Sunday, October 31, 2010

copper plating

Hello Labmembers,

Have any of you had experience with plating ~30 microns of Cu  (or Au or Cr or Al) on a substrate?

I am looking for flexible sheets of about 30 microns cu on both sides.

1.       I have a flexible plastic sheet (can sustain ~130C), can I send it somewhere for electroplating

2.      Can I try electroless plating myself in lab or send it out somewhere? Electroless plating  of cu would use palladium (Pd) or tin (Sn) are common seed layer materials (which I can deposit in innotec).  Pd and Sn alloys are created by dipping in SnCl2 or PdCl2 solutions => autocatalytic reaction of metal ions from the solutions occurs. initial copper nucleation on Pd is believed to occur because of the catalysis of the dissociation of formaldehyde

 

thank you

 

Regards,

Sonny

---------------

"What makes the desert beautiful," said the Little Prince ,"is that somewhere it hides a well ."

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     `--'         rock on    

Sonny Vo

Ph.d candidate

Department of Applied Physics, Stanford University

(626) 216-4597

Harris Research Group: http://snow.stanford.edu/index.html

 

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