A wafer broke during oxide etching in chamber B. Half of the wafer came out, I believe the other half is still in chamber B. However, I can't exclude that wafer pieces may have fallen elsewhere in the system (e.g. somewhere in the elevator), so I am shutting it down as a precaution.
The wafer included a bonded interface and the breakage may have occured because the bond quality was poor. On the other hand, I have never had problems with similar bonded wafers in the past.
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