) and high temperature (1000C-1400C) at N2 ambient, does anyone know any company or institute provide such service?

Your input and comments will be much appreciated.

 

Wish you all have a great thanksgiving holiday!

Gavin

Tuesday, November 22, 2011

Renovation countdown: 23 days!

Dear labmembers --

You may have noticed a number of people walking around the building in
construction helmets and orange vests. Construction is well underway in
the basement and in the area above the lab. Here's a quick update of
activities which may be relevant to your work here.

The former CAD room will soon house the new maintenance office area and
workshop. The ASML emulator and CAD desktops are now located in the
cube area near the Maureen's office. The probe
station/micromanipulator6000 is now located in room 144, near the cube
area (thanks to Andreas for setting it back up and even cleaning the
dust!) These are still available for your use - please remember to
clean up when you are done.

We hand over the keys to the lab to contractors on Thursday, Dec. 15. To
make equipment safe to exist in a construction zone, process gases will
need to be purged, wet benches drained and rinsed, microscopes will be
removed, etc. All this takes time, so tools will be shutdown in the
days leading up to 12/15. We should have a schedule of planned tool
shutdown early next week, to help plan your work in December accordingly.

Please remember to remove all your personal items from bins and WIP
shelves by the morning of Monday, Dec. 12. Items left in the lab will
be removed by staff. (Remember, this will be a construction zone - any
damage to equipment will be covered by liability, but damaged masks and
wafers will not be.) There will be no bin charges in December; bins
will assigned again when the lab reopens.

Lastly, the red lockers can be used for storing personal items, but they
will not be accessible during construction. So anything you leave in
them will have to stay until the lab reopens. We'd like to encourage
you to turn in you locker key if you don't think you will use it.

One more thing -- many thanks to everyone who cleaned up items in the
former CAD room and the cube area -- it helped enormously in staging our
moves. And your understanding and support (which we will need more of
in coming weeks!) are greatly appreciated.

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Problem p5000etch SNF 2011-11-22 17:48:22: Ch B has HT EX fault error, won't run

Problem p5000etch SNF 2011-11-22 16:50:11: HT EX fault in Chamber B

I couldn't run any wafer due to HT EX fault in chamber B.

Re: Shutdown p5000etch SNF 2011-11-21 17:50:03:

Adjusted the helium cooling bypass valve. Cycled wafers with no problems.

Re: Problem p5000etch SNF 2011-11-21 17:41:37: helium valve is not open and can not run any process.

Adjusted the helium cooling bypass valve. Cycled wafers with no problems.

attending IEDM ?

Dear Friends and Colleagues,

While attending IEDM over the years (or any big conference for that matter), selecting which papers to attend has been a drudgery. Going back and forth between the conference leaflet and the abstract booklet, and then discovering that their exists an conflict between the papers i wanted to attend and finally loosing the piece of paper with my schedule on the first day of the conference.

This motivated me to create a iPhone/iPad/iPod which will allow the participants to browse the schedule : showing them all the sessions going on at a particular time and then choose one, browse the papers by the category, find which room to go to next to attend the next paper.

The app is live on the Appstore now and you can search for it by typing "IEDM" in the Appstore. Alternatively you can get it use this link : http://itunes.apple.com/us/app/iedm-2011/id478640054?ls=1&mt=8

App Description :
This app allows you to browse through the schedule of IEDM 2011 conference, select the papers you want to attend and make your conference calendar. Browse all the papers being presented at a particular time slot or alternatively browse the papers by conference categories. You can read through the abstract of the papers and select the ones you want to attend to make your conference itinerary. This app also allows you to do a live search over the extended abstracts to quickly narrow all the papers on a particular topic (e.g. Flash Memory) or from a particular institution (e.g. Stanford University).
The App for IEDM 2011 is sponsored by Applied Materials.

Please have fun using the app and let me know of your feedback.

Best Regards,
Aneesh

Re: ion implantation question

The Innovion website, http://www.innovioncorp.com/Support/ProcessEngineering.aspx, has range statistics and other technical data.
Perhaps ask Innovion if you are not sure.  Add some test wafers( bare Si, Oxide / Si, whatever might make sense)  if you have only a few device wafers. I think the price is the same up to the load limit.

jimkruger


From: John Shott <shott@stanford.edu>
To: Stephanie Claussen <sclaussen@stanford.edu>
Cc: "labmembers@snf.stanford.edu" <labmembers@snf.stanford.edu>
Sent: Monday, November 21, 2011 6:59 PM
Subject: Re: ion implantation question

Stephanie:

What are the dose and energy of the implant that you plan to do?

To first order, the implant depth in oxide is comparable to that in silicon.  As I recall (don't take this as an accurate number) the mean implant depth of 100 keV phosphorus is about 125 nm. However, if you tried to use 125 nm of masking oxide, you'd be in serious trouble because fully half of the dopant would penetrate the oxide. Absent more accurate numbers, I'd suggest that a masking oxide thickness of 2.5 to 3.0 times the mean implant depth in silicon. For 100 keV phosphorus, I'd suggest that about 400 nm of oxide is probably safe. Note: heat treatment following implant also needs to be considered but is often a second order consideration unless post-implant heat treatment is really hot or long.

Let me know if you have other questions or are worried about trusting my now-addled memory about such matters.

