typical etch rate for LTO400PC, densified ox in Ch B running Jim-ox is
350-400 nm/min
batch 1: jimox, 30sec
wafer1: 309 nm/min
wafer2: 280 nm/min
wafer3: 120 nm/min !!!
batch2: jimox, 30sec
wafer1: 289
wafer2: 292
wafer3: 110 !!!
batch3: jimox, 140sec
wafer1: 278
wafer2: ~154
wafer3: ~210
wafer4: ~160
wafer5: ~101
wafer6: ?
wafer7: >231
wafer8: 300
Observations during run:
RF power and all gases were very close to setpoint. He leak was <2sccm, looked at for every wafer. No rotation of any wafer after run.
Gas flow values did not fluctuate at all during run. Each were at +2sccm from setpoint, and stayed at this value exactly for the whole run. Typically they fluctuate, which might mean they are not being read properly.
EPD also showed very strange drops and rises at random times. This might be due to gasses turning on and off intermitently.
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