I'm looking for someone (institution or company) that has SAM (Scanning Acoustic Microscope), in order to image voids and defects in bonded wafer pairs. Please let me know if you have experience, or contacts relating to SAMs.
Ironically, the technique was developed at Stanford, yet there are none on campus (as far as I know).
Cheers,
Filip
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Ph.D. Candidate, Stanford University
Department of Electrical Engineering
Center for Integrated Systems
B-103, 420 Via Palou
Stanford, CA 94305
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