John

Sent from my iPhone

On Nov 21, 2011, at 5:04 PM, Stephanie Claussen <sclaussen@stanford.edu> wrote:

> Hi all,
>
> I am planning on doing phosphorous ion implantation this week at INNOViON in San Jose. This will be on an already-fabricated vertical pin structure. I was planning to deposit LPCVD oxide over my entire structure, then pattern and etch it to open up the n regions where I want the ions implanted.
>
> Can anyone tell me how thick this oxide should be to prevent P doping in my p region? Your prompt responses are greatly appreciated, as this is a process I was planning on carrying out over the next day or two.
>
> Thanks so much,
> Stephanie


Monday, November 21, 2011

Re: ion implantation question

Stephanie:

What are the dose and energy of the implant that you plan to do?

To first order, the implant depth in oxide is comparable to that in silicon. As I recall (don't take this as an accurate number) the mean implant depth of 100 keV phosphorus is about 125 nm. However, if you tried to use 125 nm of masking oxide, you'd be in serious trouble because fully half of the dopant would penetrate the oxide. Absent more accurate numbers, I'd suggest that a masking oxide thickness of 2.5 to 3.0 times the mean implant depth in silicon. For 100 keV phosphorus, I'd suggest that about 400 nm of oxide is probably safe. Note: heat treatment following implant also needs to be considered but is often a second order consideration unless post-implant heat treatment is really hot or long.

Let me know if you have other questions or are worried about trusting my now-addled memory about such matters.

John

Sent from my iPhone

On Nov 21, 2011, at 5:04 PM, Stephanie Claussen <sclaussen@stanford.edu> wrote:

> Hi all,
>
> I am planning on doing phosphorous ion implantation this week at INNOViON in San Jose. This will be on an already-fabricated vertical pin structure. I was planning to deposit LPCVD oxide over my entire structure, then pattern and etch it to open up the n regions where I want the ions implanted.
>
> Can anyone tell me how thick this oxide should be to prevent P doping in my p region? Your prompt responses are greatly appreciated, as this is a process I was planning on carrying out over the next day or two.
>
> Thanks so much,
> Stephanie

Shutdown p5000etch SNF 2011-11-21 17:50:03:

helium valive if close and it stoped the process after 2sec.

Problem p5000etch SNF 2011-11-21 17:41:37: helium valve is not open and can not run any process.

ion implantation question

Hi all,

I am planning on doing phosphorous ion implantation this week at INNOViON in San Jose. This will be on an already-fabricated vertical pin structure. I was planning to deposit LPCVD oxide over my entire structure, then pattern and etch it to open up the n regions where I want the ions implanted.

Can anyone tell me how thick this oxide should be to prevent P doping in my p region? Your prompt responses are greatly appreciated, as this is a process I was planning on carrying out over the next day or two.

Thanks so much,
Stephanie

Found in the Gowning Room Miscellaneous Costume Earrings

With the cleanup going on in, out and around the lab, a concerned labmember has given me two mismatched non pierced earrings that have been in the gowning room for some time.  One has rhinestones and a teardrop pearl and the other is an outline of a bow with a heart on the end of one of the strings.

 

If either or both are yours, please come by my cubicle to claim.

 

Thank you,

 

Maureen

Comment p5000etch SNF 2011-11-21 12:00:30: Ch.A Argon MFC

Replaced Ch.A's 1000 sccm Argon MFC with a 100 sccm Ar MFC to enable a user to run a recipe at lower flows.

Friday, November 18, 2011

Re: Problem p5000etch SNF 2011-11-17 16:51:57: No Chlorine

Installed new cylinder. Chlorine is now available

Thursday, November 17, 2011

Problem p5000etch SNF 2011-11-17 16:51:57: No Chlorine

It looks like the chlorine regulator may have failed, so there is no chlorine to the lab. Will have more of an update tomorrow.

missing wafers

Hello all,

me again, I have a labmember totally stressed.
Will you please look around and see if you can find a small box that
contains
Two 6" boxes, one of the box contains 25 wafers and the other box is empty.
There should be a mask in the box as well.

Please if you find it, give it or leave it in front of any staff's or
Maureen's office.

Any help in this matter is much appreciated.

mahnaz

Wednesday, November 16, 2011

missing wafers

Hello all,

A labmember is missing a full box of 6" wafers that was in a cardboard
box along with an empty 6" box on her desk.

The box was sitting on the desk and I saw the box in the morning.
If you have taken the wafers by mistake, please bring it back.

mahnaz

Imina Technologies miBots Nanomanipulation Workshop

The SNF Staff in conjunction with Imina Technologies is pleased to present:

NANOMANIPULATION WORKSHOP

Monday December 5, 2011

The miBots™ are coming! Do you have a need for manipulation or sensing
small samples in a microscope? If so, we invite you to see these novel
nanopositioners for yourself at the Stanford NanoFabrication Facility in
a FREE, hands-on workshop on December 5th in the Paul Allen Building,
Auditorium Room 101X.

Designed especially for light microscopy, SEMs and FIBs, these
affordable, easy-to-use mini robots are virtually untethered and free to
move independently, opening new vistas for manipulation and testing at
the macro, micro, or nanoscale. Working individually or in groups, the
miBot™ uses a variety of tools such as grippers, probes, and optical
fibers so that, in addition to manipulating the sample, they can
illuminate a nano workspace and conduct force or electrical
measurements. Robust, mechanically and thermally stable, and
vacuum-ready, these tiny trojans are a great, customizable solution for
maneuvering and testing cells, nanostructures, semiconductor devices,
LEDs, and MEMs.

miBots will be working in the Paul Allen Building, Auditorium Room 101X
from 10 AM till Noon.

