The purpose of this talk is to give an overview of MEMS packaging
technologies developed at the Wireless Integrated Microsystems (WIMS)
center at the University of Michigan. ePack, Inc. is a spin out of the
University of Michigan—a short description of this company will be given
at the end of the talk. ePack helps companies and researchers implement
packaging technologies in order to encourage the commercialization of
their MEMS devices.
Two sets of packaging technologies will be discussed. I) Low temperature
wafer-level packaging processes for vacuum/hermeticity will be presented
including various solder bonding and localized heating technologies.
Vacuum pressures lower than 10 mTorr were achieved with yields as high
as high as 90% and 3 years of package reliability data. II) A harsh
environment robust micromechanical technology (HERMIT) for vibration,
shock and thermal isolation as well as vacuum packaging. This technology
involves flip chipping MEMS devices onto another wafer which has
specially designed vibration/shock/thermal isolation structures where
another substrate is then used for batch encapsulation of the devices.
This technology was a DARPA funded project was specially developed for
high performance gyroscopes, but can be applied to any type of MEMS device.
These technologies are a culmination of several bonding processes,
feed-through technologies and various special materials.
*Jay Mitchell* is president and co-founder of ePack Corp., a company
providing packaging services and expertise to companies and researchers
in order to bring MEMS devices to market. He finished his doctorate in
January of 2008. In the fall of 2002, he began the Ph.D. program at the
University of Michigan in mechanical engineering. In his research he
developed a Au-Si eutectic wafer-level packaging process and a low
temperature localized heating technique for the hermetic/vacuum
packaging of MEMS and microsystems. In 2000 and 2001, he worked for
Movaz Networks in the testing and design of micromirrors for
telecommunications applications. He received his B.S. and M.S. from Case
Western Reserve University in 1999 and 2000, respectively. His research
interests include: MEMS, micromachining technologies, micromachined
sensors, actuators, and micropackaging.
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