Winter Course Announcement: EE412, Adv. Nanofab. Lab

Dear Labmembers --

Due to popular demand, EE412: Advanced Nanofabrication Laboratory, is back for Winter term.
This is a team-project-based course with the aim to develop, characterize and document
processes that will be of value to the SNF labmember community. The instructor this term is Prof. Beth Pruitt.
Students receive not only course credit, but lab time and supplies in support of their projects
-- and of course the satisfaction of contributing to the lab community knowledge base.

For more information, check out the course description and reports from the Fall session on the wiki
(https://snf.stanford.edu/SNF/processes/ee412).

The first class will be Wednesday, Jan. 5, 3:15-5 pm in Allen 101 and will meet weekly at this time.

Projects (and mentors, by Coral ID) collected thus far are listed below.

ALD (jprovine): These projects will be carried out on the smaller Savannah.  The more capable Fiji will be operational as
soon as permitting allows, so there is some possibility one or more of these projects may transfer over.
 
-       Yt2O3/Yt-Zr-Oxide nanolaminates as thermal isolation and dielectric in battery stacks.
-       Al2O3 as a highly conformal etch mask for STSetch and XeF2 (for achieving extremely high aspect ratio structures).
-       Extreme aspect ratio coverage (perhaps in combination with Al2O3 etch masking.)
-       Nitride films (TiN, WN, HfN, AlN)
 
Poly/low temperature SiGe (maurice):  For use as mechanical isolation layer between CMOS and MEMS structures.  Characterization in tylansige and/or thermcopoly2.
 
STSetch2 (mcvittie):  Possible projects are -
-       Characterization/development of standard etch recipes.
-       Characterization/development of through-wafer etching methods.
 
AW610 RTA characterization (emyers):  The new RTA’s offer flexibility with respect to temperature range, materials, and substrates.  But the actual temperatures the devices are subjected to are uncertain.  This project would focus on characterizing the thermal offsets in the RTA's using carrier wafers or susceptor.
 
EVSprayCoater (mahnaz & jparker):  This tool is designed for creating resist coatings over structures with high aspect ratios that can range from conformal to planarizing.  Two possible projects:
-       Characterization/development of ASML exposure in deep trenches (continuation from EE412 Fall.)
-       Characterization/development of other resist recipes.

Front-to-back alignment metrology for the ASML (vinnypici).  Mentoring by ASML engineers.  ASML is extremely interested in precision metrology for 3D align and are hoping that an enterprising student might be interested in patterning optical structures on the front and back sides of quartz wafers as a means of quantifying alignment.
 
Negative lift-off/image reversal resist (mahnaz):  The newer negative resists can be tuned to provide a negative/retrograde profile, serving as a reverse image, lift-off alternative to the conventional LOL 2000 bilayer resist process.
 
Silicon-silicon wafer bonding (mtang)

If you would like to enroll, serve as a mentor, or propose a project please get in touch with one of us. And please spread the word.


Thanks for your attention --


The EE412 Project Mentors