For more information, or to register for workshop, click here
http://imina.ch/events/registration-form-workshops-california-december-2011.
Imina will contact you in the week before the workshop to confirm and
provide a map and directions.

Want to learn more? Visit us at www.imina.ch or give Tom Levesque a call
at (972) 318-0196.

Regards,
SNF Staff

Tuesday, November 15, 2011

want to borrow proTEK (protective coating)

Hi,
Sorry to spam. I am doing a KOH etch from the backside of the wafer. But my front side of wafer has Al, which can't survive in a long time KOH etch. I am wondering if anyone have proTEK (http://www.brewerscience.com/products/protective-coatings) or have used the proTEK before to protect the frontside of the wafer? Any comments and suggestions are welcomed.
Best,
Helen

Qiushi(Helen) Ran
=========================================
Department of Electrical Engineering
Stanford University, Stanford, CA 94305.
Mobile: +1-650-796-1439
Email: qran@stanford.edu

want to borrow proTEK (protective coating)

Hi, 
Sorry to spam. I am doing a KOH etch from the backside of the wafer. But my front side of wafer has Al, which can't survive in a long time KOH etch. I am wondering if  anyone have proTEK (http://www.brewerscience.com/products/protective-coatings) or have used the proTEK before to protect the frontside of the wafer? Any comments and suggestions are welcomed.
Best, 
Helen

--
Qiushi(Helen) Ran
------------------------------------------------------------------------------ 
Cell: 650-796-1439
Ph.D. Candidate
Department of Electrical Engineering,
Stanford, CA, 94305


Presentation slides: Dr. Mike Stopa's "Modeling the electronic structure of semiconductor devices"

Dear All,

The powerpoint slides from Dr. Mike Stopa's presentation last week on "Modeling the electronic structure of semiconductor devices"

can be downloaded from:


Best regards,
Blanka

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Blanka Magyari-Kope
Senior Research Associate
Department of Electrical Engineering
Allen 105
Tel: 650 725 5725

Re: Shutdown p5000etch SNF 2011-11-14 18:41:25: wafer didn't come out properly

The load lock vent switch was stuck. Adjusted the vent swithc.

Monday, November 14, 2011

Has anyone seen this USB key?

Hi SNF labmembers,

Has anyone lately seen a USB key that looks like this?


It ran away from me earlier today!

Thanks,

--K

Shutdown p5000etch SNF 2011-11-14 18:41:25: wafer didn't come out properly

After Ch.A metal etch, wafer can't move out from the transfer chamber elevator. (The wafer came out from Ch.A, but didn't reture to the Cassette succesfully)

Sunday, November 13, 2011

Local Glue Challenge

Hello Labmembers,
Good Afternoon! I am working on an ambitious project to spread peace and love across our pale blue dot of a planet. The only thing stopping me from succeeding is the inability to merge two plastic sheets together locally, meaning, gluing it to within a 1mm diameter BUT still keep this spot transparent.  I believe this is a non-trivial challenge so
*if you recommend a technique or machine that can do this successfully AND easily, i will hand deliver a lunch of your choice and give you a 5 minutes back massage while you enjoy lunch since you are the super star of SNF in my eyes (see p.s. note for details of this lunch)*

details of challenge:
Take for example, two transparency sheets (mylar). i JUST need to glue them/merge them together at a specified point between them that is less than or around 1mm in diameter. It's just as simple as that. i'd also like it to be as optically transparent as possible. If you absolutely need the reason for such a strange request, just convince yourselves that i am designing posters for the Occupy Wall Street movements.

Anyhow, I have used all sorts of glue: plastic-plastic specialty glue, 'gorilla glue', 'krazy glue', 'let's get gluing,' 'glue-on it,'  etc. but it's quite difficult to get a local 1mm spot since these glues smear. pipette methods, double-sided tape have their deficiencies. I'd like to do this with higher precision and have the glued spot to stick together permanently (like a laminator machine but local!-This will win the lunch if you can give me the details!).
I checked online and the only non glue-based technique i found were Hot-gas welding, vibration welding, ultrasonic welding, induction welding and dielectric welding ( Read more: Plastic Welding Processes | eHow.com http://www.ehow.com/facts_6896075_plastic-welding-processes.html#ixzz1cIA07a9s).
I tried soldering iron which works but leaves behind a burned spot.


Thanks!

Regards,
Sonny

*( lunch has to be an on campus eatery and no more than $10); only winner will be notified*



Re: Computer terminals in SNF not working

SNF Lab Members:

While I don't yet know what caused the Sunrays to be unresponsive, I've
reset them (on the server) and they seem to be functional once again. I
apologize for the outage and will try to resolve what may have caused
this tomorrow.

John

On 11/12/2011 9:29 PM, J. Jason Lin wrote:
> Can a staff member troubleshoot the problem?

Saturday, November 12, 2011

Computer terminals in SNF not working

Can a staff member troubleshoot the problem?

Thursday, November 10, 2011

Renovation Countdown: 35 Days!!!!

Dear Labmembers --

Yes, it's only a month away... Thanks to all who have cleaned up the
151/CAD room and the shared cubicle area -- it is much appreciated by
staff.

Please remember that the lab will belong to the contractors starting
Dec. 15, so staff will need to put all the equipment into a safe
condition for long term shutdown before 7 am that day. This means that
individual tools may be shutdown several days before this date,
depending on what needs to be done. We plan to post a schedule in
coming weeks.

Please also remember to remove ALL PERSONAL BELONGINGS from your lab
bins, roll-around carts, WIP racks, and mask bins. There will be major
construction done in the lab and we will not be able to ensure that your
items will be safe. We will also take the opportunity to remove lab
bins to allow installation of new equipment -- so bins will be
reassigned to active labmembers when the lab reopens Feb. 1. (Be
assured, there will be no bin charges in Dec./Jan.)

Thanks for your attention and patience --

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

silver selenide

Does any one have or know where to purchase high purity bulk silver(I)
selenide Ag2Se ?

Thanks,
Shibing
--
Shibing Wang

Postdoctoral Scholar
Geological and Environmental Sciences
Stanford University

450 Serra Mall
Braun Hall, Building 320
Stanford University
Stanford, CA 94305-2115

shibingw@stanford.edu
650-862-3001

Reminder: EE Ph.D. Dissertation Defense: Meredith M. Lee (Friday Nov. 11, 10AM, CIS-X Auditorium)

"Come for the food, stay for the free entertainment!"

-Meredith
--------------------------------------------------
Meredith M. Lee
Stanford University
Ph.D. Candidate, Dept. of Electrical Engineering
Center for Integrated Systems
420 Via Ortega, Stanford, CA 94305-4075
Fax: (650) 723-4659
mmlee@stanford.edu

University Ph.D. Dissertation Defense

Department of Electrical Engineering

 

Tunable Photonic Crystal Biosensors for Portable Label-Free Diagnostics

Meredith M. Lee


Advisor: Professor James S. Harris

Co-Advisor: Professor Shanhui Fan

Friday, November 11, 2011

10 AM (refreshments at 9:45 AM)

Allen (Center for Integrated Systems-X) Auditorium



Although there is a pressing global need for widely-deployable disease detection and monitoring systems, today's options for biochemical analysis are often bulky, slow, and expensive.  Miniaturization and integration of devices based on micro-arrays of sources, detectors, and active or passive biosensing surfaces provides a means to achieve handheld diagnostic capabilities with a 'lab-on-a-chip'.  In particular, the development of label-free sensors offers simplified sample preparation and the opportunity for multi-modal measurements for correlated detection.

In this talk, I will describe the design, simulation, fabrication, and characterization of label-free sensors utilizing current-tuned and temperature-tuned Vertical Cavity Surface Emitting Lasers (VCSELs), integrated photodetectors, photonic crystal slab resonators, and microfluidics.   The sensors operate in the VIS-NIR (650-850 nm) wavelength range for low background absorption and are designed for compatibility with previously demonstrated monolithically integrated fluorimeters.  In addition to showing a proof-of-concept prototype for single-slab refractive index sensing with tunable GaAs-based 670 nm VCSELs, I will present the design, fabrication, and experimental measurement of tunable-gap coupled photonic crystal slabs for increased flexibility and sensitivity.   These compact, parallel sensor architectures enable multiplexed, cost-effective on-chip biosensing, with packaged devices less than one cubic centimeter.


Re: BioMEMS seminar "Emergent Functionality of Cellular Buildup Wet Robotics" tomorrow

Hi All,

I'm sorry for my fool mistake but seminar is starting at "Allen 101",
not "Allen 101X".

Ken


On Wed, 09 Nov 2011 18:57:28 -0800
Kentaro Iwami <iwami@stanford.edu> wrote:

> Hi All,
>
> Prof. Keisuke Morishima, former SNF labmember from Osaka University will visit Stanford tomorrow.
> He is an authority of BioMEMS and will be speaking "Emergent Functionality of Cellular Buildup Wet
> Robotics", including MEMS-fabricated muscle-powered bioactuator and biochemical energy source.
> I strongly recommend to join it!
>
> Title: Emergent Functionality of Cellular Buildup Wet Robotics
> Author: Keisuke Morishima, Department of Mechanical Engineering,
> Osaka University, 2-1 Yamadaoka, Suita 565-0871, JAPAN
> Place Allen 101X, 11/10/2011 (Thu), 1:30pm-2:30pm
> Abstract:
> We have demonstrated an environmentally robust hybrid (biotic?abiotic) robotic system that uses
> living components, called "Cellular Build Up Wet Nano Robotics". Our group has already presented
> a bioactuator using rat heart muscle cells, but it is difficult to keep rat heart muscle cells
> contracting spontaneously without maintaining the culture conditions carefully. By contrast, insect
> cells are much robust over a range of culture conditions (temperature, osmotic pressure and pH)
> compared to mammalian cells. Therefore, insect cells are more practical use of a hybrid wet robotic
> system, and they can be driven without precise environmental control. From this point of view, to
> utilize robust biological components as a functional systems and self assembly process and their
> emergent functionality, and to build up such a soft and wet machines will lead us an innovative
> fundamental change and produce a new principle and design to future man-made systems. We
> demonstrate the example of a micro bioactuator and mechanical systems driven by biochemical energy.
> This novel muscle-powered bioactuator successfully show autonomous beating at room temperature for
> a long time without maintenance. Experimental results suggest the possibility of constructing an
> environmentally robust hybrid wet robotic system with living components and open up a new science
> and technology, biorobotic approach, medical, environmental monitoring, agriculture and industrial
> application.
>
>
>
> -------------------------------------------------------------------------
> Kentaro IWAMI, Ph. D.
> Visiting scholar, Center for Integrated Systems, Stanford University
> Paul G. Allen Building, 420 Via Palou Mall, Room 113, Stanford, CA 94305-4070 USA
> Tel: 650-223-3817 E-mail: iwami@stanford.edu
>
> Assistant Professor, Department of Mechanical Systems Engineering,
> Tokyo University of Agriculture and Technology
> 2-24-16 Nakacho, Koganei, Tokyo 184-8588 Japan
> Tel: +81-42-388-7422 Fax: +81-42-388-7093 E-mail:k_iwami@cc.tuat.ac.jp
> -------------------------------------------------------------------------

Litho Back on at 2 pm

Hello all,

There was report of an odor in the litho area around 12:50.
After evacuating the litho area, Mary, Maurice and i realized that is
Electrical and the source seems to be coming from ASML.

We have powered down the ASML and Linda has called FSE for help.

Litho will be open at 2 pm and we will update you as what the status of
the ASML will be.


mahnaz

Wednesday, November 9, 2011

BioMEMS seminar "Emergent Functionality of Cellular Buildup Wet Robotics" tomorrow

Hi All,

Prof. Keisuke Morishima, former SNF labmember from Osaka University will visit Stanford tomorrow.
He is an authority of BioMEMS and will be speaking "Emergent Functionality of Cellular Buildup Wet
Robotics", including MEMS-fabricated muscle-powered bioactuator and biochemical energy source.
I strongly recommend to join it!

Title: Emergent Functionality of Cellular Buildup Wet Robotics
Author: Keisuke Morishima, Department of Mechanical Engineering,
Osaka University, 2-1 Yamadaoka, Suita 565-0871, JAPAN
Place Allen 101X, 11/10/2011 (Thu), 1:30pm-2:30pm
Abstract:
We have demonstrated an environmentally robust hybrid (biotic?abiotic) robotic system that uses
living components, called "Cellular Build Up Wet Nano Robotics". Our group has already presented
a bioactuator using rat heart muscle cells, but it is difficult to keep rat heart muscle cells
contracting spontaneously without maintaining the culture conditions carefully. By contrast, insect
cells are much robust over a range of culture conditions (temperature, osmotic pressure and pH)
compared to mammalian cells. Therefore, insect cells are more practical use of a hybrid wet robotic
system, and they can be driven without precise environmental control. From this point of view, to
utilize robust biological components as a functional systems and self assembly process and their
emergent functionality, and to build up such a soft and wet machines will lead us an innovative
fundamental change and produce a new principle and design to future man-made systems. We
demonstrate the example of a micro bioactuator and mechanical systems driven by biochemical energy.
This novel muscle-powered bioactuator successfully show autonomous beating at room temperature for
a long time without maintenance. Experimental results suggest the possibility of constructing an
environmentally robust hybrid wet robotic system with living components and open up a new science
and technology, biorobotic approach, medical, environmental monitoring, agriculture and industrial
application.

-------------------------------------------------------------------------
Kentaro IWAMI, Ph. D.
Visiting scholar, Center for Integrated Systems, Stanford University
Paul G. Allen Building, 420 Via Palou Mall, Room 113, Stanford, CA 94305-4070 USA
Tel: 650-223-3817 E-mail: iwami@stanford.edu

Assistant Professor, Department of Mechanical Systems Engineering,
Tokyo University of Agriculture and Technology
2-24-16 Nakacho, Koganei, Tokyo 184-8588 Japan
Tel: +81-42-388-7422 Fax: +81-42-388-7093 E-mail:k_iwami@cc.tuat.ac.jp
-------------------------------------------------------------------------

Tuesday, November 8, 2011

Re: Shutdown p5000etch SNF 2011-11-07 19:22:37: could not remove wafer.

Somebody recovered the user's quartz wafer. Cycled 4 Si wafers with no problems.
The P5000 cannot process quartz wafers in Auto mode. If you need to process quartz wafers, please contact the etch staff for assistance.

Monday, November 7, 2011

Shutdown p5000etch SNF 2011-11-07 19:22:37: could not remove wafer.

system froze with wafer on blade. recovery procedures did not work.

Computational Seminar on Semiconductor Device Modeling

Modeling the electronic structure of semiconductor devices

Dr. Mike Stopa 

Director of National Nanotechnology Infrastructure Network Computation Project 

Center for Nanoscale Systems 

Harvard University


Time: 10 am, Thursday November 10, 2011

Place: Allen 101 


Modeling of the electronic structure of nano-scale semiconductor devices is a both conceptually and practically difficult task that is invaluable for experimentalists and device engineers. The complexity and variety of semiconductor devices, in their morphology or material composition or in the specific features that are under investigation, generally inhibit the development of any "all purpose code" that simulates all properties of all devices. The SETE code, which I will discuss in this talk, was initially developed to model GaAs-AlGaAs heterostructure-based two dimensional electron gas (2DEG) devices, but has since been applied to other systems. Modification to other systems typically means that only the most fundamental features of the SETE code are transferable. A brief list of some of the systems, materials and properties that have been modeled by SETE and its variants is:

·       Semiconductor nanowires;

·       Configuration interaction calculation in quantum dots;

·       Magnetic terraces (compressible and incompressible regions) in the 2DEG in the quantum Hall regime;

·       Complicated band structure using k dot p (Luttinger Hamiltonian) formalism;

·       Förster transfer process between semiconductor nanoparticles;

·       Strain effect on electronic structure;

·       Molecular systems adjacent to (adsorbed on) metal surfaces.

I will, in this talk, give a general overview of density functional calculations for semiconductor devices, emphasizing the core elements – mainly the Poisson solver – and the simplest implementation (using the Thomas-Fermi approximation in a 2DEG). I will discuss further the kinds of modifications that are necessary to implement some of the above features. Some of the talk will relate to work that is currently in progress and for which feedback will be greatly appreciated.


~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Blanka Magyari-Kope
Senior Research Associate
Department of Electrical Engineering
Allen 105
Tel: 650 725 5725

Reminder: MSE Ph.D. Dissertation Defense: Angie C. Lin (Tues Nov 8, 10am, CISX Auditorium)

University Ph.D. Dissertation Defense

Department of Materials Science and Engineering

 

All-epitaxial orientation-patterned III-V semiconductors for nonlinear optics

Angie C. Lin


Advisor: Professor James S. Harris

Tuesday, November 8, 2011

10 am (refreshments at 9:45 am)

CIS-X Auditorium, Paul G. Allen building

Applications such as airborne countermeasures, chemical spectroscopy, and imaging require high-power, compact, and tunable light sources in the infrared (IR) and Terahertz (THz) spectral ranges.  While laser sources exist at certain frequencies in this range, they are bulky and require low temperature operation.  Another solution is to generate the desired IR and THz frequencies through nonlinear optical frequency conversion in orientation-patterned III-V semiconductors, from readily available high-power lasers in the near-IR.  Achieving high conversion efficiencies requires the optical signals to be quasi-phase-matched (QPM) inside the semiconductor.

Orientation-patterning is an all-epitaxial technique in which we fabricate QPM semiconductor structures by the following steps: growth by molecular beam epitaxy (MBE), lithography, etching, and regrowth by MBE.  Previous work on orientation-patterned GaAs has led to demonstration of a variety of nonlinear optical devices; however, there is a push to develop orientation-patterned GaP (OP-GaP) to overcome inherent material limitations in GaAs.  This thesis work has been focused on the development of OP-GaP, including MBE growth and characterization of GaP films on Si and processing of OP-GaP structures.  Improvements in material quality have been made through the course of studying the nucleation and growth conditions of GaP on Si to control the formation and annihilation of antiphase domain defects.  Understanding the growth of GaP on Si has not only enabled the development of OP-GaP as a platform for nonlinear optical devices, but also for III-V epitaxial mirrors on Si substrates for optical coatings.

 

Process Clinic 11/7/11

All,

The SNF staff wants to remind you we will be holding the Process Clinic
weekly until the shutdown. The Process Clinic is held between 2pm-3pm,
so please bring your process, equipment or miscellaneous questions.

Due to lack of conference rooms, today's Process Clinic will be held in
the cubicles outside of the staff offices.

Regards,
SNF Staff

Re: Problem p5000etch SNF 2011-11-05 20:24:41: wafer not recognized after clamping the cassette A

Elmer soldered broken wire

reminder: seminar 4-5 in Allen 101X TODAY: Prof. Sindy Tang, ME Dept.

Hope to see you there -- Roger

Reconfigurable Optics Based on Liquid-Liquid Interfaces
Prof. Sindy K. Y. Tang
Dept. of Mechanical Engineering, Stanford University

 

Abstract:

Optofluidics, a new class of optical devices with optical interfaces formed between two liquids, possess unique characteristics that are not achievable in conventional solid-state optical systems. In optofluidic systems, it is possible to reconfigure and fine-tune the optical output in real time by manipulating liquid composition or the shape of the liquid-liquid interface dynamically. In addition, liquid-liquid interfaces are intrinsically smooth as a result of minimization of interfacial energy. Polishing is thus unnecessary. Furthermore, it is straightforward to obtain a graded profile of refractive index by taking advantage of diffusion between miscible liquids possessing different refractive indices to create devices such as GRIN lenses. This talk focuses on the design and development of optical components based on dynamic liquid-liquid interfaces in microfluidic systems: liquid waveguides, lenses, and multi-color droplet dye lasers.

 

Short Bio:
Sindy K.Y. Tang joined the faculty of Stanford University in September 2011 as an assistant professor in the Department of Mechanical Engineering. She received her B.S. degree in Electrical Engineering from California Institute of Technology in 2003, M.S. from Stanford University in 2004, and Ph.D. from Harvard University in Engineering Sciences in 2010. Dr. Tang’s research interests include optofluidics, microfluidics and nanophotonics for the development of tools for biology and smart materials. 


Sunday, November 6, 2011

Dummy HSQ-patterned samples

Hi SNF users,

I'm wondering if anyone has any samples patterned with ebeam using negative-resist HSQ. I'm not sure what thicknesses are common, but greater than 300nm is desired. Samples will be etched.

Thanks,

Robert Chen
Electrical Engineering Ph.D. Candidate
Harris MBE Group, Stanford University
http://robochen.web.stanford.edu

Saturday, November 5, 2011

Problem p5000etch SNF 2011-11-05 20:24:41: wafer not recognized after clamping the cassette A

I clamped the cassette A after loading wafers, but in 'Monitor Wafers' screen, the wafers were not recognized. I could not proceed further.
It seems something wrong with clamping sensing.

Friday, November 4, 2011

misplaced mask. nanopore2.0

Dear Labmembers

It looks like I've misplaced my mask. the label on it should read "nanopore2.0".

If you've seen this mask in the fab could you drop me a note by email
or call me at 408 504 3402?

thanks

-Kee

EE Ph.D. Dissertation Defense: Meredith M. Lee (Friday Nov. 11, 10AM, CIS-X Auditorium)


University Ph.D. Dissertation Defense

Department of Electrical Engineering

 

Tunable Photonic Crystal Biosensors for Portable Label-Free Diagnostics

Meredith M. Lee


Advisor: Professor James S. Harris

Co-Advisor: Professor Shanhui Fan

Friday, November 11, 2011

10 AM (refreshments at 9:45 AM)

Allen (Center for Integrated Systems-X) Auditorium



Although there is a pressing global need for widely-deployable disease detection and monitoring systems, today's options for biochemical analysis are often bulky, slow, and expensive.  Miniaturization and integration of devices based on micro-arrays of sources, detectors, and active or passive biosensing surfaces provides a means to achieve handheld diagnostic capabilities with a 'lab-on-a-chip'.  In particular, the development of label-free sensors offers simplified sample preparation and the opportunity for multi-modal measurements for correlated detection.

In this talk, I will describe the design, simulation, fabrication, and characterization of label-free sensors utilizing current-tuned and temperature-tuned Vertical Cavity Surface Emitting Lasers (VCSELs), integrated photodetectors, photonic crystal slab resonators, and microfluidics.   The sensors operate in the VIS-NIR (650-850 nm) wavelength range for low background absorption and are designed for compatibility with previously demonstrated monolithically integrated fluorimeters.  In addition to showing a proof-of-concept prototype for single-slab refractive index sensing with tunable GaAs-based 670 nm VCSELs, I will present the design, fabrication, and experimental measurement of tunable-gap coupled photonic crystal slabs for increased flexibility and sensitivity.   These compact, parallel sensor architectures enable multiplexed, cost-effective on-chip biosensing, with packaged devices less than one cubic centimeter.

Thursday, November 3, 2011

Dry film resist laminator

Dear Lab Members,

I am looking for a dry film resist laminator that I can test out. If you know any lab has such a equipment, please let me know.
Thank you much.

- Hyeun-Su

Wednesday, November 2, 2011

Open positions at Synaptics

Dear fellow students, graduates, and postdocs,

Synaptics is hiring and they have a lot of open positions in the US (Santa Clara, New York, Austin), China, Taiwan, Japan and Korea (see below). If you are interested in any of the positions below, just send me your resume/CV and I will make sure that it gets to the right person (it is always better if the resume is handed internally). And if you have friends that are also looking for a job, I can forward their resume too. Please do not hesitate to write to me if you have any questions: elkallas@stanford.edu or pascale.kallassi@synaptics.com.


Best regards,


Pascale El Kallassi

-------------------------------------------------------------------------------------------------------------
Synaptics was recently named one of Forbes' Top 20 Small Public Companies! With leading-edge features, design, and systems engineering, Synaptics continues to pioneer into the next generation of interface design. The PC, slate, and mobile industries challenge us to differentiate in the expanding world of touch.

Our vision, enriching the interaction between humans and intelligent devices, has enabled some of the world's most innovative concepts and devices. We are excited to work on gadgets that we see every day and we look forward to making them fun and easier to use.



Open positions:

CHINA – Shenzhen

IRC27900 - Sr. Manufacturing Engineer - Lemke, David

IRC28564 - System Engineer - Rehn, Chris

IRC25918 - System Design Engineer - Yim, Simon

JAPAN

IRC29940 - System Engineer - Mera, Yuhka

KOREA

IRC27340 - Field Applications Engineer - Cho, Donald

IRC25920 – System Engineer – Kim, Ilsun

TAIWAN

IRC29600 - System Engineer - Yau, David

IRC25910 - Senior SW Engineer - Srinivasan, Mahesh

US – Austin

IRC25932 - Sr. Mixed Signal IC Design Engineer - Kozak, Mujo

US – New York

IRC28200 - Analog/MXS Design Engineer - Knausz, Imre

US – Santa Clara

IRC21410 - Senior Analog Mixed-Signal Design Engineer - Lo, Steve

IRC24060 - Sr. Product Marketing Manager - Brady, John

IRC24080 - Applications Engineer - Constable, Dave

IRC24420 - Sr. System Architect - Schwartz, Adam

IRC24509 - Sr. Firmware Engineer - Eryilmaz, Erol

IRC25861 - Sr. Digital Design Engineer - Pearce, Mark

IRC25905 - Director, WW Field Applications Engineering - Long, Dave

IRC25908 - Platform Embedded Firmware Manager - Hodgson, Robin

IRC25914 - Applications Engineer - Lim, Chin

IRC26199 - Test Methodology Engineer - McCoy, Tom

IRC26700 - System Architect - Kumar, Shwetank

IRC27080 - Sr. Digital Design Engineer - Pearce, Mark

IRC27120 - Sr. Windows Software Engineer - Jones, Russ

IRC28320 - Systems Design Engineer - Spray, Andrew

IRC28340 - Sr. Firmware Engineer - Peng, Earl

IRC28720 - Sr. Windows Software Engineer - Jones, Russ

IRC30480 - Sr. Firmware Engineer - Satriya, Hari

IRC30500 - Firmware Manager - Eryilmaz, Erol

IRC30820 - Sr. QA Automation Engineer - Gregoire, Donald

IRC30900 - Sr. Software Engineer - Chilamakuri, Chenchu

IRC31421 - Sr. CAD Engineer - Musunuri, Rao

Re: Comment p5000etch SNF 2011-11-01 15:33:51: Update Ch.A

ready for use

Re: Problem p5000etch SNF 2011-11-01 09:08:00: Ch.A is down for a BCl3 cylinder change

qual on Chamber looks good; nice and clean surface, cleared via end point at 110 secs

MSE Ph.D. Dissertation Defense: Angie C. Lin (Tues Nov 8, 10am, CISX Auditorium)

University Ph.D. Dissertation Defense

Department of Materials Science and Engineering

 

All-epitaxial orientation-patterned III-V semiconductors for nonlinear optics

Angie C. Lin


Advisor: Professor James S. Harris

Tuesday, November 8, 2011

10 am (refreshments at 9:45 am)

CIS-X Auditorium, Paul G. Allen building

Applications such as airborne countermeasures, chemical spectroscopy, and imaging require high-power, compact, and tunable light sources in the infrared (IR) and Terahertz (THz) spectral ranges.  While laser sources exist at certain frequencies in this range, they are bulky and require low temperature operation.  Another solution is to generate the desired IR and THz frequencies through nonlinear optical frequency conversion in orientation-patterned III-V semiconductors, from readily available high-power lasers in the near-IR.  Achieving high conversion efficiencies requires the optical signals to be quasi-phase-matched (QPM) inside the semiconductor.

Orientation-patterning is an all-epitaxial technique in which we fabricate QPM semiconductor structures by the following steps: growth by molecular beam epitaxy (MBE), lithography, etching, and regrowth by MBE.  Previous work on orientation-patterned GaAs has led to demonstration of a variety of nonlinear optical devices; however, there is a push to develop orientation-patterned GaP (OP-GaP) to overcome inherent material limitations in GaAs.  This thesis work has been focused on the development of OP-GaP, including MBE growth and characterization of GaP films on Si and processing of OP-GaP structures.  Improvements in material quality have been made through the course of studying the nucleation and growth conditions of GaP on Si to control the formation and annihilation of antiphase domain defects.  Understanding the growth of GaP on Si has not only enabled the development of OP-GaP as a platform for nonlinear optical devices, but also for III-V epitaxial mirrors on Si substrates for optical coatings.

 

New Tycom terminal

Hello All,
The new TYCOM Monitor has been installed.

Tuesday, November 1, 2011

ME395 Seminar 11/3; Evelyn Wang from MIT

Autumn 2011-2012
 
Nanoengineered Surfaces: Transport Phenomena and Energy Applications
 
Presented by
 
 
Evelyn N. Wang
Associate Professor of Mechanical Engineering
Massachusetts Institute of Technology
Thursday, November 3, 2011
4:15 PM in Bldg. 380 room 380Y
 
Nanoengineered surfaces offer new possibilities to manipulate fluidic and thermal transport processes for a variety of applications including lab-on-a-chip, thermal management, and energy conversion systems. In particular, nanostructures on these surfaces can be harnessed to achieve superhydrophilicity and superhydrophobicity, as well as to control liquid spreading, droplet wetting, and bubble dynamics. In this talk, I will discuss fundamental studies of droplet and bubble behavior on nanoengineered surfaces, and the effect of such fluid-structure interactions on boiling and condensation heat transfer. Three-dimensional micro, nano, and hierarchical structured arrays were fabricated to create superhydrophilic and superhydrophobic surfaces with unique properties. For example, with asymmetric superhydrophilic nanopillars, uni-directional spreading of water droplets was achieved where the liquid spreads only in the direction of the pillar deflection. With hierarchical superhydrophobic surfaces that mimic the superior non-wettability of a lotus leaf, water droplets rebound at velocities greater than 4 m/s.  Energy-based models were developed to explain and predict such behavior as functions of pertinent parameters.  Furthermore, we investigated the effect of nanostructure design to enhance heat transfer during pool boiling and dropwise condensation. A critical heat flux of 196 W/cm2 with a heat transfer coefficient greater than 80 kW/m2K was achieved during pool boiling.  In addition, with stable dropwise condensation surfaces, heat transfer enhancements of 4-6x were demonstrated with partially suspended droplet morphologies. These studies provide insights into the complex physical processes underlying fluid-nanostructure interactions.  Furthermore, this work shows significant potential for the development and integration of nanoengineered surfaces to advance next generation energy systems.
 

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Comment p5000etch SNF 2011-11-01 15:33:51: Update Ch.A

BCl3 cylinder is under a 24 hour leak check. It should be ready by tomorrow afternoon.

Re: Comment p5000etch SNF 2011-10-14 13:40:53: BCl3 back- check etch rates

bottle switched out- new qual to be run

Problem p5000etch SNF 2011-11-01 09:08:00: Ch.A is down for a BCl3 cylinder change